专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2007184691A Composite rf component 审中-公开
标题翻译：复合RF组件
公开(公告)号：JP2007184691A
公开(公告)日：2007-07-19
申请号：JP2006000347
申请日：2006-01-05
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： TAKANO ATSUSHI , FUJII KUNIHIRO , NISHIDA KAZUFUMI
IPC分类号： H03H9/72 , H03H9/25
摘要： PROBLEM TO BE SOLVED: To provide a composite RF component with an antenna duplexer, which is excellent in long term reliability.
SOLUTION: The composite RF component is provided with: a mount board 11 including a ground electrode; a power amplifier 12 arranged on the mount board 11; the antenna duplexer 15 arranged on the mount board 11 apart from the power amplifier 12 at a prescribed interval and including a surface acoustic wave element 14 with interdigital electrodes 13 at its lower side; and a mold resin 16 for covering the power amplifier 12 and the antenna duplexer 15 on the mount board 11, wherein a low heat conduction layer 25 whose heat conductivity is smaller than that of the mold resin 16 is formed between the antenna duplexer 15 and the mold resin 16.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供具有优异长期可靠性的天线双工器的复合RF部件。复合RF部件设置有：包括接地电极的安装板11; 布置在安装板11上的功率放大器12; 布置在安装板11上的天线双工器15以规定的间隔与功率放大器12分开，并且包括在其下侧具有叉指电极13的表面声波元件14; 以及用于覆盖安装板11上的功率放大器12和天线双工器15的模制树脂16，其中在天线双工器15和导线层15之间形成导热率小于模制树脂16的导热率的低导热层25 模塑树脂16.版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2005184309A Surface acoustic wave device and manufacturing method therefor 审中-公开
标题翻译：表面声波设备及其制造方法
公开(公告)号：JP2005184309A
公开(公告)日：2005-07-07
申请号：JP2003420656
申请日：2003-12-18
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： FUJII KUNIHIRO , TAKANO ATSUSHI
IPC分类号： H03H9/25 , H03H3/08
摘要： PROBLEM TO BE SOLVED: To provide a small-sized surface acoustic wave device with high reliability.
SOLUTION: A surface acoustic wave element 13 face-down mounted on a mount board 11 by metallic bumps 12 is covered by a resin film 14 and the mount face of the mount board 11 and the resin film 14 are closely adhered, and the thickness of the resin film 14 in contact with side faces of the surface acoustic wave element 13 is formed thinner than the thickness of the resin film 14 in contact with the rear side of the surface acoustic wave element 13 to thereby improve the reliability.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供具有高可靠性的小型表面声波装置。解决方案：通过金属凸块12面向下安装在安装板11上的表面声波元件13被树脂膜14覆盖，并且安装板11和树脂膜14的安装面紧密粘合，并且与表面声波元件13的侧面接触的树脂膜14的厚度形成为比与表面声波元件13的后侧接触的树脂膜14的厚度薄，从而提高可靠性。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2003338729A Electronic part and manufacturing method 审中-公开
标题翻译：电子零件和制造方法
公开(公告)号：JP2003338729A
公开(公告)日：2003-11-28
申请号：JP2002144235
申请日：2002-05-20
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： FUJII KUNIHIRO , TANABE TAKASHI
IPC分类号： H01L41/09 , H01L41/18 , H01L41/22 , H01L41/23 , H01L41/313 , H03H3/08 , H03H9/25
摘要： PROBLEM TO BE SOLVED: To provide an electronic part having superior characteristics with no risk of damage of the elemental characteristics, by ensuring package sealing. SOLUTION: The electronic part includes; a package 14 having an external electrode 15 extended from an inner bottom face to an outer surface and an opening; an SAW element 10 having an IDT 12 and a connecting electrode 13; a bump 17 for mounting the SAW element on the package 14, and connecting an external electrode 15a and the connecting electrode 13 of the SAW element 10; and a resin 18 for covering the backside of the SAW element and the opened part of the package 14. A length from the resin 18 to the inner bottom face of the package 14 is longer than that from the SAW element 10 to the inner bottom face of the package 14 and smaller than that from the inner bottom face of the package 14 to the upper edge thereof. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：通过确保包装密封，提供具有优异特性的电子部件，没有损坏元件特性的风险。
解决方案：电子部件包括; 具有从内底面延伸到外表面的外部电极15和开口的包装14; 具有IDT 12和连接电极13的SAW元件10; 用于将SAW元件安装在封装14上并连接外部电极15a和SAW元件10的连接电极13的突起17; 以及用于覆盖SAW元件的背面和封装14的开口部分的树脂18.从树脂18到封装14的内底面的长度比从SAW元件10到内底面的长度长并且小于从包装14的内底面到其上边缘的内径。版权所有（C）2004，JPO

4. 发明专利

JP2007184690A Antenna duplexer 审中-公开
标题翻译：天线双机
公开(公告)号：JP2007184690A
公开(公告)日：2007-07-19
申请号：JP2006000346
申请日：2006-01-05
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： TAKANO ATSUSHI , FUJII KUNIHIRO , NISHIDA KAZUFUMI
IPC分类号： H03H9/72 , H03H9/25
摘要： PROBLEM TO BE SOLVED: To provide an antenna duplexer the reliability of which is improved for a long time by escaping heat generated in interdigital electrodes to a ceramic board or a ceramic package via bumps and dummy bumps with a high heat conductivity.
SOLUTION: The antenna duplexer is provided with: the ceramic package or ceramic board; the bumps 12 provided on an upper side of the ceramic package or ceramic board; and a surface acoustic wave element 14 positioned on an upper side of the bumps 12 and including the interdigital electrodes at its lower side connected electrically to the bumps 12. The interdigital electrodes comprise first interdigital electrodes 13a connected to a radio wave transmission side via the bumps 12, and second interdigital electrodes 13b connected to a radio wave reception side via the bumps 12, and the dummy bumps 18 not electrically connected to the interdigital electrodes are formed between the ceramic package or ceramic board and the surface acoustic wave element 14.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种天线双工器，其可靠性通过将具有高导热性的凸点和虚拟凸起通过将交叉指状电极中产生的热量逸出到陶瓷板或陶瓷封装而长时间地改善。
解决方案：天线双工器配有：陶瓷封装或陶瓷板; 所述凸块12设置在所述陶瓷封装或陶瓷板的上侧; 以及位于凸块12的上侧的表面声波元件14，并且在其下侧包括与凸块12电连接的叉指电极。叉指电极包括经由凸块连接到无线电波发送侧的第一叉指电极13a 12和通过凸块12连接到无线电波接收侧的第二叉指电极13b，并且在陶瓷封装或陶瓷板与表面声波元件14之间形成未电连接到叉指电极的虚拟凸块18。 >版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2003115734A SURFACE ACOUSTIC WAVE DEVICE AND MANUFACTURING METHOD THEREOF 审中-公开
公开(公告)号：JP2003115734A
公开(公告)日：2003-04-18
申请号：JP2001310913
申请日：2001-10-09
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NANBA AKIHIKO , ONISHI KEIJI , MORITOKI KATSUNORI , FUJII KUNIHIRO
IPC分类号： H03H3/08 , H03H9/145 , H03H9/25
摘要： PROBLEM TO BE SOLVED: To solve the problem that a piezoelectric single crystal material such as tantalic acid lithium or niobic acid lithium is difficult to make thin because it is easily broken and this prevents a device from being reduced in height. SOLUTION: On a principal plane of a piezoelectric substrate finished into a mirror face, comb-shaped electrodes and pad electrodes are provided, a space forming portion is provided so as to cover the comb-shaped electrodes, and protruding electrodes are provided on the pad electrodes. An insulating material is provided so as to cover the protruding electrodes and the space forming portion, the protruding electrodes are exposed from the material by grinding the material, and terminal electrodes are provided so as to cross the protruding electrodes. The other principal plane of the substrate is ground or polished to thin the substrate.

6. 发明专利

JP2001185573A METHOD FOR MANUFACTURING ELECTRONIC COMPONENT 失效
公开(公告)号：JP2001185573A
公开(公告)日：2001-07-06
申请号：JP2000397702
申请日：2000-12-27
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： MURAKAMI KOZO , FUJII KUNIHIRO , MATSUO SATOSHI
IPC分类号： H01L21/60 , H03H3/08 , H03H9/25
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing electronic components which can alternately decide the position of connection between the internally connected electrode of a package and a wire. SOLUTION: A plurality of internally connected electrodes 14 are made, such that they lead to the end of inside periphery on the top end face of the step 22, at the inwall face of a package, and a shield electrode 15 is made at the inside bottom face, and a plurality of shield electrode nonformation parts 18a and 18b are provided such that they lead to the end of the inside periphery of the package 13, and the angle between one side each of the shield electrode nonforming parts 18a and 18b and one side of the internally connected electrode 14 is arranged to be right-angled, and the intersecting points between one side each of contacting with the side end of the internally connected electrode 14 of the shield electrode nonforming parts 18a and 18b and one side of contacting with the end on inside periphery side of the package 13 of the internally connected electrode 14 are detected severally, whereby the boundary between the inside periphery end and the inside bottom face of the package 13 in the plan view is recognized, and the mounting position into the package 13 of a SAW element 17 is determined.

7. 发明专利

JP2001168676A SURFACE ACOUSTIC WAVE DEVICE AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JP2001168676A
公开(公告)日：2001-06-22
申请号：JP2000293734
申请日：2000-09-27
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： TAKASE MICHIHIKO , OKAJIMA MICHIO , YOSHIDA TETSUHISA , SETSUNE KENTARO , MURAKAMI KOZO , FUJII KUNIHIRO
IPC分类号： H01L41/09 , H01L41/18 , H01L41/22 , H01L41/23 , H01L41/29 , H03H3/08 , H03H9/145 , H03H9/25
摘要： PROBLEM TO BE SOLVED: To provide a surface acoustic wave device and its manufacturing method where the propagating characteristic of a surface acoustic wave is excellent since discharging is not generated easily between IDT electrodes. SOLUTION: This device is provided with a piezoelectric substrate 11, a first interdigital electrode 12a and a second interdigital electrode 12b, both of which are formed to face each other on the substrate 11. The substrate 11 is provided with a doping area 11a doped with a material of at least one form selected from an atom, a molecule and a cluster on a surface 11s between the electrode 12a and the electrode 12b.

8. 发明专利

JP2002261582A SURFACE ACOUSTIC WAVE DEVICE, ITS MANUFACTURING METHOD, AND CIRCUIT MODULE USING THE SAME 审中-公开
公开(公告)号：JP2002261582A
公开(公告)日：2002-09-13
申请号：JP2001307560
申请日：2001-10-03
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： ONISHI KEIJI , NANBA AKIHIKO , SATOU HIROTERU , MORITOKI KATSUNORI , BESSHO YOSHIHIRO , FUJII KUNIHIRO , MURAKAMI KOZO
IPC分类号： H03H9/25 , H03H3/08
摘要： PROBLEM TO BE SOLVED: To obtain an SAW device which can be made smaller than the conventional types, and to provide its manufacturing method. SOLUTION: A surface acoustic wave device is equipped with a piezoelectric board 11, a plurality of interdigital electrodes 12 arranged on the main surface 11a for exciting surface acoustic waves, a plurality of bumps 14 arranged on the main surface 11a, and an insulating sheet 15 arranged, so as to face the main surface 11a. The bumps 14 and the interdigital electrodes 12 are electrically connected together, and the bumps 15 are provided penetrating through the insulating sheet 15.

9. 发明专利

JP2002217673A SAW DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT USING THE SAME 失效
公开(公告)号：JP2002217673A
公开(公告)日：2002-08-02
申请号：JP2001006032
申请日：2001-01-15
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： FUJII KUNIHIRO , AZUMA KAZUJI , NANBA AKIHIKO
IPC分类号： H03H9/145 , H03H3/08 , H03H9/25
摘要： PROBLEM TO BE SOLVED: To provide an SAW device wherein short-circuit failures caused by a cover on IDT electrodes for sealing them are prevented from occurring. SOLUTION: The SAW device has IDT electrodes 12 provided on a piezoelectric substrate 11; input/output electrodes 13 connected with the IDT electrodes 12; a non-contact cover 14 with the IDT electrodes 12 which is so provided as to cover them; protruding electrodes 16 provided on the input/output electrodes 13, and a resin layer 18 for so coating therewith the outer peripheral portions of the cover 14, the input/output electrodes 13, and bump electrodes 16 as to expose only the upper portions of the electrodes 16 to the external. Further, the upper end surfaces of the bump electrodes 16 and the surface of the resin layer 18 are so formed that they nearly exist in the same plane.

10. 发明专利

JP2002009570A ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JP2002009570A
公开(公告)日：2002-01-11
申请号：JP2000190914
申请日：2000-06-26
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： FUJII KUNIHIRO , TANATSUGI EIJI
IPC分类号： H05K3/34 , H01L21/60 , H03H3/08 , H03H9/25
摘要： PROBLEM TO BE SOLVED: To provide an electronic component where each bump and a metallic layer provided on a support have an identical adhesive strength to each other even when a mount face of the support such as a package and a substrate on which an element is mounted is not flat. SOLUTION: The electronic component is provided with a package 3 having a metallic layer 4 and a SAW element 7 that is mounted on this metallic layer 4 via bumps 6a, 6b. The middle part of the mount part of the SAW element 7 on the package 3 is thicker than the outer circumferential parts, the height of the bumps 6a, 6b mounted on the middle part of the SAW element 7 is lower than that of the bumps mounted on the circumferential part so as to reduce dispersion in forces exerted onto the metallic layer via the bumps 6a, 6b thereby attaining the purpose above.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式