会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 5. 发明专利
    • ANTIBACTERIAL METALLIC AIR FILTER AND ITS PRODUCTION
    • JPH09155124A
    • 1997-06-17
    • JP31563595
    • 1995-12-04
    • MITSUBISHI MATERIALS CORP
    • ISHIBASHI SHUNJISHOJI KAZUHIKOHOSHINO KOJIKONO TORU
    • E03C1/10A61L2/16B01D39/14B22F3/11B22F5/00C22C1/08
    • PROBLEM TO BE SOLVED: To provide an antibacterial metallic air filter having durability in which antibacterial action is excellent by converting metallic powder consisting of at least one kind selected from among copper, silver and their alloy having antibacterial properties into a three- dimensional meshy porous metallic sintered body. SOLUTION: An antibacterial metallic air filter is produced by converting metallic powder consisting of at least one kind selected from among copper, silver and their alloy having antibacterial properties into a three-dimensional meshy porous metallic sintered body. The antibacterial metallic air filter is obtained by reinforcing at least one side of the antibacterial metallic air filter with a reinforcement member communicating with the front and the back in accordance with necessity. The antibacterial metallic air filter is produced by sintering and combining metallic powder consisting of at least one kind selected from among copper, silver, and their alloy having antibacterial properties as the three-dimensional meshy porous metallic sintered body on/with the surface of the meshy body or punching metal of stainless steel communicating with the front and the back as a base substance. Mixed composition slurry comprised of metallic powder consisting of at least one kind selected from among copper, silver and their alloy having antibacterial properties, a water insoluble hydrocarbon- based organic solvent, a surfactant, a water soluble resin binder and water is foamed, molded, dried and sintered to form the three-dimensional meshy porous metallic sintered body.
    • 8. 发明专利
    • COPPER ANODE FOR HIGH-CURRENT DENSITY PLATING
    • JPH0867932A
    • 1996-03-12
    • JP22734294
    • 1994-08-29
    • MITSUBISHI MATERIALS CORP
    • FURUSHIBA YUTAKAISHIBASHI SHUNJI
    • C25D7/00C22C9/00C25D17/10
    • PURPOSE: To obtain a copper anode for high-current density plating which does not form microprojections on the surface of a copper plating layer even if copper plating is executed at the high current density by composing the copper anode of phosphuretted copper consisting of specific ratios of O, P and Cu. CONSTITUTION: This copper anode for high current density plating consists of the phosphuretted copper having a compsn. contg. 20 to 100ppm O, 350 to 700ppm P and consisting of the balance Cu with inevitable impurities. The plating layer free from the microprojections on the plating surface is obtd. by subjecting a drum for gravure printing to the copper plating at the high current density by using such copper anode. The phosphuretted copper described above is obtd. by melting electrolytic copper having purity of about >=99.99% in a shaft furnace of a CO+N2 atmosphere and adding a prescribed amt. of P to the resulted melt in a holding furnace, then further, blowing O2 thereto to increase the O content. This ingot is extrusion worked to a round rod and further, this round rod is formed by forging, etc., and is rapidly cooled and pickled, by which the copper anode described above is produced.