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1. 发明专利

JPH09157675A ANTIMICROBIAL METALLIC MATERIAL FOR WATER-SOLUBLE CUTTING/MACHINING OIL AND ARTICLE 失效
公开(公告)号：JPH09157675A
公开(公告)日：1997-06-17
申请号：JP31563895
申请日：1995-12-04
申请人： MITSUBISHI MATERIALS CORP
发明人： ISHIBASHI SHUNJI , SHOJI KAZUHIKO , HOSHINO KOJI , KONO TORU
IPC分类号： E03C1/26 , A01N59/16 , A01N59/20 , A61L2/16 , B22F3/11 , B22F5/00 , C10M125/04 , C10N10/02 , C10N30/12 , C10N40/22 , C22C1/08
摘要： PROBLEM TO BE SOLVED: To ensure cutting oil/machining oil maintaining its performance over a long period to be retained at excellent disposition through preventing its putrefaction with offensive odor due to outbreak of anaerobic bacteria or sulfate-reducing bacteria. SOLUTION: This antimicrobial metallic material has a form of threedimensional netty porous metal sintered compact made from metallic powder consisting of at least one kind among antimicrobial copper, silver and alloy thereof. The sintered compact may be borne on the surface of a stainless steel net or punching metal with the surface and reverse surface communicating with each other. The other objective antimicrobial metallic article is obtained by putting the above sintered compact into a water- and air-permeable reinforcing member 2. This antimicrobial metallic material is obtained by expanding a mixed composition slurry comprising the above-mentioned metallic powder, a water-insoluble hydrocarbon-based organic solvent, surfactant, water-soluble resin binder and water followed by molding, drying, degreasing and then sintering to form a three-dimensional netty porous metal sintered compact.

2. 发明专利

JPH04111763A SAMPLE PREPARING METHOD AND WORKPIECE GRINDING DEVICE 失效
公开(公告)号：JPH04111763A
公开(公告)日：1992-04-13
申请号：JP22699290
申请日：1990-08-29
申请人： MITSUBISHI MATERIALS CORP
发明人： ISHIBASHI SHUNJI , AKIYAMA KAZUHIRO , SATO YASUO , SUGA HISAAKI
IPC分类号： G01N1/32 , B24B7/04
摘要： PURPOSE:To easily and surely obtain a sample of high finishing accuracy by reducing gradually a grinding load acting on workpiece in accordance with a progress of grinding, while rotating a grinding plate about an axis further by a grinding load reducing means. CONSTITUTION:A workpiece W, which distortion of a ground surface is removed, is ground white moving a sample table 18, to which the workpiece W is fixedly mounted, an axial direction of a grinding plate 10, while rotating the grinding plate 10 about in an axis. Further, a grinding load, acting on the workpiece according to a progress of grinding, is gradually reduced by grinding load reducing means 20. In this way, this grinding plate 10 is not moved to dance on the workpiece W further delaying a grinding speed according to the progress of grinding, so that a sample of high finishing accuracy can be easily and surely obtained without giving damage to the workpiece W.

3. 发明专利

JPH09155124A ANTIBACTERIAL METALLIC AIR FILTER AND ITS PRODUCTION 失效
公开(公告)号：JPH09155124A
公开(公告)日：1997-06-17
申请号：JP31563595
申请日：1995-12-04
申请人： MITSUBISHI MATERIALS CORP
发明人： ISHIBASHI SHUNJI , SHOJI KAZUHIKO , HOSHINO KOJI , KONO TORU
IPC分类号： E03C1/10 , A61L2/16 , B01D39/14 , B22F3/11 , B22F5/00 , C22C1/08
摘要： PROBLEM TO BE SOLVED: To provide an antibacterial metallic air filter having durability in which antibacterial action is excellent by converting metallic powder consisting of at least one kind selected from among copper, silver and their alloy having antibacterial properties into a three- dimensional meshy porous metallic sintered body. SOLUTION: An antibacterial metallic air filter is produced by converting metallic powder consisting of at least one kind selected from among copper, silver and their alloy having antibacterial properties into a three-dimensional meshy porous metallic sintered body. The antibacterial metallic air filter is obtained by reinforcing at least one side of the antibacterial metallic air filter with a reinforcement member communicating with the front and the back in accordance with necessity. The antibacterial metallic air filter is produced by sintering and combining metallic powder consisting of at least one kind selected from among copper, silver, and their alloy having antibacterial properties as the three-dimensional meshy porous metallic sintered body on/with the surface of the meshy body or punching metal of stainless steel communicating with the front and the back as a base substance. Mixed composition slurry comprised of metallic powder consisting of at least one kind selected from among copper, silver and their alloy having antibacterial properties, a water insoluble hydrocarbon- based organic solvent, a surfactant, a water soluble resin binder and water is foamed, molded, dried and sintered to form the three-dimensional meshy porous metallic sintered body.

4. 发明专利

JPH07242965A COPPER ALLOY EXCELLENT IN PLATING PROPERTY AND ELECTRICAL CONDUCTIVITY AND THIN SHEET OR STRIP CONSTITUTED OF THE SAME COPPER ALLOY 失效
公开(公告)号：JPH07242965A
公开(公告)日：1995-09-19
申请号：JP5807294
申请日：1994-03-03
申请人： MITSUBISHI MATERIALS CORP , MITSUBISHI SHINDO KK
发明人： FURUSHIBA YUTAKA , ISHIBASHI SHUNJI
IPC分类号： C22C9/00 , H01L23/48
摘要： PURPOSE:To produce a copper alloy excellent in plating property and electrical conductivity and capable of producing a lead frame for a semiconductor device such as IC and SI and to produce a thin sheet or a strip constituted of the same copper alloy. CONSTITUTION:A copper alloy having a compsn. contg., by weight, 1.5 to 2.3% Fe, 10 to 100ppm C, and the balance Cu with inevitable impurities and a copper alloy thin sheet or strip constituted of the same are produced. Or, a copper alloy having a compsn. contg. 1.5 to 2.3% Fe and 10 to 100ppm C, furthermore contg. 0.015 to 0.045% P, and the balance Cu with inevitable impurities and a copper alloy thin sheet or strip constituted of the same are produced.

5. 发明专利

JPH0472735A PROCESS OF GETTERING SEMICONDUCTOR WAFER 失效
公开(公告)号：JPH0472735A
公开(公告)日：1992-03-06
申请号：JP18603990
申请日：1990-07-13
申请人： MITSUBISHI MATERIALS CORP , NIPPON SILICONE KK
发明人： SUGA HISAAKI , NAKADA YOSHINOBU , AKIYAMA KAZUHIRO , ISHIBASHI SHUNJI
IPC分类号： H01L21/322
摘要： PURPOSE:To enable abundant impurities to be rapidly discharged out of a semiconductor wafer by a method wherein a damage layer is formed on the rear surface of the semiconductor wafer which is to be heated in vacuum atmosphere. CONSTITUTION:Impurities 12 in specific concentration are contained in the surface 11A side of a silicon wafer 11. In this case, a damage layer 13 in specific depth formed of e.g. surface defects, linear defects or crystal grain boundaries 13A extends outside so as to expose the defects 13A in the end rear surface 11B of the silicon wafer 11. When this silicon wafer 11 is arranged in e.g. vacuum vessel to be heated at e.g. 700 deg.C in vacuum atmosphere exceeding 10-3Torr, the defects 13A etc., in the damage layer 13 work as a carrier route for the impurities 12. That is, the impurities 12 are attracted to the parts around the linear defects 13A so as to be discharged outside the wafer 11 through the intermediary of the linear defects 13A.

6. 发明专利

JPH0867932A COPPER ANODE FOR HIGH-CURRENT DENSITY PLATING 失效
公开(公告)号：JPH0867932A
公开(公告)日：1996-03-12
申请号：JP22734294
申请日：1994-08-29
申请人： MITSUBISHI MATERIALS CORP
发明人： FURUSHIBA YUTAKA , ISHIBASHI SHUNJI
IPC分类号： C25D7/00 , C22C9/00 , C25D17/10
摘要： PURPOSE: To obtain a copper anode for high-current density plating which does not form microprojections on the surface of a copper plating layer even if copper plating is executed at the high current density by composing the copper anode of phosphuretted copper consisting of specific ratios of O, P and Cu. CONSTITUTION: This copper anode for high current density plating consists of the phosphuretted copper having a compsn. contg. 20 to 100ppm O, 350 to 700ppm P and consisting of the balance Cu with inevitable impurities. The plating layer free from the microprojections on the plating surface is obtd. by subjecting a drum for gravure printing to the copper plating at the high current density by using such copper anode. The phosphuretted copper described above is obtd. by melting electrolytic copper having purity of about >=99.99% in a shaft furnace of a CO+N2 atmosphere and adding a prescribed amt. of P to the resulted melt in a holding furnace, then further, blowing O2 thereto to increase the O content. This ingot is extrusion worked to a round rod and further, this round rod is formed by forging, etc., and is rapidly cooled and pickled, by which the copper anode described above is produced.

7. 发明专利

JPH06316735A HANGING OVERHEAD WIRE 失效
公开(公告)号：JPH06316735A
公开(公告)日：1994-11-15
申请号：JP12547193
申请日：1993-04-28
申请人： MITSUBISHI MATERIALS CORP , RAILWAY TECHNICAL RES INST
发明人： NAGASAWA HIROKI , AOKI SUMIHISA , MAE YOSHIHARU , KOSHIBA YUTAKA , YAJIMA KENJI , ISHIBASHI SHUNJI
IPC分类号： C22C9/00
摘要： PURPOSE:To obtain a hanging overhead wire excellent in high temp. creep strength and usable in a severe environment by specifying the oxygen content in a copper alloy to be a certain value or below. CONSTITUTION:The compsn. of a copper alloy contg., by weight, 0.15 to 1% Cr, 0.01 to 0.3% Zr and 1% Cr content and >0.3% Zr content, its hot workability is deteriorated, and its working into wire rod is made hard. On the other hand, both in the case of 10ppm oxygen, high temp. creep strength at >=200 deg.C can not be obtd. By regulating the oxygen content in the copper alloy contg. specified amounts of Cr and Zr to be

8. 发明专利

JPH06154838A PRODUCTION OF COPPER ALLOY TROLLEY WIRE AND HANGING STRINGING 失效
公开(公告)号：JPH06154838A
公开(公告)日：1994-06-03
申请号：JP33102492
申请日：1992-11-17
申请人： MITSUBISHI MATERIALS CORP , RAILWAY TECHNICAL RES INST
发明人： NAGASAWA HIROKI , AOKI SUMIHISA , KAWAKITA SHIZUO , MAE YOSHIHARU , IWAMURA TAKURO , KOSHIBA YUTAKA , YAJIMA KENJI , ISHIBASHI SHUNJI
IPC分类号： B21C1/00 , B60M1/30 , C22C9/00 , C22F1/00 , C22F1/08 , H01B1/02
摘要： PURPOSE:To provide the process for production of the trolley wire and hanging stringing of the tramcar lines of high-speed electric railways. CONSTITUTION:A strand is produced by hot working a copper alloy billet consisting of a compsn., which contains, by weight %, 0.1 to 1.0% Cr, 0.01 to 0.3 Zr, 0.006 to 0.1% Si and 0.006 to 0.1% P and consists of the balance Cu and inevitable impurities, under the conditions of 860 to 1000 deg.C and >=90% working rate, the rapidly cooling this billet right after this hot working or allowing the billet to cool after the hot rolling and further, subjecting the alloy to a soln. heat treatment consisting of rapid cooling after heating at 860 to 1000 deg.C. This strand is then subjected to at least one time of cold working and is thereafter subjected to an aging treatment or is subjected repetitively to >=2 times of the cold working and the aging treatment.

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