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1. 发明专利

JP2014107393A Normal temperature bonding device, wafer having normal temperature bonding device and normal temperature bonding method 审中-公开
标题翻译：正常温度结合装置，具有正常温度结合装置的散热器和正常温度接合方法
公开(公告)号：JP2014107393A
公开(公告)日：2014-06-09
申请号：JP2012258771
申请日：2012-11-27
申请人： Mitsubishi Heavy Ind Ltd , 三菱重工業株式会社
发明人： GOTO TAKAYUKI , TSUTSUMI KEIICHIRO , TSUNO TAKESHI , KINOUCHI MASAHITO , IDE KENSUKE
IPC分类号： H01L21/02 , B23K20/00
CPC分类号： H01L21/76251 , B23K15/0006 , B23K20/00 , B23K20/02 , B23K20/233 , B23K20/2333 , B23K20/2336 , B23K2201/40 , B32B15/01 , B32B37/06 , B32B37/18 , B32B38/0008 , B32B2457/14 , B81C1/00269 , H01L21/2007 , H01L21/67092 , H01L21/67748
摘要： PROBLEM TO BE SOLVED: To allow for bonding of a variety of material combinations becoming the components of a functional device.SOLUTION: A normal temperature bonding device comprises: a first substrate 51 having a first surface 51a; and a second substrate 52 having a second surface 52a being bonded to the first surface 51a. In the bonding of the first and second surfaces 51a, 52a, any one of the first and second surfaces 51a, 52a contains one n-th material such as silicon, SiO or GaN, and the other contains the other n-th material such as silicon, SiO2, quartz or Au, and there are at least 115 combinations of materials.
摘要翻译：要解决的问题：允许将各种材料组合成为功能装置的组件的结合。解决方案：常温接合装置包括：具有第一表面51a的第一基板51; 第二基板52具有与第一表面51a接合的第二表面52a。在第一表面51a和第二表面52a的接合中，第一表面51a和第二表面52a中的任何一个包含一个第n个材料，例如硅，SiO或GaN，另一个包含另一个第n个材料，例如硅，SiO 2，石英或Au，并且存在至少115种材料的组合。

2. 发明专利

JP2011134848A Bonding method and bonding device controller 有权
标题翻译：接合方法和接合装置控制器
公开(公告)号：JP2011134848A
公开(公告)日：2011-07-07
申请号：JP2009292313
申请日：2009-12-24
申请人： Mitsubishi Heavy Ind Ltd , 三菱重工業株式会社
发明人： TSUNO TAKESHI , KINOUCHI MASAHITO , GOTO TAKAYUKI , SUZUKI KITEN , IDE KENSUKE
IPC分类号： H01L21/02
摘要： PROBLEM TO BE SOLVED: To provide a method for aligning a bonding target faster. SOLUTION: The bonding method includes a step of photographing a first image reflecting a first guide pattern formed on a reference scale different from the bonding target by use of a first alignment camera 41-1, and photographing a second image reflecting a second guide pattern formed on the reference scale by use of a second alignment camera 41-2 and a step of aligning the first alignment camera 41-1 so that the first guide pattern is reflected in the first image when the second guide pattern is reflected in the second image. According to such a bonding method, the first alignment camera 41-1 and the second alignment camera 41-2 can faster be aligned as compared to aligning by using alignment marks formed in the bonding target, and a bonding substrate 32 and a substrate 34 to be bonded can faster be aligned. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种更快地对准接合目标的方法。解决方案：接合方法包括通过使用第一对准摄像机41-1拍摄反映形成在与接合目标不同的基准标尺上的第一引导图案的第一图像的步骤，并且拍摄反映第二对准图像的第二图像引导图案通过使用第二对准相机41-2在参考标尺上形成，以及将第一对准相机41-1对准的步骤，使得当第二引导图案被反射到第一引导图案时，第一引导图案被反射在第一图像中第二张图片。根据这种接合方法，与通过使用在接合靶中形成的对准标记的对准相比，第一对准照相机41-1和第二对准照相机41-2可以更快地对准，以及接合基板32和基板34 粘合可以更快地对齐。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2010141092A Normal-temperature bonding device 有权
标题翻译：正温接合装置
公开(公告)号：JP2010141092A
公开(公告)日：2010-06-24
申请号：JP2008315431
申请日：2008-12-11
申请人： Mitsubishi Heavy Ind Ltd , 三菱重工業株式会社
发明人： KINOUCHI MASAHITO , GOTO TAKAYUKI , TAWARA SATOSHI , TSUNO TAKESHI , UCHIUMI ATSUSHI , IDE KENSUKE , SUZUKI KITEN
IPC分类号： H01L21/02 , B23K20/00 , B23K101/40
CPC分类号： H01L21/6838 , B23K20/02 , B23K2201/40 , H01L21/67201 , Y10T156/10 , Y10T156/17
摘要： PROBLEM TO BE SOLVED: To improve reliability in wafer bonding, and to reduce manufacturing cost. SOLUTION: A normal-temperature bonding device 1 includes: a cartridge 11; a conveyance device for conveying the cartridge 11; a lower side stage for holding the cartridge 11; an upper side stage facing a wafer 50-1 mounted on the cartridge 11 when the lower stage holds the cartridge 11; and a compression-bonding mechanism for bringing the upper stage closer to the lower stage. The upper wafer 50-1 held to the upper stage is directly brought into contact with the upper stage. Thus, the conveyance device can convey the wafer 50-1 without direct contact with the wafer 50-1. The wafer 50-1 can be held to the lower stage without direct contact with the lower stage. As a result, the normal-temperature bonding device can prevent contamination of the wafer 50-1 to be bonded. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提高晶片接合的可靠性，降低制造成本。常温接合装置1包括：盒11; 用于输送盒11的输送装置; 用于保持盒11的下侧台阶; 当下级保持盒11时，面对安装在盒11上的晶片50-1的上侧级; 以及用于使上层更靠近下级的压缩机构。保持在上层的上晶片50-1直接与上层接触。因此，输送装置可以不与晶片50-1直接接触而输送晶片50-1。可以将晶片50-1保持在下级而不与下级直接接触。结果，常温接合装置能够防止待接合的晶片50-1的污染。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2007140737A Shape correction method, molding die and production method for molded article 有权
标题翻译：形状校正方法，成型模具和成型制品的生产方法
公开(公告)号：JP2007140737A
公开(公告)日：2007-06-07
申请号：JP2005331352
申请日：2005-11-16
申请人： Mitsubishi Heavy Ind Ltd , 三菱重工業株式会社
发明人： MIURA MASAMI , IDE KENSUKE , NAKAHAMA TAKESHI , NAKAHARA YOSHISATO , KONO TAKAYUKI , SATO HIROMASA , IZUMI MITSUHIKO
IPC分类号： G06F17/50 , B21D37/20 , B29C33/38
摘要： PROBLEM TO BE SOLVED: To provide a shape correction method capable of correcting a molding die model to shape suitable for press molding, a molding die manufactured on the basis of the molding die model corrected by the shape correction method, and a production method for the molding die allowing production of a high-quality molded article wherein a wrinkle or a crack is reduced by performing molding by use of the molding die.
SOLUTION: By correcting curved surface shape of a filet face of the molding die model to curved surface shape of a part of an elliptical torus, a shape model suitable for the press molding is made, the molding die is manufactured on the basis of the shape model, and the high-quality molded article is obtained by performing the press molding by use of the molding die.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种能够校正成型模具以形成适合于模压成型的形状校正方法，基于通过形状校正方法校正的成型模具模型制造的成型模具和生产通过使用成形模进行成型，可以制造成型品的高品质成型体的制造方法，其中皱纹或裂纹减少。解决方案：通过将成型模具模型的曲面的曲面形状校正为椭圆环的一部分的曲面形状，形成适合于压制成型的形状模型，基于该模具的制造的形状模型，并且通过使用模制模具进行压制成型来获得高质量的模制品。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2006065716A Correction method for deformation error 审中-公开
标题翻译：变形误差校正方法
公开(公告)号：JP2006065716A
公开(公告)日：2006-03-09
申请号：JP2004249538
申请日：2004-08-30
申请人： Mitsubishi Heavy Ind Ltd , 三菱重工業株式会社
发明人： YAMAMOTO HIDEAKI , IDE KENSUKE , ARAI EIJI , SHIRASE KEIICHI
IPC分类号： G05B19/404 , B23Q15/18
摘要： PROBLEM TO BE SOLVED: To provide a correction method for a deformation error capable of compensating static precision in the whole working area of a machine tool. SOLUTION: A three-dimensional finite element model for the whole machine tool is prepared, a temperature change in each nodal point of the finite element model is found by a nonstationary heat conduction analysis, a thermal deformation amount in the each nodal point is found based on the temperature change by a nonstationary finite element analysis (step S2), an error model is prepared based on the thermal deformation amount in the each nodal point, an error amount in the working area of the machine tool is calculated based on the error model to prepare a three-dimensional error map (step S4), a database is constructed based on the three-dimensional error map in every prescribed time interval (step S9), a correction amount for each shaft is found with respect to a lapse time and a position in the each shaft of constitutional machines (step S10), based on the database, when machining a work, and a command position for the machine tool is corrected based on the correction amount (step S11-S16). COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够补偿机床整个工作区域的静态精度的变形误差的校正方法。解决方案：制备整个机床的三维有限元模型，通过非平稳热传导分析发现有限元模型的每个节点的温度变化，每个节点的热变形量基于通过非平稳有限元分析的温度变化（步骤S2）找到，基于每个节点中的热变形量准备误差模型，基于机床的工作区域中的误差量基于用于准备三维误差图的误差模型（步骤S4），在每个规定的时间间隔内基于三维误差图构建数据库（步骤S9），针对每个轴的每个轴找到校正量（步骤S10），基于数据库，当加工工件时，基于校正量来校正机床的指令位置（步骤S10） S11-S16）。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2003145374A MACHINE TOOL 审中-公开
公开(公告)号：JP2003145374A
公开(公告)日：2003-05-20
申请号：JP2001349811
申请日：2001-11-15
申请人： MITSUBISHI HEAVY IND LTD
发明人： WATANABE AKIRA , IDE KENSUKE , ICHIKIZAKI TETSUO , HORIUCHI SEIJI
IPC分类号： B23Q1/00 , B23Q1/01 , B23Q1/72 , B23Q5/00 , B23Q5/40 , B23Q11/00 , B23Q1/25
摘要： PROBLEM TO BE SOLVED: To provide a machine tool for improving productivity by increasing a cutting speed on a time average basis while effectively suppressing the vibration of a structure to be generated during the movement of a moving body relative to a structure with driving systems. SOLUTION: The machine tool comprises a table body 3 linearly movable via guide members 4 having sliding or rolling guide faces on a bed 1 and the driving systems having ball screws 5 for moving the table body 3 along the guide faces. The pair of guide members 4 are provided at point-symmetrical positions about the position of a gravity center G of the table body 3, and the pair of driving systems having the ball screws 5 are provided at point- symmetrical positions about the position of the gravity center G of the table body 3 or the set of driving systems having the ball screws are provided at the position of the gravity center G.

7. 发明专利

JPH05138531A POLISHING DEVICE 失效
公开(公告)号：JPH05138531A
公开(公告)日：1993-06-01
申请号：JP30604791
申请日：1991-11-21
申请人： MITSUBISHI HEAVY IND LTD
发明人： IDE KENSUKE
IPC分类号： B24B19/08 , B24B27/00 , B24B49/12
摘要： PURPOSE:To carry out unmanned manufacturing of high quality metallic mold by making a measurement of the gloss of a work to be polished, and controlling the polishing movement making a comparison between the measured results and the set value. CONSTITUTION:A gloss measuring device 6 consisting of a light emitting device and a light receiving device which are placed mutually opposite to each other relative to the relective surface is provided to a robot body facing toward a polished surface, and the gloss of a press metallic mold 4 which is a work to be polished is measured. The measured data together with the set data to be set by a gloss setting tool 7 are received by a polishing continuation command device 8. The gloss of the metallic mold surface in the vicinity of the tip of a polishing tool 4 measured by the gloss measuring device 6 is collected to obtain the average value, and a comparison is made between the average value and the set value. When the measured value is smaller than the set data, the command to continue the polishing work in the same region is outputted to a control device 1, and the polishing work of the metallic mold by the polishing tool 4 is continuously achieved.

8. 发明专利

JPH04252911A THREE-DIMENSIONAL MEASURING APPARATUS 失效
公开(公告)号：JPH04252911A
公开(公告)日：1992-09-08
申请号：JP2677491
申请日：1991-01-29
申请人： MITSUBISHI HEAVY IND LTD
发明人： IDE KENSUKE
IPC分类号： G01B5/20 , G01B5/008 , G01B21/20
摘要： PURPOSE:To correctly correct a probe diameter and accurately measure a model shape. CONSTITUTION:When a probe 10 comes into contact with a model 7, a touch signal is output from a touch sensor 5. Robot positions for moving the probe 10 are measured by position measuring devices 1a, 1b,...1N. The probe center coordinate is calculated by calculators 2, 3 from the robot positions when the touch signals were output. A virtual plane calculator 4 calculates a virtual plane which is approximate to a plane including a point which is being measured. A probe diameter correcting device 6 shifts the calculated center coordinate of the probe along a perpendicular direction to the virtual plane by a radius of the probe toward the virtual plane, making the shifted coordinate a model surface coordinate.

9. 发明专利

JPH03249511A THREE-DIMENSIONAL SHAPE RECOGNIZER 失效
公开(公告)号：JPH03249511A
公开(公告)日：1991-11-07
申请号：JP4581890
申请日：1990-02-28
申请人： MITSUBISHI HEAVY IND LTD
发明人： IDE KENSUKE , TSUKAMOTO EIHIKO
IPC分类号： G01B11/24
摘要： PURPOSE:To realize the three-dimensional shape recognizer which can accurately recognize the shape of an object of measurement even when a virtual image is formed by spraying a frosting agent on the surface of an object of measurement irradiated with slit light and its peripheral part when a virtual image formation detector detects the formation of the virtual image. CONSTITUTION:The object of measurement is irradiated with the slit light from a slit light generator 3 and a coordinate computing element 7 performs arithmetic based upon image data inputted by a camera 5 to recognize the three-dimensional shape of the object of measurement. The slit light irradiation possibly generates the virtual image which is a mirror image of a real image on the object of measurement in the image data other than the real image. A virtual image detector 8 detects the formation of the virtual image as virtual image generation when there are plural coordinates on a Z axis for one coordinate on, for example, an X axis. A frosting agent sprayer 9 sprays the frosting agent on the surface of the object of measurement to be irradiated with the slit light and its peripheral part in response to the detection of the virtual image formation, so the luster of the part is eliminated, so that the virtual image disappears.

10. 发明专利

JPH03249505A THREE-DIMENSIONAL SHAPE RECOGNIZER 失效
公开(公告)号：JPH03249505A
公开(公告)日：1991-11-07
申请号：JP4581290
申请日：1990-02-28
申请人： MITSUBISHI HEAVY IND LTD
发明人： IDE KENSUKE
IPC分类号： G01B11/24
摘要： PURPOSE:To calculate image data corresponding to a real image by a coordinate computing element and to accurately recognize a three-dimensional shape by irradiating an object of measurement with an asymmetrical pattern and deciding the real image and a virtual image according to the image data. CONSTITUTION:A light projection pattern switch 9 selects a slit light generator 3 normally (when no virtual image is generated) to irradiate the object of measurement with slit light. When the virtual image which is a mirror image is formed on the object of measurement, an asymmetrical pattern generator 10 is selected to irradiate the object with the asymmetrical pattern. At this time, a real-image/virtual-image decision device 11 judges the same pattern with the projected object pattern as the real image and the inverted pattern of the asymmetrical pattern as the virtual image from image data inputted to an image fetch device 6 and supplies corresponding data to the coordinate computing element 7. Thus, the three-dimensional shape can accurately be recognized.

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