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1. 发明专利

JP2006156624A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2006156624A
公开(公告)日：2006-06-15
申请号：JP2004343574
申请日：2004-11-29
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： OBARA MASANOBU , HASHIMO SEIJI , OGUSHI TETSURO , MIYA KAZUHIRO , MATSUNAGA TOSHIHIRO
IPC分类号： H01L23/473 , H01L25/04 , H01L25/18
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2924/13055 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device which can be miniaturized and which has high cooling capability.
SOLUTION: In the semiconductor device in which semiconductor modules are placed in both the sides of a heat sink, respectively, and cooling liquid is supplied to the backside of the semiconductor module, the heat sink includes partitions having duct sides arranged at approximately parallel at both sides, first aqueducts provided along the partitions, second aqueducts arranged substantially parallel to the first aqueducts through the partitions, and a duct part formed between the duct surface of the partition part and the backside of the semiconductor module. Cooling liquid supplied to the first aqueduct is divided into each duct part and introduced into the second aqueduct.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供可以小型化并且具有高冷却能力的半导体器件。解决方案：在分别将半导体模块放置在散热器的两侧并且冷却液体被供应到半导体模块的背面的半导体器件中，散热器包括具有大致布置的管道侧的隔板在两侧平行地设置有沿分隔件设置的第一输水管，通过分隔件与第一导水管大致平行地配置的第二输水管，以及形成在分隔部的管道面与半导体模块的背面之间的管道部。供给到第一输水管的冷却液被分割成每个管道部分并被引入第二输水管。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JPH04366567A WIRING BOARD 失效
公开(公告)号：JPH04366567A
公开(公告)日：1992-12-18
申请号：JP14305491
申请日：1991-06-14
申请人： MITSUBISHI ELECTRIC CORP
发明人： HAMAGUCHI TSUNEO , OBARA MASANOBU
IPC分类号： H01L23/538 , H01L25/00 , H05K1/14
摘要： PURPOSE:To provide a wiring board capable of stereoscopically mounting an electronic part at a high density. CONSTITUTION:A connecting member 8 is provided between a first wiring board 1 having a wiring layer 3 consisting of a conductor and an insulating body and formed on a support base plate 2, and a second wiring board 4 having a wiring layer 6 consisting of a conductor and an insulating body and formed on a support base plate 5. The conductors of the wiring layers 3, 6 are connected to each other by use of a connecting conductor 11 formed in the through hole 9 of the connecting member and a connecting conductor 10 formed in the through hole 7 of the support base plate 5.

3. 发明专利

JPH02303037A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH02303037A
公开(公告)日：1990-12-17
申请号：JP12278389
申请日：1989-05-18
申请人： MITSUBISHI ELECTRIC CORP
发明人： OBARA MASANOBU , KONDO TAKASHI , YAMASE MIYUKI
IPC分类号： H01L21/60 , H01L23/13 , H01L23/495
摘要： PURPOSE:To improve the reliability of a device by supporting respective metallic wires which connect internal electrodes in internal electrode rows located on the outside to electrodes of a semiconductor chip with a holder and preventing occurrence of short circuit accidents. CONSTITUTION:Stepped parts 71-73 are formed by directing outward on the mainframe of a package 7 so that a recessed part 74 is surrounded at a peripheral part of the recessed part 74. Internal electrodes 51-53 are disposed on the stepped parts 71-73 and in this way, internal electrode rows are formed trebly at the peripheral part of the semiconductor 1. A plurality of electrodes 2 are formed at the upper face of a chip 1 and the internal electrodes 51-53 corresponding to the electrodes 2 are connected one after another with metallic wires 41-43. Further, A plurality of external electrodes 6 are provided at lower faced of the main frame 7 and they are connected electrically to the internal electrodes 51-53. Then, a protruding holder part 8 is formed so that its part demarcates spaces between the stepped parts 71-73 and the metallic wires 41-43 are held at a prescribed height. Such a construction prevents occurrence of short circuit accidents of the metallic wires 41-43 and improves the reliability of this device.

4. 发明专利

JPH02246234A SEMICONDUCTOR CONTAINER AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH02246234A
公开(公告)日：1990-10-02
申请号：JP6801989
申请日：1989-03-20
申请人： MITSUBISHI ELECTRIC CORP
发明人： KONDO TAKASHI , YAMA YOMIJI , OBARA MASANOBU
IPC分类号： H01L21/60
摘要： PURPOSE:To prevent contact between wires and contact between the wire and a semiconductor element by providing projecting parts at the peripheral edges of inner leads, providing the wires along the parts, and restricting the movement of the wires. CONSTITUTION:A semiconductor element 2 is fixed to a ceramic package 1. A wire 3 is provided along a projecting part 14 which is formed at a part of a projecting-part forming layer 114. A pad 21 which is formed at a part of the semiconductor element 2 through the wire 3 is electrically connected to an inner lead 11 comprising a metal layer that is provided by a method such as printing on an inner-lead forming layer. Therefore, the movement of the wire 3 which is provided along the projecting part is restricted by the projecting part 14 that is provided at the peripheral end part of the inner lead. Thus, contact between the wires and contact between the wire and the semiconductor element can be prevented.

5. 发明专利

JPH02237047A SEMICONDUCTOR TESTING DEVICE 失效
公开(公告)号：JPH02237047A
公开(公告)日：1990-09-19
申请号：JP5671889
申请日：1989-03-09
申请人： MITSUBISHI ELECTRIC CORP
发明人： TAKAGI RYOICHI , TADA TETSUO , OBARA MASANOBU
IPC分类号： G01R31/28 , G01R1/04 , G01R1/073 , H01L21/66
摘要： PURPOSE:To make it possible to measure a semiconductor wafer in the block in a unit of semiconductor wafer without moving the semiconductor wafer in parallel by a method wherein a contact part made to protrude from the surface of an electrically insulative substrate is formed on the substrate in such a way as to corresponding to all electrodes to be used as an object of measurement on the semiconductor wafer and a conductive layer on the contact part is made connectable electrically with the electrodes. CONSTITUTION:A contactor 294 is formed in such a way that when a probe card 2 is aligned to a prescribed position on a wafer 3, it faces each electrode pad 34 in semiconductor chips 33. The surface of the contactor 294 is coated with a metal thin film 296 and the film 296 is formed so as to come into contact electrically with the pads 34. This film 296 is electrically connected to a metal pattern wiring 292, which is extended from a selecting circuit 28, through a through hole 290. Thereby, a multitude of semiconductor devices formed on the wafer can be tested in the block and moreover, a high-precise alignment is possible to a multitude of the electrode pads formed by a fine work in the wafer.

6. 发明专利

JPH02235360A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH02235360A
公开(公告)日：1990-09-18
申请号：JP5663389
申请日：1989-03-08
申请人： MITSUBISHI ELECTRIC CORP
发明人： YAMA YOMIJI , KONDO TAKASHI , OBARA MASANOBU
IPC分类号： H01L23/02
摘要： PURPOSE:To prevent the generation of a recess at the tine of hermetic sealing even in the case of a large lid by installing a supporting stud part to support the lid from the inside, in the lid and a vessel which seal a semiconductor element. CONSTITUTION:At the central part of a vessel 1, a die pad part 2 for mounting a semiconductor element is formed, around which inner lead mounting parts 3, 4 are formed step-wise. A semiconductor element 5 is mounted on the die pad part 2. A square type stud part 15 is installed at each corner of the die pad part 2. The length of the part 15 is so set that the upper end comes into contact with the inner surface of a lid 13, and the lid 13 is retained from the inside by four points. By this constitution, the lid 13 can be prevented from being depressed in the case of hermetic sealing, and the generating of failures caused by mutual contact of metal thin wires 12 connecting each electrode of the semiconductor element with the inner leads 8, 9 corresponding with each of the above electrodes can be prevented.

7. 发明专利

JPS6356918A MANUFACTURE OF SEMICONDUCTOR ELEMENT 失效
公开(公告)号：JPS6356918A
公开(公告)日：1988-03-11
申请号：JP20205286
申请日：1986-08-27
申请人： MITSUBISHI ELECTRIC CORP
发明人： OBARA MASANOBU , ITOU KIYOYUKI , KOBAYASHI ISAO , HOSHINO MASAHIRO
IPC分类号： B05D5/12 , C25D13/00 , C25D13/20 , G03F7/16 , H01L21/027 , H01L21/30
摘要： PURPOSE:To coat the irregularities of the surface of a semiconductor substrate completely with a photosensitive resin uniformly without the loss of a material, and to apply the photosensitive resin precisely in arbitrary thickness by dipping the semiconductor substrate, on the surface of which a conductive film is formed, into the water-soluble photosensitive resin received in an electrolytic bath for electrodeposition coating and precipitating a photosensitive film through DC electrolysis. CONSTITUTION:When a photosensitive resist film is shaped onto the surface of a semiconductor substrate 3, a conductive film 15 is formed onto the surface of the semiconductor substrate 3, the semiconductor substrate 3 is dipped into an electrodeposition-coating water-soluble photosensitive resin 12 housed in an electrodeposition coating tank 11, and a photosensitive resist film is deposited through DC electrolysis. The semiconductor substrate 3, on the surface of which to be coated with a resin the conductive layer 15 such as a metallic layer in Al, Cu, etc., an ITO layer, etc. are shaped previously, is immersed into the electrodeposition- coating water-soluble photosensitive resin 12. DC voltage of approximately 200V is applied between the conductive layer 15 on the surface of the semiconductor substrate 3 and a cathode 13, thus electrodepositing the photosensitive resin dissolved or dispersed into the liquid 12 and charged at positive charges onto the surface of the conductive layer 15 on the surface of the semiconductor substrate 3.

8. 发明专利

JPS6259887B2 失效
公开(公告)号：JPS6259887B2
公开(公告)日：1987-12-14
申请号：JP17652582
申请日：1982-10-05
申请人： MITSUBISHI ELECTRIC CORP
发明人： OBARA MASANOBU , SHIBATA HIROSHI , NAKAO SHIN
IPC分类号： H01L23/34 , H01L23/367 , H01L23/40 , H01L23/433

9. 发明专利

JPS6224948B2 失效
公开(公告)号：JPS6224948B2
公开(公告)日：1987-05-30
申请号：JP17164181
申请日：1981-10-24
申请人： MITSUBISHI ELECTRIC CORP
发明人： OBARA MASANOBU
IPC分类号： H05K3/46 , H01L23/538

10. 发明专利

JPS60138948A PACKAGE FOR SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS60138948A
公开(公告)日：1985-07-23
申请号：JP24687883
申请日：1983-12-27
申请人： MITSUBISHI ELECTRIC CORP
发明人： OBARA MASANOBU
IPC分类号： H01L23/50 , H01L23/498
摘要： PURPOSE:To enable to perform necessary wirings on the substrate up to the neighborhood of a pin head provided on the substrate by a method wherein a pad for the pen head is made as small as possible and an area of the junction between the pad and the pin head to be performed using a solder material is made smaller, and at the same time, an adhesion to act between the other parts of the pin head and the substrate is held to the same degree as an adhesion at a time when a pad of the conventional size was used, by using together a soldering material and a bonding agent. CONSTITUTION:A pad 4 is made smaller to a degree that the pad 4 can be satisfied electrically necessary conditions and the pad 4 is adhered to a pin head 5b using a soldering material 5c such as a silver solder, etc. Moreover, the other parts of the pin head 5b are adhered to a substrate 1 with a bonding agent 5d such as an epoxy and a polyimide, etc., having an insulating property. As a result, it becomes possible to perform wirings 7 on the package substrate 1 located on the lower side of the pin head 5b, thereby enabling to cope with an augmentation of external terminals to be accompanied by an integration of elements. Incidentally, the external terminals are limited to a pin 5. So long as the external terminals are fine strips in a lead type, etc., that will do, and also, the terminals are limited to configuration and material.

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