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    • 4. 发明专利
    • X-RAY TRANSFER MASK
    • JPH02271608A
    • 1990-11-06
    • JP9373889
    • 1989-04-13
    • MITSUBISHI ELECTRIC CORP
    • TAKEUCHI SUSUMUMORIIZUMI KOICHI
    • G03F1/22H01L21/027
    • PURPOSE:To prevent an X-ray transmission thin film from warping by a method wherein a running hole opened inside and outside is provided on a support ring while a reinforcing thin film for transmitting X-rays is provided for closing an opening on the opposite side of the X-ray transmission thin film. CONSTITUTION:A support ring 11 for supporting an X-ray transmission thin film 1 comprises two rings 12,13, an upper ring and a lower ring, having inner holes 12a,13a expanding toward a side where the respective rings are joined to each other, wherein on a joint face on the lower ring side of the upper ring 12 a plurality of U-shaped grooves 14 extending along the diameter are provided, These U-shaped grooves are constituted so that they function as small running holes opened inside and outside of the support ring 11 when both rings 12,13 are joined. A reinforcing thin film 15 for transmitting X-rays is provided on the upper ring 12 of both rings 12, 13 so that an opening on the opposite side to the h,ray transmission thin film 1 is closed. Thus the X-ray transmission thin film 1 can be prevented from warping when a mask is moved thereby obtaining a highly precise pattern at the time of pattern transfer.
    • 6. 发明专利
    • APPARATUS FOR INSPECTING DEFECT IN CHARGED BEAM PATTERN
    • JPS62137835A
    • 1987-06-20
    • JP27850785
    • 1985-12-11
    • MITSUBISHI ELECTRIC CORP
    • MORIIZUMI KOICHITAKEUCHI SUSUMU
    • H01L21/66H01J37/28
    • PURPOSE:To perform high speed inspection of defects without large capacity memories, by projecting two charged beams on a pattern to be inspected and a reference pattern, sequentially comparing the intensities of secondary electrons, which are discharged from both patterns, thereby detecting the defects in the pattern. CONSTITUTION:One of two charged beams is projected on a pattern, whose defects are to be inspected; and the other is projected on a reference pattern. The two charged beams are alternately turned On and OFF by a blanking control circuit 4 so that the charged beams are alternately projected on the pattern to be inspected and the reference pattern. The secondary electron intensity signals of both patterns are detected in a time shared basis. Therefore, a sample chamber is not divided into two chambers and both patterns are not required to be isolated. One secondary electron detector 3 is enough. A deflection control circuit 5, which deflects the charged beams in association with the blanking control circuit 4, is provided. A pattern-defect detecting circuit 60 compares the intensities of the secondary electrons, which are generated from the pattern to be inspected and from the reference pattern for comparison and inspection and detects the defects in the pattern.
    • 9. 发明专利
    • Inspection-correction apparatus for mask pattern defect
    • 用于掩模图形缺陷的检查校正装置
    • JPS6184833A
    • 1986-04-30
    • JP20756884
    • 1984-10-02
    • Mitsubishi Electric Corp
    • MORIMOTO HIROAKISAITO KAZUNORITAKEUCHI SUSUMU
    • G03F1/84G03F1/86H01L21/027H01L21/30
    • H01L21/30
    • PURPOSE:To prevent detect correction marks from remaining, by a method wherein a mask pattern is scanned with a converged ion beam, and pattern defects are detected by obtained secondary electron signals; then, at the same time, the defects are corrected by ion beam irradiation. CONSTITUTION:Secondary electron signal waveforms 33 are obtained when the mask pattern 30 of a mask substrate 29 is scanned with a scanning ion beam 32. Thus, secondary electron signals made binary in scanning are successively contained into a video memory 25. On finish by a frame, a video signal processing circuit 24 successively reads out corresponding mask pattern design data which have been made binary by means of a CPU 26 via I/O bus 28, compares said data with the data in the video memory 25, and checks them for difference. If they have a difference, the data of its coordinates and size is fed to a beam deflection control circuit 22, and a defect part 31 is corrected by irradiation with ion beams 12.
    • 目的:通过利用会聚离子束扫描掩模图案的方法来防止检测到校正痕迹,并通过获得的二次电子信号检测图案缺陷; 然后,同时通过离子束照射校正缺陷。 构成:当用扫描离子束32扫描掩模基板29的掩模图案30时,获得二次电子信号波形33.因此,扫描中二进制的二次电子信号被依次包含在视频存储器25中。 视频信号处理电路24通过I / O总线28连续地读取已经通过CPU26进行二进制的对应的掩模图案设计数据,将所述数据与视频存储器25中的数据进行比较,并且检查它们 区别。 如果它们有差异,则其坐标和尺寸的数据被馈送到光束偏转控制电路22,并且通过用离子束12照射来校正缺陷部分31。