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    • 3. 发明专利
    • Life preserver
    • 救生圈
    • JPS5784293A
    • 1982-05-26
    • JP15933480
    • 1980-11-12
    • Mitsubishi Electric Corp
    • JITSU HIROSHIITOU KIYOYUKI
    • B63C9/20
    • PURPOSE: To improve reliablility of radar detection without deteriorating its flexibility by applying on electric wave reflective material at least one part of the member having air-tightness of the buoyant part.
      CONSTITUTION: Basic cloth to be the component member of life preserved is integrated by a fabric composed of warp and woof yarns 10. And, at least one part of warp and woof yarns 10 in the fabric is composed of metal family, metallic cord glass family or plastic family. In addition to it, coating is done by using electric wave reflective material coating material 11 which is rubber or plastic with content of more than 35 percent in weight of metallic particle, such as silver particle etc.
      COPYRIGHT: (C)1982,JPO&Japio
    • 目的:为了提高雷达检测的可靠性,而不会通过将电波反射材料应用于具有浮力部分的气密性的部件的至少一部分而使其灵活性变差。 构成:作为保存的组成成分的基本布被由经纱和纬纱10组成的织物整合在一起。织物中的经纱和纬纱10的至少一部分由金属系列,金属帘布玻璃系列 或塑料家庭。 除此之外,通过使用电波反射材料涂层11(其是金属颗粒例如银颗粒等)的重量百分比大于35%的橡胶或塑料来进行涂覆。
    • 5. 发明专利
    • EXPOSING MACHINE
    • JPS6340157A
    • 1988-02-20
    • JP18574886
    • 1986-08-06
    • MITSUBISHI ELECTRIC CORP
    • HOSHINO MASAHIROKOBAYASHI ISAOITOU KIYOYUKIARAI HITOSHI
    • H05K3/00G03F7/20
    • PURPOSE:To expose and harden the whole photosensitive resist film by reflecting an exposing liquid by the surface of a resist film formed on the surface of a through- hole of a printed circuit board which is formed a photosensitive resist film on the surface of a copper clad laminated plate and a through-hole, allowing an exposing light to reach the inside, and executing the exposure. CONSTITUTION:A light beam which arrives directly from a light source 4 and a light beam which is emitted from the light source 4 are reflected by a reflecting plate 5 once, and by using the light beam which is arrived, the surface of a hole such as a through-hole, etc., and the surface of the circuit board are exposed. Simultaneously, the light source 4 and the reflecting plate 5 are moved horizontally as indicated with an arrow, and the whole work of a printed circuit boards 1 is exposed. In the regard, the light source and the reflecting plate are moved so as to prevent the light beam going to intense only in a prescribed direction, and the light beam is scattered so as to attain a roughly uniform exposure quantity extending from '0' to a direction of 180 deg.C against the surface of the circuit board. The scattered light beam reaches the through-hole in the direction extending from '0' to 180 deg., therefore, the light beam is made incident at various angles into the through-hole 8, reflected and reaches the whole hole, and the exposure is executed.
    • 9. 发明专利
    • MANUFACTURE OF SEMICONDUCTOR ELEMENT
    • JPS6356918A
    • 1988-03-11
    • JP20205286
    • 1986-08-27
    • MITSUBISHI ELECTRIC CORP
    • OBARA MASANOBUITOU KIYOYUKIKOBAYASHI ISAOHOSHINO MASAHIRO
    • B05D5/12C25D13/00C25D13/20G03F7/16H01L21/027H01L21/30
    • PURPOSE:To coat the irregularities of the surface of a semiconductor substrate completely with a photosensitive resin uniformly without the loss of a material, and to apply the photosensitive resin precisely in arbitrary thickness by dipping the semiconductor substrate, on the surface of which a conductive film is formed, into the water-soluble photosensitive resin received in an electrolytic bath for electrodeposition coating and precipitating a photosensitive film through DC electrolysis. CONSTITUTION:When a photosensitive resist film is shaped onto the surface of a semiconductor substrate 3, a conductive film 15 is formed onto the surface of the semiconductor substrate 3, the semiconductor substrate 3 is dipped into an electrodeposition-coating water-soluble photosensitive resin 12 housed in an electrodeposition coating tank 11, and a photosensitive resist film is deposited through DC electrolysis. The semiconductor substrate 3, on the surface of which to be coated with a resin the conductive layer 15 such as a metallic layer in Al, Cu, etc., an ITO layer, etc. are shaped previously, is immersed into the electrodeposition- coating water-soluble photosensitive resin 12. DC voltage of approximately 200V is applied between the conductive layer 15 on the surface of the semiconductor substrate 3 and a cathode 13, thus electrodepositing the photosensitive resin dissolved or dispersed into the liquid 12 and charged at positive charges onto the surface of the conductive layer 15 on the surface of the semiconductor substrate 3.