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1. 发明专利

JP2007124500A Acoustic sensor and method for manufacturing acoustic sensor 有权
标题翻译：声学传感器及制造声学传感器的方法
公开(公告)号：JP2007124500A
公开(公告)日：2007-05-17
申请号：JP2005316594
申请日：2005-10-31
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： YOSHIDA KOICHI , YAMADA TORU , KOJIMA HIDEKI , MAKIHATA KATSUHIRO
IPC分类号： H04R19/04 , H04R1/02 , H04R31/00
CPC分类号： H01L24/97 , H01L2224/48091 , H01L2224/48137 , H01L2924/1306 , H01L2924/13062 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To improve spectacularly the manufacture efficiency of acoustic sensors and to realize a large-scale mass-production of high-quality acoustic sensors. SOLUTION: A metal can sealed package is constructed by mounting an electro-acoustic transducing element (ECM) 102 which is formed by a MEMS technique and an electronic circuit component 104 such as a JFET, a capacitor or the like on a circuit board 90 and fixing a metal cap 100 on the mounting surface of the circuit board 90 by solder reflowing. At the time of solder reflow process, the metal cap 100 is positioned by positioning holes provided in a metal tray and solder paste is supplied. After engaging the circuit board 90, collective reflow is performed and the circuit board 90 is individuated. The acoustic sensors are manufactured in this way. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提高声学传感器的制造效率，实现高质量声传感器的大规模生产。解决方案：通过将由MEMS技术形成的电声换能元件（ECM）102和诸如JFET，电容器等的电子电路部件104安装在电路上来构造金属罐密封封装通过焊料回流将金属盖100固定在电路板90的安装表面上。在回流焊工艺时，金属盖100通过设置在金属托盘中的孔定位，并且供给焊膏。在接合电路板90之后，进行集体回流并且电路板90被个体化。声学传感器以这种方式制造。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2006086311A Component mounting method and apparatus 审中-公开
标题翻译：组件安装方法和装置
公开(公告)号：JP2006086311A
公开(公告)日：2006-03-30
申请号：JP2004269067
申请日：2004-09-16
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： ISHITANI SHINJI , YOSHIDA KOICHI , AZUMA KAZUJI , SASAOKA TATSUO , SUZUKI NAOKI
IPC分类号： H01L21/60
CPC分类号： H01L2224/16
摘要： PROBLEM TO BE SOLVED: To provide a component mounting method and an apparatus capable of preventing a substrate and a component which have been cleaned from being contaminated, and capable of mounting the component while maintaining a clean state. SOLUTION: The component mounting method comprises a step (S1) of plasma-cleaning the substrate and electronic component in a vacuum chamber; a step (S2) of forming protective films on the surfaces of the plasma-cleaned substrate and electronic component without opening the inside of a vacuum chamber to the atmosphere; a recleaning step (S3) of irradiating ultraviolet rays (or electric beams or atmosphere plasmas) to the substrate and electronic component, which are formed with the protective films thereon, to remove the protective films; and a step (S4) of mounting the electronic component on the substrate of which protective film has been removed. With this configuration, the protective films prevent contaminants in the atmosphere from depositing on the cleaned surfaces of the substrate and electronic component, and the removal of the protective films immediately before the mounting enables bonding while maintaining each surface of the substrate and electronic component in a clean state. Thus, satisfactory bonding can be achieved. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够防止被清洁的基板和部件被污染并能够在保持清洁状态的同时安装部件的部件安装方法和装置。解决方案：部件安装方法包括在真空室中等离子体清洁基板和电子部件的步骤（S1）; 在等离子体清洁的基板和电子部件的表面上形成保护膜的步骤（S2），而不向大气中打开真空室的内部; 向其上形成有保护膜的基板和电子部件照射紫外线（或电子束或气氛等离子体）的清洗步骤（S3）以除去保护膜; 以及将电子部件安装在已经去除了保护膜的基板上的步骤（S4）。通过这种结构，保护膜防止大气中的污染物沉积在基板和电子部件的清洁表面上，并且在安装之前立即去除保护膜可以将基板和电子部件的每个表面保持在一个状态清洁状态。因此，可以实现令人满意的接合。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2004096087A Method and equipment for determining machining dimension of joint component 有权
公开(公告)号：JP2004096087A
公开(公告)日：2004-03-25
申请号：JP2003192147
申请日：2003-07-04
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： YAMAMOTO AKIHIRO , KOBAYASHI SAKAE , EGUCHI SHINZO , MURATA KAZUHIRO , YOSHIDA KOICHI
IPC分类号： G02F1/13 , G02F1/1345 , H01L21/60 , H05K1/02 , H05K3/32 , H05K3/36
CPC分类号： H05K3/361 , H01L2224/16225 , H05K1/0269 , H05K3/323 , H05K2203/162 , H05K2203/163
摘要： PROBLEM TO BE SOLVED: To provide equipment and a method for determining the dimension of a bonding film which bonds an object whose dimension changes by a temperature change under an environmental temperature different from a temperature at the time of use.
SOLUTION: A bonding method of a circuit electrode (2) is provided with a process (S404) for measuring the survey dimension of a bonding part of the circuit electrode (2) at a first temperature (T1), a process (S406) for comparing the survey dimension (Lm(T1)) of the bonding part with a design dimension (Lt(T1)) of the bonding part at the first temperature (T1), and a process (S408, S410) wherein the dimension (Nca) of a joint component (4) is determined on the basis of the compared result and the joint component (4) is arranged on a bonding part (8).
COPYRIGHT: (C)2004,JPO

4. 发明专利

JP2002069416A ADHESIVE FOR ELECTRONIC COMPONENT 失效
公开(公告)号：JP2002069416A
公开(公告)日：2002-03-08
申请号：JP2000263599
申请日：2000-08-31
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： YOSHIDA KOICHI , MIYAGAWA HIDEKI , AKIGUCHI NAOSHI , OTANI HIROYUKI
IPC分类号： C09J163/00 , C09J11/00 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To provide an adhesive capable of maintaining a form immediately after application, showing no change in physical properties due to partial progress of a curing reaction even in a high speed supply process, providing a stable volume and form of application, and having a good thermal curing properties and storage stability. SOLUTION: The adhesive for electronic component comprises a liquid epoxy resin, a microcapsule containing a curing agent for the epoxy resin, a hydrophobic spherical inorganic filler and a hydrophilic spherical inorganic filler.

5. 发明专利

JP2002026051A APPARATUS AND METHOD FOR FORMING BUMP, COMPUTER READABLE MEDIUM RECORDING PROGRAM FOR EXECUTING BUMP FORMING METHOD, AND SEMICONDUCTOR SUBSTRATE 失效
公开(公告)号：JP2002026051A
公开(公告)日：2002-01-25
申请号：JP2000202700
申请日：2000-07-04
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NARITA MASACHIKA , YOSHIDA KOICHI , IKETANI MASAHIKO , MAE TAKAHARU , KANAYAMA SHINJI
IPC分类号： H05K3/34 , B23K20/00 , H01L21/00 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide an apparatus and a method for forming a bump in which bonding state can be stabilized between the electrode part and the bump while enhancing the bonding strength as compared with a prior art, a computer readable recording medium, and a semiconductor substrate on which bumps are formed. SOLUTION: A preheater 160 is provided and before a bump 16 is formed at an electrode part 15, a semiconductor substrate 201 is subjected to temperature control for accelerating bonding of the electrode part and the bump at the time of forming the bump. Since metal particles at the electrode part can be changed into an appropriate state before a bump is formed, bonding state of the electrode part and the bump can be enhanced phenomenally.

6. 发明专利

JP2001127114A ELECTRONIC PARTS WITH BUMP, AND METHOD AND APPARATUS FOR BONDING THE SAME 失效
公开(公告)号：JP2001127114A
公开(公告)日：2001-05-11
申请号：JP30710199
申请日：1999-10-28
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： AZUMA KAZUJI , KANAYAMA SHINJI , WADA HIROSHI , YOSHIDA KOICHI , FUKUMOTO KENJI
IPC分类号： H01L21/60 , H01L21/607
摘要： PROBLEM TO BE SOLVED: To provide a method and an apparatus for bonding electronic parts with bump and electronic parts with bump which is designed to stabilize the bump with an electrode, by avoiding positional deviation of ultrasonic wave in the oscillating direction of the electronic parts with bump with respect to suction tool. SOLUTION: A chamfering portion 12a is formed in advance on the surface opposite to that forming a bump 20 of an IC chip 12, and the IC chip 12 is held by a suction tool 16 so as to bring the two opposing chamfering section 12a in the oscillating direction (b) of the ultrasonic wave into contact with the chamfering portion 16a of the suction tool 16. Therefore, positional deviation of the IC chip 12 can be prevented in the oscillating direction of the ultrasonic wave with respect to the suction tool 16. As a result, the IC chip 12 can securely follow the oscillation of the suction tool 16, and slip that the IC chip 12 cannot follow the oscillation of the suction tool 16 can be prevented, resulting in prevention of reduction of efficiency in transmitting the ultrasonic wave oscillation.

7. 发明专利

JPH11121491A BUMP BONDING EQUIPMENT 失效
公开(公告)号：JPH11121491A
公开(公告)日：1999-04-30
申请号：JP28242997
申请日：1997-10-16
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： YOSHIDA KOICHI , YAMAMOTO AKIHIRO , YONEZAWA TAKAHIRO , IMANISHI MAKOTO
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To shorten tact time, by simultaneously progressing and operating a carrying equipment of a plurality of semiconductor devices and a position regulating equipment which regulates, at the same time, a plurality of the semiconductor devices on a stage in which a plurality of mounting positions are arranged. SOLUTION: Two sucking collets 9a, 9b suck semiconductor devices in a supply tray and carry them above a stage 1. The sucking collet 9a which has mounted a semiconductor device 3a on a carrying-in position moves, waits in the vicinity of a carrying-out equipment, and is exclusively used as a carrying-out equipment. The whole of three regulating plate 2a-2c moves to the right and regulates the semiconductor device 3a at a bonding position where a bump is formed. The whole of three regulating plate 2a-2c moves to the left and mounts a semiconductor device 3b sucked with the other sucking collet 9b on the carrying-in position. The sucking collet 9b moves to the supply tray in order to suck the next semiconductor device, and is exclusively used as a carrying-in equipment. The two sucking collets 9a, 9b and the three regulating plate 2a-2c are operated with simultaneous progress.

8. 发明专利

JPH104095A APPARATUS AND METHOD FOR BUMP BONDING 失效
公开(公告)号：JPH104095A
公开(公告)日：1998-01-06
申请号：JP15574896
申请日：1996-06-17
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： IMANISHI MAKOTO , YAMAMOTO AKIHIRO , OTANI HIROYUKI , EGUCHI SHINZO , YONEZAWA TAKAHIRO , AZUMA KAZUJI , YOSHIDA KOICHI , HIROYA KOJI
IPC分类号： H01L21/321 , H01L21/60 , H01L21/607 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To improve the reliability of electronic components by preventing the damage and poor bonding of these components at regulating of them in a bump bonder. SOLUTION: The apparatus has an electronic component position regulator comprising a stage 1 for mounting and heating electronic components, rotatable correcting plate 2 having a side face for positioning the electronic component, plate 4 having a side face for positioning the device with the plate 2, and regulating spring 5 for exerting a regulating force on the plate 2 to press the plate 4 to the electronic device.

9. 发明专利

JPH06267798A MANUFACTURE OF CAPACITOR 失效
公开(公告)号：JPH06267798A
公开(公告)日：1994-09-22
申请号：JP5189993
申请日：1993-03-12
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KOJIMA TOSHIKUNI , KUDO YASUO , FUKUYAMA MASAO , YOSHIDA KOICHI
IPC分类号： H01G9/028 , H01G9/02
摘要： PURPOSE:To provide a capacitor which excels in the recovering ability of a dielectric coating film and is high in a working voltage by obtaining a conductive polymer with electrolytic polymerization using a specific electrolyte and using the conductive polymer for an electrode formed on the dielectric coating film. CONSTITUTION:A conductive polymer obtained from electrolytic polymerization using alkyl phosphoric acid ester and aromatic sulfonic acid salt or polyethylene oxide and aromatic sulfonic acid salt or alkyl phosphoric acid ester and phenol dielectric substance and aromatic sulfonic acid salt or an electrolyte containing at least either bridged type polyacrylic soda or aromatic sulfonic acid salt and polymerizable monomer is laninated on an electrode with manganese oxide layer 4 of a dielectric coating film 3 sequentially formed for counter electrodes. Thereby, a high breakdown strength capacitor which excels in the recovering ability of a dielectric coating film can be efficiently manufactured.

10. 发明专利

JPH06124858A CAPACITOR AND ITS MANUFACTURE 失效
公开(公告)号：JPH06124858A
公开(公告)日：1994-05-06
申请号：JP27399892
申请日：1992-10-13
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KUDO YASUO , FUKUYAMA MASAO , YOSHIDA KOICHI , KOJIMA TOSHIKUNI
IPC分类号： H01G9/04 , H01G9/012 , H01G9/032 , H01G9/14 , H01G9/05
摘要： PURPOSE:To provide a capacitor being excellent in capacitor characteristics and, above all, in frequency characteristics and the manufacture of the capacitor, which can be user on an AC circuit and on a circuit where the direction of voltage changes sometimes and in which a polarity need not be discriminated also at the time of mounting. CONSTITUTION:When foil-shaped or plate-shaped valve metal parts 2, in which electrolytes composed of dielectric film and conductive macromolecules are formed successively, are caused to correspond to each other and a plurality of adjacent valve metal parts 3, in which electrolyte layers are not formed, are located in two directions in no manner of overlapping with each other and laminated while having electric junction and respective electrode leads 8 are formed in the parts 3, in which the electrolyte layers are not formed, so that a capacitor is constituted, it is possible to obtain a non-polar solid electrolytic capacitor being excellent in frequency characteristics. Because manganese dioxide acting as intermediary for growing the conductive macromolecular film on the dielectric is formed by the reduction of permanganate, the damage of the dielectric film is small; and because the surface of the conductive macromolecules is cleaned by a surface active agent, the macromolecular film is prevented from separating from a graphite layer so that it is possible to obtain a capacitor being stable in characteristics.

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