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1. 发明专利

JP2007150365A Bump bonding device 有权
标题翻译： BUMP BONDING DEVICE
公开(公告)号：JP2007150365A
公开(公告)日：2007-06-14
申请号：JP2007059472
申请日：2007-03-09
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： NARITA MASACHIKA , IMANISHI MAKOTO , MAE TAKAHARU , KANAYAMA SHINJI
IPC分类号： H01L21/60
CPC分类号： H01L2224/45144 , H01L2224/78 , H01L2224/78301 , H01L2224/85 , H01L2224/85203 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01079 , H01L2224/48 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a bump bonding device enabling stable positional recognition by a recognizing camera without significant cost increase, and stable feeding of a bonding wire to a bonding operation mechanism.
SOLUTION: In the bump bonding device adapted to form a bump on a wafer on a bonding stage by a bonding head configured so that a bonging wire stored in a reel in wired state is fed to the bonding operation mechanism while being brown up in a bent state by air and supported in a floating state at a predetermined tension, by means of a wire tensioner, an earth bar for contacting with the bonding wire during being fed to earth the static electricity of the wire, is provided between the reel and the bonding operation mechanism.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够通过识别摄像机进行稳定的位置识别而不显着地增加成本并且将接合线稳定地馈送到接合操作机构的凸块接合装置。解决方案：在凸块接合装置中，适于通过接合头在接合台上在晶片上形成凸起，该接合头被构造成使得存储在有线状态的卷轴中的双绞线在被接合时被供给到接合操作机构处于空气的弯曲状态并以预定的张力以浮动状态被支撑，通过线张紧器，在被馈送到接地线之前与接合线接触的接地棒被设置在卷轴之间和接合操作机构。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2007110149A Bump joining device and method, and semiconductor component manufacturing device 有权
标题翻译： BUMP接合装置和方法以及半导体元件制造装置
公开(公告)号：JP2007110149A
公开(公告)日：2007-04-26
申请号：JP2006331337
申请日：2006-12-08
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： MINAMITANI SHOZO , AZUMA KAZUJI , TAKAHASHI KENJI , KANAYAMA SHINJI , WADA HIROSHI , TSUJISAWA TAKAFUMI
IPC分类号： H01L21/60 , H01L21/607
摘要： PROBLEM TO BE SOLVED: To provide a bump joining device and a bump joining method that can completely join a bump and an electrode part of a substrate with higher joining strength than before, and a semiconductor component manufacturing device.
SOLUTION: The bump joining device is equipped with a vibration generating device 9, a voice coil motor 121, and a controller 110 and vibrates the bump with an ultrasonic wave up to a joining completion contact area from when the bump is pressed against the electrode part of the circuit board to reach an initial contact area, so the bump is completely joined with the electrode part as compared with convention cases wherein the bump is vibrated from when the joining completion contact area is reached, so higher joining strength than before can be obtained.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种可以完全接合凸块和具有比以前更高的接合强度的基板的电极部分的凸块接合装置和凸块接合方法以及半导体部件制造装置。解决方案：凸块接合装置配备有振动产生装置9，音圈电动机121和控制器110，并且从凸块被压靠时到达接合完成接触区域的超声波振动。电路板的电极部分达到初始接触面积，因此与达到接合完成接触面积时凸起振动的常规情况相比，凸块与电极部分完全接合，因此比以前更高的接合强度可以获得。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2005236230A Component mounting apparatus and method of driving the same 有权
标题翻译：组件安装装置及其驱动方法
公开(公告)号：JP2005236230A
公开(公告)日：2005-09-02
申请号：JP2004046984
申请日：2004-02-23
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： ONOBORI SHUNJI , SHIDA SATOSHI , HIRATA SHUICHI , KANAYAMA SHINJI
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide a component mounting apparatus capable of easily changing the coating quantity and the coating pattern of the bonding material for the mounting. SOLUTION: The component mounting apparatus is furnished with a vertically movable head 210 for mounting a component, a vertically movable dispenser 220 which is connected to a cylinder 230 and applies the bonding material to a substrate, and the cylinder 230 for pushing the dispenser 220 downward. The head 210 has a first stopper 211, while the dispenser 220 has a second stopper 221 which touches the first stopper by pushing the dispenser 220 with a prescribed force by the cylinder 230. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够容易地改变用于安装的接合材料的涂布量和涂布图案的部件安装装置。
解决方案：部件安装装置配备有用于安装部件的可垂直移动的头部210，连接到圆筒230并将接合材料施加到基底的可垂直移动的分配器220，以及用于推动分配器220向下。头部210具有第一止动件211，而分配器220具有第二止动件221，第二止动件221通过由缸230以规定的力推动分配器220而接触第一止动件。（C）2005，JPO＆NCIPI

4. 发明专利

JP2004336071A Part mounting tool and method and device of mounting part using the same 审中-公开
公开(公告)号：JP2004336071A
公开(公告)日：2004-11-25
申请号：JP2004205052
申请日：2004-07-12
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： MINAMITANI SHOZO , KANAYAMA SHINJI , UENO YASUHARU , SHIDA SATOSHI
IPC分类号： H01L21/60
CPC分类号： H01L24/75 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/14 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To prevent a fault caused by slipping from occurring between a mounting tool and a part when ultrasonic bonding is performed on an area between metal junctions each formed on the part and an object to be mounted. SOLUTION: An adsorbing surface 14a which absorbs the part at an adsorbing nozzle 14 is formed of a resin material 14b. The part 3 is adsorbed to the adsorbing surface 14a, the metal junction section 5 of the part and the metal junction section 6 of the object 4 to be mounted are contacted and are pressurized together, an ultrasonic oscillation is applied to the adsorbing nozzle 14 from a horn 17, an area between the metal junction sections 5, 6 are bonded with an oscillating friction. Since the hardness of the resin material 14b is low and the adsorbing surface 14a is formed to be a rough surface, a frictional force to the part 3 becomes big, slipping with the part 3 is suppressed, and the oscillation is efficiently transmitted to the part, a stable bonding can be conducted. COPYRIGHT: (C)2005,JPO&NCIPI

5. 发明专利

JP2003282645A Parts mounting method and unit thereof 有权
标题翻译：部件安装方法及其单元
公开(公告)号：JP2003282645A
公开(公告)日：2003-10-03
申请号：JP2002087596
申请日：2002-03-27
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： MINAMITANI SHOZO , MAE TAKAHARU , UENO YASUHARU , YAMADA AKIRA , KANAYAMA SHINJI
IPC分类号： B23K20/10 , B23K101/36 , H01L21/60 , H01L21/607
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a part mounting method and unit thereof which accurately perform ultrasonic junction with high reliability even when a junction area between a part and a mounting subject is wide.
SOLUTION: The unit comprises a parts supply means, a mounting head that holds a supplied part to mount it one the mounting subject, a support stage that fixes/supports the mounting subject, and a means that relatively moves the mounting heat and the support stage to align the part and the mounting subject. The mounting head 5 includes an ultrasonic vibration generating means 16; a resonant body 27 where one end face is connected to the ultrasonic vibration generating means 26, the other end face is an operating surface 30, vibration input to the one end face becomes vibration approximately parallel with the surface at the operating surface 30, and a node 31 of resonant mode is formed on an axis core perpendicular to the operating surface 30; and a loading means that applies pressing load to the node of resonant body 27.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：即使当部件和安装对象之间的接合区域较宽时，也提供了一种即使在高可靠性下精确地执行超声波接合的部件安装方法和单元。解决方案：该装置包括一个零件供应装置，一个安装头，该安装头固定一个安装对象的供给部件，一个固定/支撑安装对象的支撑台，以及相对移动安装热量的装置，对准零件和安装主体的支撑台。安装头5包括超声波振动发生装置16; 一个端面连接到超声波振动发生装置26的共振体27，另一个端面是操作表面30，输入到一个端面的振动变得与操作表面30的表面大致平行，并且谐振模式的节点31形成在垂直于操作表面30的轴芯上; 以及对共振体27的节点施加按压负载的装载装置。（C）2004，JPO

6. 发明专利

JP2003017534A Component mounting tool, and component mounting method and apparatus using the same 有权
标题翻译：组件安装工具及组件安装方法及其使用方法
公开(公告)号：JP2003017534A
公开(公告)日：2003-01-17
申请号：JP2002183304
申请日：2002-06-24
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： AZUMA KAZUJI , MINAMITANI SHOZO , KANAYAMA SHINJI , TAKAHASHI KENJI
IPC分类号： H01L21/60 , H01L21/607
CPC分类号： H01L24/75 , H01L24/81 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/14 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To continue the connection of a component by regenerating an chucking surface in short time while holding the component by means of this chucking surface, whose abrasion resistance is improved without lowering vibration characteristics of a component mounting tool, and performing mounting with the ultrasonic connection between metal joints.
SOLUTION: While pressurizing the component 3 that is chucked to the chucking surface 14a, which is made to have a prescribed surface roughness for friction bonding using ultrasonic vibration, of a chucking nozzle 14 to an object to be mounted 4 with mutual metal joints opposite to each other, by applying ultrasonic vibration to the chucking nozzle 14, the metal joints are rubbed and bonded using ultrasonic wave, and the component is mounted. While repeating this mounting, the chucking surface 14a is cleaned by applying ultrasonic vibration to the chucking nozzle 14 in the state to be immersed in a cleaning liquid 112, and thus a regenerating process to regenerate the chucking surface 14a in the prescribed surface roughness is performed and the recycling process is performed after having polished the chucking surface 14a. Thus, the purpose of the invention is achieved.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了通过在短时间内再生卡盘表面来持续部件的连接，同时通过该卡盘表面保持部件，其耐磨性得到改善而不降低部件安装工具的振动特性，并且执行安装金属接头之间的超声波连接。解决方案：将夹紧喷嘴14的夹紧表面14a的组件3加压到具有规定的用于超声波振动的摩擦接合的表面粗糙度的同时，将相对于与通过对夹紧喷嘴14施加超声波振动，使用超声波摩擦接合金属接头，安装该部件。在重复该安装的同时，通过在浸没在清洗液112中的状态下对夹持喷嘴14施加超声波振动来清洁卡盘表面14a，从而进行以规定的表面粗糙度再生夹持面14a的再生处理在对夹紧面14a进行研磨后进行回收处理。因此，实现了本发明的目的。

7. 发明专利

JP2002176295A PART MOUNTING DEVICE 失效
公开(公告)号：JP2002176295A
公开(公告)日：2002-06-21
申请号：JP2000370124
申请日：2000-12-05
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： UENO YASUHARU , MINAMITANI SHOZO , SHIDA SATOSHI , KANAYAMA SHINJI , SAKAI ICHIJI
IPC分类号： H05K13/04 , H01L21/60 , H05K13/08
摘要： PROBLEM TO BE SOLVED: To provide a part mounting device wherein a reflecting part is provided for precision mounting of a part. SOLUTION: There are provided a part recognizing means 5 which recognizes the image on a part supply head 4 side, a substrate recognizing means 12 which recognizes the sight field in the direction opposite to the part recognizing means 5 to recognize the image on a substrate 7 side, and a reflecting part 11 which reflects an incident optical flux to project it in the direction opposite to the incident direction. The board recognizing means 12 recognizes an image on the part supply head 4 side through the reflecting part 11. The reflecting part 11 allows both the part recognizing means 5 and the board recognizing means 12 to recognize the same reference point on the part supply head 4. So, the dislocation amount of the part recognizing means 5 and the board recognizing means 12 is precisely calculated. With the calculated data used, the correction amount of a part 2 and the board 7 in a production process is precisely calculated.

8. 发明专利

JP2002158246A METHOD AND APPARATUS FOR FORMING BUMP ONTO SEMICONDUCTOR WAFER 失效
公开(公告)号：JP2002158246A
公开(公告)日：2002-05-31
申请号：JP2000354448
申请日：2000-11-21
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NARITA MASACHIKA , IKETANI MASAHIKO , TSUBOI YASUTAKA , MAE TAKAHARU , KANAYAMA SHINJI
IPC分类号： G06T1/00 , B23K20/00 , H01L21/00 , H01L21/60 , H01L23/544
摘要： PROBLEM TO BE SOLVED: To provide a method and an apparatus for forming bumps on a semiconductor wafer whereby the productivity of the semiconductor wafer when forming the bumps is improved in comparison with a conventional case. SOLUTION: In the method and the apparatus, a bump forming head 190, a recognizing apparatus 150, and a controller 180 are provided. Further, ICs formed on a semiconductor wafer are so divided into basic blocks 230 as to perform continuously the formations of bumps to the ICs included in one basic block and perform the positional recognition of one of the remaining basic blocks only when sifting the bump forming operation from the one basic block to one of the remaining basic blocks. AS a result, the times of the positional recognitions can be cut down largely and the productivity of the semiconductor wafer can be improved, in comparison with the conventional case wherein the operation of the positional recognition of each IC is performed whenever forming bumps in each IC.

9. 发明专利

JPH11330119A BUMP BONDING DEVICE 失效
公开(公告)号：JPH11330119A
公开(公告)日：1999-11-30
申请号：JP12793398
申请日：1998-05-11
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NARITA MASACHIKA , IMANISHI MAKOTO , MAE TAKAHARU , KANAYAMA SHINJI
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To obtain a bump bonding device capable of stably recognizing a position by a recognition camera, without sharply increasing cost and capable of stably feeding a bonding wire to a bonding work mechanism. SOLUTION: In this bump bonding device, a camera unit 40 provided with a recognition camera 24 capable of recognizing the position of an IC chip to be bonded, and a lens barrel for the camera 24 forms bumps on a wafer loaded on a bonding stage 10 by a bonding head 11 arranged on the upper part of the bonding work mechanism. In this case, the camera 24 is fixed on the upper part of a base material of the head 11, and the lens barrel is arranged coaxially on the front side of the camera 24 with the camera 24 and fixed on the base member by plural points, consisting of a point near to a base end part connected to the camera 24 and a prescribed point ahead of the nearby point.

10. 发明专利

JPH1126994A ELECTRONIC COMPONENT MOUNTING EQUIPMENT 失效
公开(公告)号：JPH1126994A
公开(公告)日：1999-01-29
申请号：JP17873497
申请日：1997-07-04
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NASU HIROSHI , KANAYAMA SHINJI , TAKAHASHI KENJI , MATSUMURA SHINYA , KIYOMURA HIROYUKI
IPC分类号： B23P19/04 , B23P21/00 , H05K13/04
摘要： PROBLEM TO BE SOLVED: To enable automatic fine adjustment in parallelism in the Z axis direction, by controlling parallelism of the lower surface of a suction nozzle which is detachable from the upper surface of a mounting stage, at a mounting position, by using a piezoelectric element. SOLUTION: A parallelism measuring apparatus 6 of a noncontact system is fixed to an adjusting tool fixing part 1B of a suction nozzle retaining part 1, or to a suction nozzle fixing part 1C. By using the measuring apparatus 6, pallalelism of the upper surface 5a of a mounting stage 5 is measured. On the basis of the measured data, a lower part position 1E is finely moved by the piezoelectric element 3, setting a shoulder part 1D as a reference point. Thereby, when deviation of parallelism is generated between the lower surface 4a of a suction nozzle and the upper surface 5a of the suction stage 5, as the result of exchange of kinds of the suction nozzle 4, parallelism can be corrected without interrupting production.

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