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1. 发明专利

JP2008168517A Mold device for injection molding 审中-公开
标题翻译：注塑成型模具
公开(公告)号：JP2008168517A
公开(公告)日：2008-07-24
申请号：JP2007004162
申请日：2007-01-12
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： UEDA SATOSHI , KITAGAWA TOMOKAZU
IPC分类号： B29C45/26 , B29C45/33 , B29L11/00
摘要： PROBLEM TO BE SOLVED: To provide a mold for injection molding which can easily and highly precisely adjust the position of at least one mold of the combined mold combining a plurality of molds with a simple constitution.
SOLUTION: A mold device comprises a combined mold 19 constituted by combining a plurality of molds 16, 17, 18, an outer frame 22 which has a constant clearance 21 with the outside surface of the combined mold 19 and is provided so as to enclose the surrounding, a support body 23 which is provided in the clearance 21 and elastically supports the outside surface of the combined mold, and a position adjusting mechanism 24 for moving the combined mold 19 by pressing the outside surface. The position adjusting mechanism 24 is composed of a pressing block 25 for pressing the outside surface of the combined mold and an adjustment means 26 for moving the pressing block 25. While one side of the pressing block 25 is moved along the inside surface of the outer frame and the other side is abutted on the outside surface of the combined mold 19 at a constant angle, the combined mold 19 is moved in the approximately orthogonal direction to the moving direction by moving with the adjustment means 26 to adjust the position.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种注射成型用模具，其能够以简单的结构容易且高精度地调整组合模具的至少一个模具的结合多个模具的位置。解决方案：模具装置包括组合的模具19，其通过将多个模具16,17,18组合，外框架22与组合模具19的外表面具有恒定的间隙21并被设置为围绕着周围，设置在间隙21内的支撑体23，弹性地支撑组合模具的外表面，以及位置调整机构24，通过按压外表面移动组合的模具19。位置调整机构24由用于挤压组合模具的外表面的压块25和用于移动压块25的调节装置26组成。当按压块25的一侧沿外侧的内表面移动时框架，另一侧以一定的角度抵接在组合模具19的外表面上，组合的模具19通过与调节装置26一起移动以调节位置，在与移动方向大致正交的方向上移动。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2007335755A Substrate treatment equipment and method for treating substrate 审中-公开
标题翻译：基板处理设备和处理基板的方法
公开(公告)号：JP2007335755A
公开(公告)日：2007-12-27
申请号：JP2006167869
申请日：2006-06-16
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： NAKAJIMA TAMAKI , UEDA SATOSHI , ITO YOSHINORI
IPC分类号： H01L21/31 , C23C16/455 , H01L21/3065
摘要： PROBLEM TO BE SOLVED: To provide substrate treatment equipment and a method for treating a substrate which can carry out the treatment of the substrate uniformly over the substrate surface.
SOLUTION: In a treatment chamber 11 to carry out the substrate treatment, a substrate support 12 is provided on which a substrate 13 is laid. In the upper portion of the treatment chamber 11 facing the substrate support 12, a shower head 14 is arranged. The shower head 14 has a hollow portion 23 inside, and at the same time, has a gas diffusion plate 22 in which a plurality of gas jet nozzles 24 are formed on the surface facing the substrate 13 which is laid on the substrate support 12. Between a gas supply means and the shower head 14, a gas mixer 20 is provided which supplies gas from a gas supply as a treated gas 21 to the shower head 14. The space between the gas mixer 20 and the hollow portion 23 of the shower head 14 is connected by a plurality of gas supply paths 15.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供基板处理设备和用于处理能够在基板表面上均匀地进行基板处理的基板的方法。解决方案：在用于执行基板处理的处理室11中，设置有基板支撑件12，基板13被放置在基板支撑件12上。在处理室11的面向衬底支撑件12的上部，布置有淋浴喷头14。喷淋头14在内部具有中空部23，同时具有气体扩散板22，在与基板13相对的面上形成有多个气体喷射喷嘴24，气体喷射喷嘴24被放置在基板支撑体12上。在气体供给装置和喷淋头14之间，设置有气体混合器20，其将气体作为处理气体21供给到喷淋头14.气体混合器20与淋浴器的中空部23之间的空间头部14通过多个气体供给路径15连接。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2005303095A Method of manufacturing semiconductor device 审中-公开
标题翻译：制造半导体器件的方法
公开(公告)号：JP2005303095A
公开(公告)日：2005-10-27
申请号：JP2004118447
申请日：2004-04-14
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： UNO AKIHITO , UEDA SATOSHI
IPC分类号： H01L21/3065 , H01L21/768 , H01L21/8242 , H01L23/522 , H01L27/108
摘要： PROBLEM TO BE SOLVED: To form a contact hole normally by preventing slitting when an oxide film etc., is deposited in an inversely tapered recess of a semiconductor device.
SOLUTION: A method for manufacturing a semiconductor device includes a stage of forming out of the film on the substrate 1 the recess 31 whose side wall is inversely tapered, a stage of depositing a 1st insulating film 15 and further a 2nd insulating film 16 on the substrate 1 having the recess 31, and a stage of forming a through hole 18 penetrating the 2nd and 1st insulating film in a region of the recess 31. The stage of depositing the 2nd insulating film 16 comprises a step of depositing the 2nd insulating film 16 while etching the 1st insulating film 15 deposited on an upper corner of the recess 31 and/or the 2nd insulating film 16 being deposited in 1st sputter etching mode, and a step of depositing the 2nd insulating film 16 while etching the 2nd insulating film 16 in 2nd sputter etching mode slower in etching speed than the 1st etching mode.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：当在半导体器件的倒锥形凹部中沉积氧化膜等时，通常通过防止切割来形成接触孔。解决方案：一种用于制造半导体器件的方法，包括：在基板1上形成侧壁为倒锥形的凹部31，沉积第一绝缘膜15以及第二绝缘膜的阶段在具有凹部31的基板1上形成有贯通第2绝缘膜和第1绝缘膜的通孔18的阶段。沉积第二绝缘膜16的阶段包括以下步骤：绝缘膜16，同时蚀刻沉积在以第一溅射蚀刻模式沉积的凹部31和/或第二绝缘膜16的上角上的第一绝缘膜15，以及沉积第二绝缘膜16同时蚀刻第二绝缘体第二溅射蚀刻模式中的薄膜16的蚀刻速度比第一蚀刻模式慢。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2003078295A Lead-terminal cutting device for electronic component 有权
标题翻译：电子元件的终端切割装置
公开(公告)号：JP2003078295A
公开(公告)日：2003-03-14
申请号：JP2001270118
申请日：2001-09-06
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： UEDA SATOSHI , ITO KATSUMI
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To increase the operability of a lead-terminal cutting device for various electronic components. SOLUTION: The lead-terminal cutting device is provided with a base 1 and a sliding body 4 which is slid on the base 1 to the Y-direction after being slid to the X-direction, or which is slid to the X-direction after being slid to the X-direction. Slitlike openings 3c, 3d, 6c, 6d in the X-direction and slitlike openings 3a, 3b, 6a, 6b in the Y-direction are formed in the base 1 and the sliding body 4 in parts in which they are faced.
摘要翻译：要解决的问题：提高各种电子部件的引线端子切断装置的可操作性。解决方案：引线端子切割装置设置有基座1和滑动体4，滑动体4在滑动到X方向之后在基座1上向Y方向滑动，或者在经过X方向滑动到X方向后滑动到X方向滑向X方向。在X方向上的狭缝状开口3c，3d，6c，6d和Y方向上的狭缝状开口3a，3b，6a，6b在基部1和滑动体4中形成在它们所面对的部分中。

5. 发明专利

JPH10296787A INSERT RESIN MOLDING DEVICE 失效
公开(公告)号：JPH10296787A
公开(公告)日：1998-11-10
申请号：JP10700797
申请日：1997-04-24
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： UEDA SATOSHI , KITAGAWA TOMOKAZU , TONO HIROAKI
IPC分类号： B29C45/26 , B29C45/02 , B29C45/14 , B29K101/10 , B29L31/34 , H01L21/56
摘要： PROBLEM TO BE SOLVED: To provide an insert resin molding device that can reduce burrs on a molded product, improve sink marks, chipping and warping and stabilize the size of a molded piece, thickness dimension and molded resin density. SOLUTION: This device comprises a top force 3 that is vertically movable, a bottom force 4 provided with a cavity portion 6 confronting the top force 3 and adapted to be freely vertically moved so as to form a shape of a desired molded piece and a frame 14, and a plunger 7 disposed in the cavity portion 6 so as to form a bottom of the cavity portion 6 and adapted to be slidingly inserted into the bottom force 4, and additionally comprises an overflow portion 8 provided in the vicinity of the cavity portion 6 to receive therein excessive molding resin and a movable plunger 9 for compressing the excessive molding resin so received, whereby a metallic terminal 1 having a connecting terminal 15 and a resin sheet 5 are integrally molded.

6. 发明专利

JPH0897050A MOLDED COIL PART 失效
公开(公告)号：JPH0897050A
公开(公告)日：1996-04-12
申请号：JP22954094
申请日：1994-09-26
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： UEDA SATOSHI , TAKAHASHI KAZUO
IPC分类号： H01F27/32
摘要： PURPOSE: To provide a resin-molded coil part which is applicable to various electronic equipments, and smaller in size, more excellent in characteristics, safety, reliability, and performance, and lower in heat release value than a non-molded conventional one. CONSTITUTION: A coil is wound around a bobbin provided with flanges at both ends, and an iron core is inserted into a center hole of the bobbin, which is sealed up in a thermosetting molding resin 17 for the formation of a coil part. A gate 16 is provided at a position along a flow of resin so as not to make a flow of resin both come into direct contact and form a right angle with the bobbin, whereby problems such as the distortion of the bobbin and the like are solved.

7. 发明专利

JPH0786053A COIL COMPONENT 失效
公开(公告)号：JPH0786053A
公开(公告)日：1995-03-31
申请号：JP22704293
申请日：1993-09-13
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： MORI KAZUSA , UEDA SATOSHI , UMEHARA SATOSHI
IPC分类号： H01F27/245
摘要： PURPOSE:To provide a coil component, which embodies a low-leakage magnetic flux, prevents the generation of beats due to core mis-alignment at the time of assembly of cores and is superior in characteristics and quality. CONSTITUTION:A coil component is constituted of an I-shaped laminated core 9 formed by laminating and mounting alternately I-shaped cores 8, which respectively have a triangular form part formed within the width of the same core on one side and a triangular form part 7 of a size exceeding the width of the core on the other side as central magnetic legs which are incorporated in the central parts of coil bobbins 6, one sheet by one sheet or several sheets by several sheets from both sides thereof, C-shaped laminated cores 15 formed by a method, wherein one pair of C-shaped cores 14 having tapered surfaces 12 and 13 to coincide with tapered surfaces 10 and 11 of the triangular form part on one side of the triangular form parts at both ends of the core 9 as magnetic legs on both sides of the component are laminated alternately one sheet by one sheet or several sheets by several sheet and are made to coincide with each other, and the coil bobbins 6.

8. 发明专利

JPH06275450A COIL PART 失效
公开(公告)号：JPH06275450A
公开(公告)日：1994-09-30
申请号：JP5994093
申请日：1993-03-19
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： MORI ICHISUKE , UEDA SATOSHI , UMEHARA SATOSHI
IPC分类号： H01F27/245 , H01F27/28 , H01F30/00 , H01F31/00
摘要： PURPOSE:To provide a coil part such as a transformer excelling in electrical characteristics and economy, which realizes miniaturization, low dissipation, high efficiency, and low leakage flux. CONSTITUTION:Take (a) as the width of a magnetic leg on both sides of an I-shaped laminate core 8 having a triangular section with tapered surfaces 7 on both ends on both sides as a central magnetic leg to be build in the center of a wiring 6 and a pair of a C-shaped laminate core 10 having tapered surfaces 9 which fit tapered surfaces 7 of the triangular section of the I-shaped laminate core 16 for both ends as the magnetic leg on both sides. Then, through a construction of an I-shaped laminate core 19 having a radius of a/50 to a/5 and a taper in an inside corner 11 and a wiring 6, a coil part excelling in electrical characteristics and economy can be realized.

9. 发明专利

JPH06275445A COIL COMPONENT 失效
公开(公告)号：JPH06275445A
公开(公告)日：1994-09-30
申请号：JP6369493
申请日：1993-03-23
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： UEDA SATOSHI , UMEHARA SATOSHI
IPC分类号： H01F27/245 , H01F30/00 , H01F31/00
摘要： PURPOSE:To reduce the size and to increase a reliability by building each iron core block by a method wherein a projecting fitting piece is squeezed out somewhere outside an effective magnetic path width on one face of each of I-shaped block iron core and C-shaped block iron cores and the fitting piece of each laminate iron core is fit in with a recessed section of the fitting piece of an adjacent laminate iron core. CONSTITUTION:In an iron core which is made by welding an I-shaped laminate iron core 6 and a C-shaped laminate iron core 9, fitting pieces 13 are squeezed out at one or more places outside an effective magnetic path width on one face of each of I-shaped laminated iron core blocks 15 and C-shaped laminate iron core blocks 17. In the I-shaped laminate iron core block 15, the fitting pieces are formed along the central line in the width direction. In the C-shaped laminate iron core block 17, the fitting pieces are formed at corners. The fitting pieces 13 of one laminate iron core are fit in with recessed sections 14 of the fitting pieces 13 of adjacent laminate iron cores to build the iron core block. By this method, a small-size coil component is obtained which has an excellent temperature rise characteristic, a high reliability and a good productivity.

10. 发明专利

JPH06254524A METHOD AND DEVICE FOR SWEEPING PIPELINE 失效
公开(公告)号：JPH06254524A
公开(公告)日：1994-09-13
申请号：JP4422193
申请日：1993-03-05
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： UEDA SATOSHI , YANO KOSAKU , SUGIYAMA TATSUO
IPC分类号： B08B9/053 , B08B9/04
摘要： PURPOSE:To eliminate the need for the large-scale overhaul and maintenance of an exhaust gas pipeline and to facilitate maintenance in sweeping the pipeline. CONSTITUTION:The sweeping ball 6 is forced into an exhaust gas pipeline 3 by a compressor 1 connected to the pipeline 3 to drop the deposit 11 in the pipeline 3, and the deposit is recovered in a recovery part 8. The recovery part 8 is connected to an exhaust gas treating device with a filter 10 in between, and the deposit 11 in the pipeline 3 is trapped. Meanwhile, the recovery part 8 is detachable, and the deposit 11 is taken out along with the ball 6.

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