专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2007335910A Part-mounting apparatus, and controlling method for part-mounting head interference avoidance 有权
标题翻译：部分安装设备和部分安装干扰避免的控制方法
公开(公告)号：JP2007335910A
公开(公告)日：2007-12-27
申请号：JP2007243345
申请日：2007-09-20
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： YAZAWA TAKASHI , SHIMIZU NOBUE , KAWASE TAKEYUKI , UCHIYAMA HIROSHI , YOSHIDA NORIAKI
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide a part-mounting apparatus and a controlling method to avoid interference of part-mounting heads which is lower in cost and higher in part-mounting efficiency than conventional one. SOLUTION: The apparatus includes a controller 181 which controls movement of part-mounting heads 131 and 132 and an interference area 211 where two or more part-mounting heads can interfere each other is specified so that movement of the part-mounting heads can be controlled to avoid interference of the heads. Since it can avoid collision only with the controlling method, it can provide a part-mounting equipment which is lower in cost than conventional one and since it can move each head asynchronously, it can increase part-mounting efficiency. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种部件安装装置和控制方法，以避免部件安装头的干扰，成本低，部件安装效率高于常规部件安装头。解决方案：该装置包括控制部件安装头131和132的运动的控制器181以及其中两个或多个部件安装头彼此相互干涉的干涉区域211，使得部件安装头可以控制，以避免头部的干扰。由于只能通过控制方法避免碰撞，因此可以提供成本低于常规的部件安装设备，由于可以异步移动每个磁头，可以提高部件安装效率。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2007065303A Cleaning device for substrate terminal 有权
标题翻译：基板端子清洁装置
公开(公告)号：JP2007065303A
公开(公告)日：2007-03-15
申请号：JP2005251469
申请日：2005-08-31
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： MIYAZAKI HIROKUNI , WATANABE MASAYA , NISHIMOTO TOMOTAKA , UCHIYAMA HIROSHI , WATANABE NOBUHISA
IPC分类号： G09F9/00 , G02F1/13
摘要： PROBLEM TO BE SOLVED: To achieve reliable and high-accuracy cleaning on a substrate panel for a display device, the substrate having a display part and a terminal part formed in at least one side in the periphery of the display part, by cleaning the surface of the terminal part close to the boundary with the display part. SOLUTION: The cleaning process includes: a cleaning preparation process of sliding and moving a cleaning body over the surface of the terminal part while pushing the cleaning body apart from to a step portion of the terminal part apart and bringing the end portion of the cleaning body into contact with the step portion; and a main cleaning process of sliding and moving the cleaning body in the longitudinal direction while pushing the cleaning body in contact with the step portion to the terminal part to clean the terminal part. These cleaning preparation process and the main cleaning process are continuously carried out by controlling to change pressure force added to a cleaning head in such a manner that the cleaning body is pushed by a first pressure force in the cleaning preparation process and that the cleaning body is pushed in the main cleaning process by a second pressure force greater than the first pressure force. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了在用于显示装置的基板面板上实现可靠和高精度的清洁，该基板具有显示部分和形成在显示部分的周边的至少一侧的端子部分，通过清洁靠近显示部分边界的端子部分的表面。解决方案：清洁过程包括：清洁制备过程，其将清洁体滑动并移动到端子部分的表面上，同时将清洁体分离到端子部分的台阶部分并使其端部所述清洁体与所述台阶部分接触; 以及将清洁体沿纵向方向滑动并移动的主要清洁处理，同时将与台阶部分接触的清洁体推向端子部分以清洁端子部分。这些清洗准备处理和主要清洁处理通过控制以改变添加到清洁头的压力的方式连续进行，使得清洁体在清洁制备过程中被第一压力推动，并且清洁体是通过大于第一压力的第二压力推动主清洁过程。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2003243893A DETECTING METHOD AND DEVICE THEREOF, AND PART MOUNTING DEVICE 审中-公开
公开(公告)号：JP2003243893A
公开(公告)日：2003-08-29
申请号：JP2002041601
申请日：2002-02-19
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KAWASE TAKEYUKI , YAZAWA TAKASHI , SHIMIZU NOBUE , UCHIYAMA HIROSHI
IPC分类号： G01B11/00 , H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide a detecting method and device thereof and a part mounting device in which two tapes of optical sensors were needed to reduce to one, thereby reducing costs, and a sensor setting switch provided in the device is not needed to operate directly by an operator. SOLUTION: In a detecting method, an amount of reflected light when lights are irradiated on a position to be detected is detected by an optical sensor 53, and it is determined that an object to be detected is present or absent according to this detected result. A positive logic and a negative logic are switched by luminosity on a surface to be detected which has been previously registered to be detected by the one optical sensor 53. In the positive logic, when the reflected lights have a given amount of lights, an output of the optical sensor 53 is turned on. In the negative logic, when the reflected lights have less than a given amount of lights, the output of the optical sensor 53 is turned on. COPYRIGHT: (C)2003,JPO

4. 发明专利

JP2003101297A METHOD FOR CORRECTING OFFSET IN ELECTRONIC COMPONENT MOUNTER 审中-公开
公开(公告)号：JP2003101297A
公开(公告)日：2003-04-04
申请号：JP2001288684
申请日：2001-09-21
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： ODA YOSHIHIKO , MIMURA NAOTO , UCHIYAMA HIROSHI
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide a method for correcting offset of the coordinate of origin of mechanical operation and the origin of coordinate of image recognition in an electronic component mounter. SOLUTION: When an electronic component is mounted by setting a circuit board through mounting operation for detecting positional shift, positional shift of the mounted electronic component from a specified position is detected. When a mounting head 20 is moved by a distance corresponding to the positional shift, movement of the mounting head 20 is measured by means of an X-axis encoder 13 and a Y-axis encoder 14 and the origin of coordinate of image recognition is corrected based on that movement.

5. 发明专利

JP2001358498A METHOD AND APPARATUS FOR MOUNTING COMPONENT 失效
公开(公告)号：JP2001358498A
公开(公告)日：2001-12-26
申请号：JP2000179837
申请日：2000-06-15
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： SHIMIZU NOBUE , KAWASE TAKEYUKI , UCHIYAMA HIROSHI , YOSHIDA NORIAKI
IPC分类号： B25J15/00 , H05K13/02 , H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide a method and an apparatus for the mounting of a component wherein a plurality of components can be simultaneously sucked and mounted even when the structure of a mounting head is changed, and even when the number and the shape of the components to be fed are changed. SOLUTION: In the method and the apparatus for the mounting of the component, one or the plurality of components are fed to an intermediate component feed body from a component feed part 1, the components on the feed body are sucked and held by one or a plurality of suction nozzles 11 which are installed on the mounting head 10 and the components are mounted on a board. An intermittent feed conveyor 8 is used for the feed body. An operation which feeds the components to the conveyor 8 by a transfer head is combined with the movement operation of the conveyor 8, and the arrangement state of the components on the conveyor 8 is made variable.

6. 发明专利

JPH11289197A MOUNTING UNIT AND ITS POSITIONING METHOD 失效
公开(公告)号：JPH11289197A
公开(公告)日：1999-10-19
申请号：JP8978598
申请日：1998-04-02
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： ODA YOSHIHIKO , UCHIYAMA HIROSHI , NAKANO TOMOYUKI
IPC分类号： G01B11/00 , G05D3/12 , H05K13/04
摘要： PROBLEM TO BE SOLVED: To position a movable part accurately without being affected by mechanical factors. SOLUTION: This mounting unit is constituted to drive a movable part, such as a mounting head 4 by a motor 5 and detect the position of the movable part 4 by an encoder 6 so as to control the position thereof. It is provided with laser measurement equipment 9a and 9b to detect the position of the movable part 4. Then, in the state where the movable part 4 is positioned, its position is measured actually by the laser measuring devices 9a and 9b so as to correct the deviation.

7. 发明专利

JPH10150300A ELECTRONIC COMPONENT RECOGNITION SYSTEM 失效
公开(公告)号：JPH10150300A
公开(公告)日：1998-06-02
申请号：JP30906796
申请日：1996-11-20
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： YAZAWA TAKASHI , MIMURA NAOTO , UCHIYAMA HIROSHI
IPC分类号： G01B11/24 , G01B11/245 , H05K13/08
摘要： PROBLEM TO BE SOLVED: To make a plurality of cameras having different resolving powers applicable to both reflection.recognition mode and trnasmission.recognition mode thereby coping with the parts in extensive kinds by a method wherein an illumination part is free liftingly provided on the plurality of part recognition cameras having different resolving powers to be commonly used. SOLUTION: For example, the first part recognition camera 1 is selected as for the camera having pertinent resolving power so that a head driving part 16 may shift a part sucking head 4 onto the first part recognition camera 1. Next, an illumination driving part 15 receiving the signal from a main controller 14 shifts an illumination part 7 to the first recognition camera 1 to light an LED 8. Next, the picture image from the first recognition camera 1 is stored in a picture image memory 12 through an A/D converter 1 and after the part recognition is performed, the compensation counting of the part sucking position is performed by a CPU 13. In such a constitution, the illumination part 7 can be shifted within the shifting range 9 so that either one camera 1, 2, 3 may perform the reflection.recognition.

8. 发明专利

JP2007234967A Component bonding method and component bonding device 有权
标题翻译：组件连接方法和组件连接装置
公开(公告)号：JP2007234967A
公开(公告)日：2007-09-13
申请号：JP2006056524
申请日：2006-03-02
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： TSUJIKAWA TOSHIHIKO , UCHIYAMA HIROSHI , YAMADA AKIRA , IWAHASHI TAKASHI
IPC分类号： H05K3/32 , G02F1/1345 , H01L21/60 , H05K3/36
CPC分类号： H01L24/75 , H01L2924/07811 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a component bonding device and a component bonding method that can greatly improve the yield of a flat panel on which a bonded component is mounted. SOLUTION: The component bonding device includes a pressing part 102 and a backup stage 103 for bonding a panel electrode of the flat panel 100b and a component electrode of the component 100a to be bonded with an anisotropic conductive adhesive 100c, a bonding recognition section 106 which is disposed between the panel electrode and component electrode while they are being bonded to image conductive particles having deformed owing to the bonding, and a control section 200 which changes bonding conditions of bonding based upon an imaging result of the conductive particles having deformed during the bonding. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够大大提高安装有粘接部件的平板的成品率的部件接合装置和部件接合方法。＆lt; P＆gt;解决方案：部件接合装置包括用于将平板100b的面板电极和要与各向异性导电粘合剂100c接合的部件100a的部件电极接合的按压部102和备用台103，截面106，它们被配置在面板电极和部件电极之间，同时它们被粘合成图像由于接合而变形的导电颗粒;以及控制部分200，其基于具有变形的导电颗粒的成像结果而改变接合条件在粘合期间。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2007019139A Feedback correction method and unit, part mounting method and device, and part mounting system 有权
标题翻译：反馈校正方法和单元，部件安装方法和装置以及部件安装系统
公开(公告)号：JP2007019139A
公开(公告)日：2007-01-25
申请号：JP2005197217
申请日：2005-07-06
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： NISHIMOTO TOMOTAKA , OKADA YASUHIRO , UCHIYAMA HIROSHI , TSUJIKAWA MASATOMO , WATANABE NOBUHISA
IPC分类号： H05K13/04 , H05K13/08
摘要： PROBLEM TO BE SOLVED: To provide a feedback correction method which is capable of displaying the correction effect of feedback in the minimum production number of pieces in a part mounting process of mounting electronic parts on the side edges of a liquid crystal panel. SOLUTION: A feedback correction unit 100 reads out from a deviation inspection unit F the inspection result of a deviation volume as a position difference between the center point of an electronic part and the center point of a mounting target position, and the feedback volume of the electronic part whose deviation volume is checked when it is mounted on a board. Furthermore, the feedback correction unit 100 is equipped with a calculation unit 101 calculating the feedback volume of a board that is manufactured next, a memory unit 102 storing parameters used in a temporary crimping operation, and a control unit 103 carrying out a mounting position correcting operation etc of the electronic part on the basis of a feedback volume for a temporary crimping unit C based on a calculation result from the calculation unit 101. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种反馈校正方法，其能够在将电子部件安装在液晶面板的侧边缘上的部件安装处理中以最小生产数量显示反馈的校正效果。解决方案：反馈校正单元100从偏差检查单元F读出偏差量的检查结果作为电子部件的中心点与安装目标位置的中心点之间的位置差，以及反馈当安装在电路板上时检查其偏差体积的电子部件的体积。此外，反馈校正单元100配备有计算单元101，其计算下一个制造的单元的反馈量，存储单元102存储临时压接操作中使用的参数，以及控制单元103，执行安装位置校正基于来自计算单元101的计算结果，基于临时压接单元C的反馈量的电子部件的操作等。（C）2007，JPO＆INPIT

10. 发明专利

JP2005086151A Component mounting device and tool replacement method thereof 审中-公开
标题翻译：组件安装设备及其替代方法
公开(公告)号：JP2005086151A
公开(公告)日：2005-03-31
申请号：JP2003319608
申请日：2003-09-11
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： UCHIYAMA HIROSHI , YAZAWA TAKASHI , SHIMIZU NOBUE , OBARA HIROSHI , MIMURA NAOTO
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To shorten setup time by replacing tools with great ease while avoiding mistakes. SOLUTION: An operation head 21 is provided, which comprises mounting heads 23 for holding a component 19 by means of mounted tools and mounting the component 19 on a circuit board 15. A tool station, in which a plurality of tools are arranged in a predetermined arrangement pattern, is detachably mounted on a tool replacing device. A control unit is provided, which compares the arrangement pattern of the tools before replacement and the arrangement pattern of the tools after replacement in the tool station upon switching to mounting onto a different kind of circuit board 15. The arrangement patterns are stored in memory. Then, the control unit drives the mounting heads 23 to change the arrangement pattern of the tools before replacement to the arrangement pattern after replacement. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：通过轻松替换工具来缩短安装时间，同时避免错误。解决方案：提供操作头21，其包括用于通过安装的工具保持部件19的安装头23，并将部件19安装在电路板15上。一种工具站，其中布置有多个工具以预定布置图案可拆卸地安装在工具更换装置上。提供了一种控制单元，其将切换到安装到不同种类的电路板15上之后，更换之后的工具的布置图案和更换后的工具的布置图案进行比较。将布置图案存储在存储器中。然后，控制单元驱动安装头23，以便在更换之后将工具的布置图案更换为布置图案。版权所有（C）2005，JPO＆NCIPI

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式