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1. 发明专利

JP2004071975A Apparatus and method for quality detection of component holding member, and apparatus and method for mounting electronic component 有权
标题翻译：组件保持构件的质量检测装置和方法，以及用于安装电子元件的装置和方法
公开(公告)号：JP2004071975A
公开(公告)日：2004-03-04
申请号：JP2002231811
申请日：2002-08-08
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KAWASE TAKEYUKI , YOSHITAKE TAKANORI , SANO KIMIAKI , HATTORI YOSHIYUKI , KINOU TOSHIYUKI , YAZAWA TAKASHI , UCHIYAMA HIROSHI
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide an apparatus and method for quality detection of a component holding member which detects the component holding member having an adverse effect on correct component recognition, and to provide an apparatus and method for mounting components provided with the apparatus for goodness/badness detection of the component holding member. SOLUTION: An illuminator 120, a CCD camera 106 and a controller 150 are provided so as to determine the quality of an adsorption nozzle based on luminance on the component holding face 140 of the adsorption nozzle 201. Thus, it is possible to detect the adsorption nozzle where the optical reflectance of the component holding face is raised to the degree of having an adverse effect on the precise recognition of an electronic component 312 held by the adsorption nozzle. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种用于检测对正确的部件识别具有不利影响的部件保持部件的部件保持部件的质量检测装置和方法，并且提供一种装置和方法，用于零件保持构件的良好/不良检测的装置。解决方案：提供照明器120，CCD照相机106和控制器150，以便基于吸附喷嘴201的部件保持面140上的亮度来确定吸附喷嘴的质量。因此，可以检测部件保持面的光反射率升高到对由吸附喷嘴保持的电子部件312的精确识别产生不良影响的吸附喷嘴。版权所有（C）2004，JPO

2. 发明专利

JPH11289189A METHOD AND DEVICE FOR MOUNTING PARTS 失效
公开(公告)号：JPH11289189A
公开(公告)日：1999-10-19
申请号：JP9304598
申请日：1998-04-06
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： UCHIYAMA HIROSHI , OGATA HIROSHI , YAZAWA TAKASHI , ODA YOSHIHIKO
IPC分类号： B23P21/00 , H05K13/02
摘要： PROBLEM TO BE SOLVED: To make parts mounting work to be conducted continuously without stopping a parts mounting device even when out-of-parts occurs, by additionally providing a process of replenishing the parts by moving the parts supplying section of the parts to a parts exchanging position, when the parts supplying section is out of the parts in a process of mounting desired parts. SOLUTION: Supplied parts are arranged in the zones Z1-Z40 of supply blocks L and R which constitute two cassette parts supplying sections 2 and the parts are successively mounted on a substrate 11 from those in the zone Z1. When some of the parts are sucked, the remaining number of the parts is checked and, when remaining parts exist, the remaining parts are successively mounted on the substrate 11 after the sucked parts are mounted on the substrate 11 as they are. When, for example, out-of-parts occurs in the zone Z10, the out-of- parts is informed by skipping the zone Z10 without mounting the parts in the zones Z11-Z20, and the parts block L is moved to a parts exchanging position by means of a parts exchanging position moving means 10. Simultaneously, parts supply is started from the parts in the zones Z21-Z40 of the parts block R.

3. 发明专利

JPH1140996A COMPONENT MOUNTING DEVICE AND METHOD FOR CALIBRATING ITS RECOGNIZED POSITION 失效
公开(公告)号：JPH1140996A
公开(公告)日：1999-02-12
申请号：JP18882497
申请日：1997-07-15
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： UCHIYAMA HIROSHI , YAZAWA TAKASHI , NAKANO TOMOYUKI , KODERA KOJI
IPC分类号： B23P19/00 , H05K13/04 , H05K13/08
摘要： PROBLEM TO BE SOLVED: To provide a component mounting device that accurately measures an offset and a scale of a board recognition camera of the component mounting device, even on the way to an actual production stage. SOLUTION: A jig unit 13 for calibrating an offset and a scale or the like is fitted to a component recognition camera 9, an offset measurement hole and a scale measurement hole, through which the component recognition camera 9 and a board recognition camera 10 recognize the shape of a component are made to the jig unit 13, the component recognition camera 9 and the board recognition camera 10 photograph respective the offset measurement hole of the jig unit 13 to recognize a deviation of the board recognition camera 10, with respect to the components recognition camera 9. Thus, the position of the board recognition camera 10 is calculated based on the deviation, a difference between a center position and the hole in the sight of the board recognition camera 10, and position information through a head section 5 for calculating the offset of the board recognition camera 10 with respect to a reference position.

4. 发明专利

JPH10202436A ELECTRONIC PART MOUNTING METHOD 失效
公开(公告)号：JPH10202436A
公开(公告)日：1998-08-04
申请号：JP729397
申请日：1997-01-20
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KIDO KAZUO , NARISEI KAZUHIKO , OBARA HIROSHI , YAZAWA TAKASHI
IPC分类号： B23P19/00 , H05K13/04
摘要： PROBLEM TO BE SOLVED: To shorten a mounting cycle time by simultaneously carrying out correcting computation and XY movement of a relative position of an electronic part and an electronic circuit board and simultaneously carrying out corrective motion and nozzle working at the time of mounting. SOLUTION: An XY moving mechanism 22 moves a head part 20 to a fetching position of an electronic part moved by a part transfer part. The electronic part is fetched by a nozzle vertical mechanism 18 and moved to a position to pick up a picture image of the electronic part held by a suction and mounting nozzle 17 by a part recognition camera, and thereafter, the picture image of the electronic part held by the suction and mounting nozzle 17 is taken up. The head part 20 is XY moved to the neighbourhood of an installation position simultaneously when the installation position is correctively computed from this picture image information, and the part is installed on an electronic circuit board 14 by lowering the suction and mounting nozzle 17 simultaneously when it is correctively moved in accordance with corrective computation.

5. 发明专利

JP2008078365A Mounting method and mounting device for led chip, and substrate with mounted led chip 有权
标题翻译：用于LED芯片的安装方法和安装设备以及带有安装的LED芯片的基板
公开(公告)号：JP2008078365A
公开(公告)日：2008-04-03
申请号：JP2006255511
申请日：2006-09-21
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： HATTORI YOSHIYUKI , IMAFUKU SHIGEKI , YAZAWA TAKASHI
IPC分类号： H05K13/04 , H01L21/50 , H01L33/48
摘要： PROBLEM TO BE SOLVED: To provide a mounting method and a mounting device for an LED chip which can reduce influence of dispersion in luminance for each product of the LED chip on uniformity of a light emission amount of a substrate as a whole in a substrate with a mounted LED chip wherein the same kind of an LED chip is mounted in lattice-like arrangement, and to provide a substrate with a mounted LED chip. SOLUTION: Each chip is sucked and held at once by a plurality of suction nozzles in a first combination of each suction nozzle and a component supply cassette 3 from a plurality of component supply cassettes 3. After each of the chips is mounted in one line of a mounting position in lattice-like arrangement, each chip sucked at once by a second combination which is different from the first combination is mounted in a line adjacent to the line, thus preventing chips supplied from the same component supply cassette 3 from being adjacent each other in lattice-like arrangement. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种LED芯片的安装方法和安装装置，其可以降低LED芯片的每个产品的亮度的色散的影响，从而整体上基板的发光量的均匀性具有安装的LED芯片的基板，其中相同种类的LED芯片以格子状布置安装，并为基板提供安装的LED芯片。解决方案：每个芯片通过多个吸嘴在多个抽吸嘴和多个部件供应盒3的组件供应盒3的第一组合中一次吸入并保持。在每个芯片安装在一排安装位置呈格子状布置，通过与第一组合不同的第二组合立即吸入的每个芯片安装在与线相邻的线中，从而防止从同一部件供应盒3提供的芯片从以格子状布置彼此相邻。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2006261345A Part mounting head and part mounting apparatus employing the same 有权
标题翻译：部件安装头和安装部件安装设备
公开(公告)号：JP2006261345A
公开(公告)日：2006-09-28
申请号：JP2005075922
申请日：2005-03-16
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： MAENISHI YASUHIRO , YAZAWA TAKASHI , SHIMIZU NOBUE , AYUSAWA KATSUSHI , NISHIKAWA NOBORU , YAMAMOTO HIROKI
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide a part mounting head capable of shortening a mounting time without increasing a part mounting machine in size, and a part mounting apparatus employing the same. SOLUTION: A first and second rotating head units 105a and 105b each have a plurality of suction nozzles 112 capable of rotatably moving and picking up parts 120 from a plurality of tape feeders 102 by the suction nozzles 112 and mount the parts on a substrate 104. In the head units, the suction nozzles 112 are arranged along a rotationally moving direction A of the suction nozzles 112 so as to draw a predetermined shape in a rotational surface including the rotationally moving direction A and a direction B of arrangement of the tape feeders 102, and the predetermined shape is a shape having a length in a direction parallel to the arrangement direction B shorter than a length in a direction perpendicular to the arrangement direction B. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够缩短安装时间而不增加部件安装机的尺寸的部件安装头以及使用其的部件安装装置。解决方案：第一和第二旋转头单元105a和105b各自具有多个吸嘴112，其能够通过吸嘴112可旋转地移动和从多个带式馈送器102拾取部件120并将部件安装在在头部单元中，吸嘴112沿着吸嘴112的旋转移动方向A布置，以便在包括旋转方向A和旋转方向A的布置方向B上的预定形状带式馈送器102，并且预定形状是在平行于布置方向B的方向上的长度比垂直于布置方向B的方向上的长度短的形状。（C）2006，JPO和NCIPI

7. 发明专利

JP2006135159A Apparatus and method for sucking and detecting component, and apparatus and method for mounting component 审中-公开
标题翻译：用于取消和检测组件的装置和方法，以及用于安装组件的装置和方法
公开(公告)号：JP2006135159A
公开(公告)日：2006-05-25
申请号：JP2004323690
申请日：2004-11-08
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： HATTORI YOSHIYUKI , IMAFUKU SHIGEKI , YAZAWA TAKASHI
IPC分类号： H05K13/04 , H05K13/08
摘要： PROBLEM TO BE SOLVED: To provide a detecting apparatus/method always capable of detecting the dropping-off of a component from a nozzle, the fetching of the component by the nozzle, and the clogging of the nozzle; and to provide a component mounting apparatus/method provided with the detecting apparatus/method. SOLUTION: The detecting apparatus 60 for measuring the light quantity incident into the nozzle from the suction hole 7 of the nozzle 1 is provided in the nozzle holder 43 of a component mounting head 53. The detecting apparatus 60 comprises a detecting unit 61 for detecting incident light, a measuring unit 62 for measuring the detected light quantity, a storage unit 63 for providing data input beforehand, and a judging unit 64 for judging based on the measured result from the measuring unit 62 and the data from the storage unit 63. When the component 10 is sucked by the nozzle 1, the component 10 blocks the suction hole 7 to reduce the incident light quantity. Conversely, when the component 10 is not sucked, the suction hole 7 is opened to increase the light quantity. These light quantities are measured and compared with various threshold values to detect the dropping-off of the component, the fetching of the component, and the clogging of the nozzle with high precision. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种总是能够检测来自喷嘴的部件脱落，由喷嘴取出部件和喷嘴堵塞的检测装置/方法; 并提供具有检测装置/方法的部件安装装置/方法。解决方案：用于测量从喷嘴1的吸入孔7入射到喷嘴中的光量的检测装置60设置在部件安装头53的喷嘴保持器43中。检测装置60包括检测单元61 用于检测入射光，用于测量检测光量的测量单元62，用于提供预先输入数据的存储单元63，以及用于基于来自测量单元62的测量结果和来自存储单元的数据进行判断的判断单元64 当部件10被喷嘴1吸入时，部件10阻挡吸入孔7以减少入射光量。相反，当零件10未被吸入时，抽吸孔7打开以增加光量。测量这些光量并与各种阈值进行比较，以高精度检测部件的脱落，部件的取出和喷嘴的堵塞。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2003243889A ELECTRONIC PART MOUNTING DEVICE AND METHOD THEREFOR 审中-公开
公开(公告)号：JP2003243889A
公开(公告)日：2003-08-29
申请号：JP2002043258
申请日：2002-02-20
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KAWASE TAKEYUKI , SHIMIZU NOBUE , YAZAWA TAKASHI , UCHIYAMA HIROSHI , YOSHIDA NORIAKI
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide an electronic part mounting device and method therefor capable of raising productivity of a board even when a defective part holding member occurs to carry out its exchange operation. SOLUTION: There are provided a part mounting head 121, an exchange station 161, and a controller 181, and it is determined whether or not a sub- pattern which coincides with a main pattern in a part holding member 122 is present in a placement of an exchange part holding member 162. Thus, when it is determined that the sub-pattern is present and an exchange frequency of the part holding member is decreased more than in the prior art, all the part holding members formed as the main pattern can be exchanged with the exchange part holding member formed as the sub-pattern, and productivity can be raised. COPYRIGHT: (C)2003,JPO

9. 发明专利

JP2003101293A OPERATING METHOD OF MOUNTING HEAD IN MOUNTER AND MOUNTER 审中-公开
公开(公告)号：JP2003101293A
公开(公告)日：2003-04-04
申请号：JP2001285990
申请日：2001-09-20
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： SHIMIZU JUNKEI , KAWASE TAKEYUKI , YAZAWA TAKASHI , UCHIYAMA HIROSHI , YOSHIDA NORIAKI
IPC分类号： B25J15/00 , H05K13/04
摘要： PROBLEM TO BE SOLVED: To enhance productivity by mounting an electronic component accurately. SOLUTION: At the time of mounting an electronic component P through a plurality of processes by urging the lowering shafts 34 among a plurality of elevating/lowering shafts 34, each having a suction nozzle 21 capable of holding the electronic component, downward through a head selection cylinder 37 and lowering the suction nozzle 21 through the elevating/lowering shaft 34 by lowering a working member 33 through a lowering regulation drive means 44, the urging load being applied onto the elevating/lowering shaft 34 is reduced by reducing the air drive pressure being fed to each head selection cylinder 37 in a process where the number of lowering suction nozzles 21 is high. Consequently, the electronic component P of the suction nozzle can be prevented from inclining due to application of a large load onto the elevating/lowering shaft 34.

10. 发明专利

JP2001007591A ELECTRONIC COMPONENT MOUNTING APPARATUS AND METHOD OF FEEDING ELECTRONIC COMPONENT USED THEREFOR 失效
公开(公告)号：JP2001007591A
公开(公告)日：2001-01-12
申请号：JP17387099
申请日：1999-06-21
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： OGATA HIROSHI , OBARA HIROSHI , UCHIYAMA HIROSHI , YAZAWA TAKASHI
IPC分类号： H05K13/02
摘要： PROBLEM TO BE SOLVED: To allow component sets to be replaced more safely and easily by a worker for making each component set capable of being slidably mounted and removed and improving the feed efficiency of electronic components. SOLUTION: In a feeding method, an operation controller requests data concerning feed positions of a component feeder which houses electronic components memorized in a data memory (step S31), the data memory transmits data about the feed positions to the operation controller (S32), the controller sends signals to component cassette designated terminals, corresponding to component cassettes attached to the component feeder and designates component cassettes which house electronic components to be mounted (S33). It further sends signals to feed operation terminals, corresponding to the component cassettes to feed required components for the component cassettes. This step is repeated so as to successively feed the electronic components to be mounted (S34).

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