专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JPH02222313A COMB LINE FILTER 失效
公开(公告)号：JPH02222313A
公开(公告)日：1990-09-05
申请号：JP4374589
申请日：1989-02-23
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： SHINGU YUJI , HAYAKAWA DAISHIRO , KAWAYAMA MASARU , YAMAGUCHI MASAYOSHI , KUZUKAWA RYOICHI
IPC分类号： H03H9/36
摘要： PURPOSE:To make a function element of a circuit board trimmable so that a filter characteristic comes to an optimum value in a state that the constraint of an ultrasonic delay medium is not varied by containing the ultrasonic delay medium in the lower case, and thereafter, loading the circuit board on a stepped part of the lower case. CONSTITUTION:A cushioning material 12 and an ultrasonic delay medium 1 are contained in the lower case 11, and thereafter, a circuit board 13a for constituting a comb line filter circuit is placed on a stepped part 11a of the lower case 11, and a lead wire 5 of the ultrasonic delay medium 1 is soldered to a pattern 13b. In such a way, since the circuit board is placed on the stepped part, even if the upper case is installed, it does not occur that the ultrasonic delay medium is pressed by the circuit board. Accordingly, the comb line filter comes to a state that the constraint of the uptrasonic delay medium is not varied, and in such a state, a function element on the circuit board is brought to trimming so that a comb line filter characteristic becomes an optimum value, therefore, the comb line filter whose characteristic is excellent can be obtained.

2. 发明专利

JPH11135924A ELECTRONIC COMPONENT PACKAGE 失效
公开(公告)号：JPH11135924A
公开(公告)日：1999-05-21
申请号：JP30149397
申请日：1997-11-04
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KUZUKAWA RYOICHI , KATOU HISAYOSHI
IPC分类号： H05K3/28
摘要： PROBLEM TO BE SOLVED: To prevent a thermal trouble from occurring to a housing which covers a fuse element. SOLUTION: An electronic part package is composed of a wiring board 5 mounted with a plurality of electronic components, a fuse element 2 interposed between a first and a second electrode 6 and 7, provided an the wiring board 5, and a resin housing 13 which covers the electrodes 6 and 7, the fuse element 2, and the electronic components, wherein a ceramic plate 9 is interposed between the fuse element 2 and the housing 13 which covers the top side of the fuse element 2.

3. 发明专利

JPH0878621A INTEGRATED CIRCUIT DEVICE 失效
公开(公告)号：JPH0878621A
公开(公告)日：1996-03-22
申请号：JP16721295
申请日：1995-07-03
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： ANPO TAKEO , IWATA MASAO , MATSUNAGA HAYASHI , KUZUKAWA RYOICHI , SUEHIRO YOSHIKAZU , YOKOTA YASUHIKO
IPC分类号： H01L25/10 , H01L25/18
摘要： PURPOSE: To provide an integrated circuit device with excellent heat radiating ability used for commercial equipment including electronic, electric, communication and measuring control equipment. CONSTITUTION: A power supply 4 and a plurality of grouped pin terminals 5 are mounted on a metal substrate, mounted parts comprising a cache controller 10, a cache memory 11, a data buffer LSI14, a CPU chip 8 and a connector 12 are placed on a multi-layer circuit wiring board 7, and the rear surface of the multi-layer circuit wiring board 7 having the mounted parts on the front surface through the grouped pin terminals is attached to metal substrate 1 having the power supply 4, thereby enhancing the degree of integration and providing the integrated circuit device having excellent heat radiation ability for heat generating parts.

4. 发明专利

JPH07263863A THICK FILM MULTILAYER SUBSTRATE 失效
公开(公告)号：JPH07263863A
公开(公告)日：1995-10-13
申请号：JP5395394
申请日：1994-03-24
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KUZUKAWA RYOICHI , IBATA AKIHIKO , YURI TAKAO
IPC分类号： H05K3/46
摘要： PURPOSE:To relax the stress between a multilayer insulator and a substrate and at the same time improve the mechanical strength of the substrate by forming a wiring layer with upper and lower layers and providing a separation recessed part for separating a wiring layer only at the upper layer of the wiring layer. CONSTITUTION:A separation recessed part 5 is provided for relaxing the stress on baking due to the difference in the expansion coefficient between a substrate 1 and an insulator 2. In the insulator 2 formed by multilayer printing, the separation recessed part 5 for separating a wiring layer 7 is provided at an upper-layer part A which is located above the second insulation layer no separation recessed part 5 exists at a lower-layer part B which is equal to or less than the second insulation layer and then an internal conductor 3 and the insulator 2 are provided. With the configuration, since the separation recessed part 5 is provided only at the upper-layer part A of the wiring layer 7, the stress due to the difference in the expansion coefficient between the substrate 1 and the insulator 2 can be absorbed by the separation recessed part 5 regardless of the repeated baking, thus preventing the internal conductor 3 and the insulator 2 from being cracked and warped. Also, no separation recessed part 5 exists at the lower-layer part B of the wiring layer 7 and mechanical strength can also be improved.

5. 发明专利

JPH07194100A OUTPUT SWITCH DEVICE FOR DC-DC CONVERTER BOOSTER 失效
公开(公告)号：JPH07194100A
公开(公告)日：1995-07-28
申请号：JP33584693
申请日：1993-12-28
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KUZUKAWA RYOICHI , HASHIMOTO TOSHIO , YURI TAKAO
IPC分类号： G05F1/56 , H02M3/155
摘要： PURPOSE:To protect a circuit from short-circuiting a load, in an output switch device for a DC-DC converter. CONSTITUTION:Here is provided a switch device wherein a switching control means 7 for on/off switching an output is provided between a DC-DC converter booster 19 and a load 16 and turned off by detecting a stop of operating the DC-DC converter booster 19 so as to protect a circuit total unit against its short-circuiting when the load 16 is short-circuited.

6. 发明专利

JPH02222315A COMB LINE FILTER 失效
公开(公告)号：JPH02222315A
公开(公告)日：1990-09-05
申请号：JP4375389
申请日：1989-02-23
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： SHINGU YUJI , HAYAKAWA DAISHIRO , KAWAYAMA MASARU , YAMAGUCHI MASAYOSHI , KUZUKAWA RYOICHI
IPC分类号： H03H9/36
摘要： PURPOSE:To eliminate a failure due to short circuiting caused by a lead wire by providing a pattern on a comb line filter circuit board part corresponding to a leading-in part of the lead wire of an ultrasonic delay medium, and soldering these leading-in part and pattern. CONSTITUTION:In a comb line filter circuit board 11 of almost the same in shape as an ultrasonic delay medium 1, a lead wire soldering use pattern 11a is provided on a part corresponding to a leading-in part of a lead wire 5 of the ultrasonic delay medium 1, and a terminal 11b is provided on the side. In the lower containing case 12, a cushioning material 13, the ultrasonic delay medium 1 and the comb line filter circuit board 11 are contained, a lead wire 5 is soldered to the pattern 11a, and thereafter, it is assembled by covering it with the upper containing case 14. In such a way, it does not occur that the lead wire is drawn around to the comb line filter circuit board from the ultrasonic delay medium, and it does not occur that each lead wire comes into contact with each other, or the lead wire comes into contact with an electrode of pattern chip parts.

7. 发明专利

JPH01273394A MICROCIRCUIT DEVICE 失效
公开(公告)号：JPH01273394A
公开(公告)日：1989-11-01
申请号：JP10132988
申请日：1988-04-26
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KUZUKAWA RYOICHI
IPC分类号： H05K7/20 , H01L23/34 , H05K7/14
摘要： PURPOSE:To transmit the heat radiation of a heating element directly over a metallic case, and to improve the effect of heat dissipation of the heating element largely by using one part of the metallic case housing a substrate, to which a mounting part is arranged, as a heat dissipating section and fast sticking the mounting part requiring heat dissipation on the substrate to the heat dissipating section. CONSTITUTION:One part of a metallic case 1 housing a substrate 4, to which a mounting part is disposed, is employed as a heat dissipating section 2, and the mounting part requiring heat dissipation on the substrate is fast stuck to the heat dissipating section 2, thus constituting a microcircuit device. The substrate 4 to which the mounting part is mounted and the metallic case 1 are held and fixed by the heat dissipating section 2 of the metallic case and support sections 7, 8. Consequently, heat from a heating element 3 can be radiated directly to the metallic case by the heat dissipating section 2 of the metallic case 1 as an adhesive section with the heating element 3, thus improving the effect of heat dissipation. The mounting substrate can be sustained and fastened simply and positively by the spring effect of the heat dissipating section 2 of the metallic case 1 and the substrate support sections.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式