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1. 发明专利

JP2005072938A Surface acoustic wave filter 有权
标题翻译：表面声波滤波器
公开(公告)号：JP2005072938A
公开(公告)日：2005-03-17
申请号：JP2003299585
申请日：2003-08-25
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KUSHITANI HIROSHI , NAKATANI SHINOBU , ANPO TAKEO
IPC分类号： H03H9/05 , H03H9/10 , H03H9/64 , H03H9/72
CPC分类号： H03H9/0576
摘要： PROBLEM TO BE SOLVED: To improve the filter characteristics of a surface acoustic wave filter.
SOLUTION: At least one transmission line 6-10 connected to a surface acoustic wave element 16 at one end and to a first ground electrode 4 at the other end is sectioned by a transmission line 11 connected to the ground electrode 4 at intervals of the wavelength of an operating frequency or lower, i.e., the ground is inserted between a plurality of transmission lines each connected to the surface acoustic wave element at one end and to the ground at the other end, thereby enough isolating terminals from each other to improve the filter characteristics.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提高表面声波滤波器的滤波器特性。解决方案：连接到一端的表面声波元件16和另一端连接到第一接地电极4的至少一个传输线6-10被间隔地连接到接地电极4的传输线11分段工作频率或更低的工作频率的波长，即接地被插入到在一端连接到表面声波元件的多个传输线和另一端连接到地面的多个传输线之间，从而足够地将端子彼此隔离到提高过滤特性。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2004282432A Digital broadcast receiving device 审中-公开
公开(公告)号：JP2004282432A
公开(公告)日：2004-10-07
申请号：JP2003071400
申请日：2003-03-17
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： OZEKI HIROAKI , KATO HISAYA , KAGEYAMA TEIJI , ANPO TAKEO
IPC分类号： H04B1/16 , H04B7/08 , H04B7/10 , H04H20/28 , H04H40/18 , H04N5/44
CPC分类号： H04B7/10 , H04B7/0802 , H04B7/0814 , H04H20/28 , H04H40/18 , H04H60/11
摘要： PROBLEM TO BE SOLVED: To provide a digital broadcast receiving device capable of stable reception in which images and voices are not interrupted even if used for mobile use.
SOLUTION: There is provided a digital broadcast receiving device including a receiving circuit 142 for receiving high frequency signals that are transmitted through time division multiplexing of a plurality of programs. Due to a configuration equipped with a circuit for selecting the good condition of a receiving property during a period that no desired program is received, the good condition of a receiving property is selected during the period that the desired program is received, so that the desired receiving program can be received with high performance and besides no property is changed during the period when the desired program is received and therefore no signal is interrupted.
COPYRIGHT: (C)2005,JPO&NCIPI

3. 发明专利

JP2004104394A High frequency switch 审中-公开
公开(公告)号：JP2004104394A
公开(公告)日：2004-04-02
申请号：JP2002262415
申请日：2002-09-09
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KUSHITANI HIROSHI , NAGATA KOJI , ANPO TAKEO
IPC分类号： H01P1/15 , H03K17/693 , H04B1/44
CPC分类号： H01P1/15 , H03K17/693
摘要： PROBLEM TO BE SOLVED: To provide a high frequency switch mainly used for an RF circuit of a mobile phone and particularly proper to a composite tendency.
SOLUTION: The high frequency switch particularly employing FET switches 3, 6 is configured to locate a strip line 5, whose electric length is equivalent to a 1/4 wavelength of a high frequency signal received from a transmission port 2, between an input output port 1 and the second FET switch 6 whose one end is connected between the input output port 1 and a reception port 4 and whose other end is connected to ground.
COPYRIGHT: (C)2004,JPO

4. 发明专利

JP2001351945A METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2001351945A
公开(公告)日：2001-12-21
申请号：JP2000167264
申请日：2000-06-05
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： YAGI YUJI , MURAKAWA SATORU , ANPO TAKEO
IPC分类号： H01L21/60 , H01L21/56
摘要： PROBLEM TO BE SOLVED: To provide a method by which a semiconductor device which has resistance to changeover aging can be manufactured through a simple process, in order to solve the problem of the change of the connection resistance between a semiconductor and metal balls caused by changeover when a semiconductor is connected electrically to metal balls, by bringing the semiconductor into contact with the balls at the time of mounting the semiconductor using an anisotropic conductive resin. SOLUTION: By making a film of a thermosetting resin 1 formed on a wiring board 5 carrying solder bumps 4 formed on be a surface and a semiconductor element 2 mounted on the board 5 by melting the solder bumps 4 heating, and then the element 2 is fixed on the board 5 through curing the resin 1, not only electrical connection and resin encapsulation can be made at the same time, but also accordingly the process can be simplified. In addition, since the electrical connection is obtained by a metallic bond by soldering, the change in the connection resistance due to changeover aging can be reduced significantly and a high reliability semiconductor device can be realized.

5. 发明专利

JP2000332368A PRINTED-WIRING BOARD 失效
公开(公告)号：JP2000332368A
公开(公告)日：2000-11-30
申请号：JP14187899
申请日：1999-05-21
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： YAGI YUJI , ANPO TAKEO , OKAMOTO IZUMI
IPC分类号： H05K3/24 , H01L21/60 , H01L23/14 , H05K1/09
摘要： PROBLEM TO BE SOLVED: To eliminate the source of cracking by an Ni grain boundary, and to provide a thermal-stress-proof wiring pattern by covering one or entire part of the protrusions of grinding powder of an insulator whose one part protrudes from a plating layer with a conductive film. SOLUTION: In the printed-wiring board, a substrate 1 made of resin, Cu foil 2 being applied onto the substrate for forming a desired pattern, an Ni layer 3, and an Au layer 5 are sequentially laminated. Furthermore, the Ni layer 3 contains alumina fine powder 6. Also, one part of the alumina fine powder 6 projects on the Ni layer 3. Onto the Ni layer 3 and the alumina fine powder 6, the Au layer 5 is laminated. When the Ni layer 3 is to be formed, the alumina fine powder 6 is included, thus suppressing grain boundary growth of Ni, and setting a part without the alumina powder 6 on the surface of the Ni layer 3 to a smooth surface shape. Also, to suppress the grain boundary growth, the alumina fine powder 6 of 10 to 150 g may be preferably contained into Ni plating liquid 4 of 1 litter.

6. 发明专利

JPH09191028A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH09191028A
公开(公告)日：1997-07-22
申请号：JP121996
申请日：1996-01-09
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： ANPO TAKEO , MATSUNAGA HAYASHI
IPC分类号： H01L21/60 , H01L39/02
摘要： PROBLEM TO BE SOLVED: To obtain a semiconductor device with excellent heat radiation. SOLUTION: This semiconductor device is so constituted that connecting conductors 2b are buried into a via hole electrically connecting a surface to be mounted with semiconductor devices 4 of a wiring substrate 1 whereon metal devices 4 of a wiring substrate 1 and a face whereon metal balls 3 facing to this surface are to be arranged and directly under these connecting conductors 2b metal balls 3 are formed. Thereby, sufficient heat radiation of a semiconductor device can be performed as well as a junction strength of the metal balls 3 can be strengthened thus obtaining a semiconductor device with excellent reliability.

7. 发明专利

JPS60112214A PUSHBUTTON SWITCH 失效
公开(公告)号：JPS60112214A
公开(公告)日：1985-06-18
申请号：JP21807383
申请日：1983-11-18
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： ANPO TAKEO
IPC分类号： H01H13/52

8. 发明专利

JPS5846916A SAFETY APPARATUS OF PRESSURE COOKER 失效
公开(公告)号：JPS5846916A
公开(公告)日：1983-03-18
申请号：JP14682481
申请日：1981-09-16
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： ANPO TAKEO
IPC分类号： A47J27/09 , A47J27/08

9. 发明专利

JP2006147204A Light emitting device and its manufacturing method 审中-公开
标题翻译：发光装置及其制造方法
公开(公告)号：JP2006147204A
公开(公告)日：2006-06-08
申请号：JP2004332411
申请日：2004-11-16
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： MINO NORIHISA , ANPO TAKEO
IPC分类号： H05B33/02 , G02B1/04 , G02B3/00 , H01L51/50 , H05B33/10
摘要： PROBLEM TO BE SOLVED: To solve such a problem that, although the normal light emission of an EL device is performed at a part called as a light-emitting layer pinched by an indium tin oxide alloy (ITO) transparent electrode fitted on a glass substrate and its counter electrode, total reflection takes place especially at an interface between the ITO transparent electrode and the glass substrate and on the top face of the glass substrate, since materials forming the layers are different from one another, to cause different refractive indices, and light-takeout efficiency tends to be lowered to 20 to 30%. SOLUTION: The device is provided with at least a transparent electrode 11, a counter electrode 12 arranged in opposition to the transparent electrode 11, and a light-emitting layer 13 arranged between the transparent electrode 11 and the counter electrode 12, and further, a first light-takeout layer 21 is arranged between the transparent electrode 11 and the transparent substrate 21. At least one lens 15 for refracting light emitted from the light emitting layer 13 is embedded in the first light-taking-out layer 21. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题为了解决这样一个问题，即EL器件的正常发光是在被称为由氧化铟锡合金（ITO）透明电极所夹持的发光层的部分进行的，玻璃基板及其对电极，特别是在ITO透明电极和玻璃基板之间的界面以及玻璃基板的顶面上发生全反射，因为形成层的材料彼此不同，导致不同的折射指标和光取出效率往往降低到20％至30％。解决方案：该器件设置有至少透明电极11，与透明电极11相对布置的对电极12和布置在透明电极11和对电极12之间的发光层13，以及此外，在透明电极11和透明基板21之间布置有第一光取出层21.用于折射从发光层13发射的光的至少一个透镜15嵌入在第一光取出层21中。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2004173421A Dc/dc converter 审中-公开
公开(公告)号：JP2004173421A
公开(公告)日：2004-06-17
申请号：JP2002336441
申请日：2002-11-20
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： HIGASHIYA HIROSHI , ANPO TAKEO
IPC分类号： H02M3/155 , H02M3/158
CPC分类号： H02M3/1582 , H02M2001/0032 , Y02B70/16
摘要： PROBLEM TO BE SOLVED: To provide a step-up/step-down type DC/DC converter which can extend the speech time of a portable telephone.
SOLUTION: This DC/DC converter includes a voltage converter circuit 70 for switching a voltage in response to an output load between an input terminal 31 and an output terminal 32. A feedback circuit is constituted by connecting a voltage comparing circuit 71 having an output voltage as a target voltage in series with a switch control circuit 28 for controlling to switch the voltage of the voltage converter circuit 70 between this voltage converter circuit 70 and the output terminal 32, and between the voltage converter circuit 70 and the input terminal 31. A step-up/step-down operation deciding circuit 29 for deciding whether the voltage is stepped up or down and a transient responding circuit 34 for deciding the operating mode of the voltage converter circuit 70 are added to the switch control circuit 28.
COPYRIGHT: (C)2004,JPO

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