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1. 发明专利

JP2545107B2 失效
公开(公告)号：JP2545107B2
公开(公告)日：1996-10-16
申请号：JP33483687
申请日：1987-12-28
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： FUKUI SATORU , MATSUNAGA HAYASHI , NISHIMOTO SUSUMU
IPC分类号： H01G4/33 , H01G4/06 , H01L23/12 , H01L27/01 , H05K1/16

2. 发明专利

JPH01174196A REMOTE CONTROL OPTICAL SIGNAL RECEIVER 失效
公开(公告)号：JPH01174196A
公开(公告)日：1989-07-10
申请号：JP33483387
申请日：1987-12-28
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： FUKUI SATORU , MATSUNAGA HAYASHI , NISHIMOTO SUSUMU
IPC分类号： H01L31/10 , H04Q9/00
摘要： PURPOSE:To mount a pair chip of a photodiode onto a board by selecting a component mount board as a glass board transmitting light. CONSTITUTION:A thin film Au pattern 24 is formed to a part subjected to thermal pressing with an Au bump 23 of a pair chip 22 of photodiode on the glass board 21 by Au paste print and calcination. A contact metal 27 such as Ti is formed on the electrode 25 of the pair chip 22 via a part of the SiO2 film 26 coating the upper face of the pair chip 22 and a barrier metal 28 such as Pb is formed on the metal 27 and the Au bump 23 is formed further on it. Thus, on optical signal is received through the glass plate 21 in the photodiode of the pair chip 22 and the semiconductor components on the glass board are formed by pair chips.

3. 发明专利

JPS6365585A OPTICAL READER 失效
公开(公告)号：JPS6365585A
公开(公告)日：1988-03-24
申请号：JP20987186
申请日：1986-09-05
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： HATANO YOICHI , HIRASHIMA TEI , NISHIMOTO SUSUMU , MATSUNAGA HAYASHI
IPC分类号： G06K7/00 , G06K7/10
摘要： PURPOSE:To decode a code having the different reflection factor of light, by receiving scan reflected light beams by two or more photodetectors so that a phase difference is generated, and also, converting them to electric signals, and comparing the levels of the electric signals having a phase difference after having amplified them by an amplifier, respectively. CONSTITUTION:By comparing the levels of electric signals from photodetectors having a phase difference, it becomes unnecessary to set a threshold level. A code can be decoded by replacing whether a code having the different reflection factor of light is long or short, with whether the time required from the intersection to the intersection of a waveform is long or short, by the waveform of a time delay caused by the phase difference, and since the threshold level is not set in advance, the wrong decoding of a code scarcely occurs. Also, by the reverse direction parallel connecting body of a diode, this reader is scarcely influenced by a disturbance light.

4. 发明专利

JPS59209223A Switch 失效
公开(公告)号：JPS59209223A
公开(公告)日：1984-11-27
申请号：JP8132684
申请日：1984-04-23
申请人： Matsushita Electric Ind Co Ltd
发明人： MATSUNAGA HAYASHI , NAKAYAMA HIROSHI
IPC分类号： H01H13/52 , H01H13/70

5. 发明专利

JPS59209220A Keyboard switch 失效
公开(公告)号：JPS59209220A
公开(公告)日：1984-11-27
申请号：JP8132784
申请日：1984-04-23
申请人： Matsushita Electric Ind Co Ltd
发明人： NAKAYAMA HIROSHI , KADANI SHIYOUZOU , MATSUNAGA HAYASHI , YAMAMOTO SHIYUUICHI
IPC分类号： H01H13/52

6. 发明专利

JPS57100777A FORMATION OF ELECTRODE OF POLYMER PIEZOELECTRIC FILM 失效
公开(公告)号：JPS57100777A
公开(公告)日：1982-06-23
申请号：JP17762280
申请日：1980-12-15
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NAKAYAMA HIROSHI , YAMAMOTO SHIYUUICHI , KADANI SHIYOUZOU , MATSUNAGA HAYASHI
IPC分类号： B41J5/12 , H01L41/04 , H01L41/45
摘要： PURPOSE:To increase adhesive strength by forming an electrode pattern after applying surface reforming treatment to the surface of polyvinylidene fluoride resin sheet under predetermined conditions by sputtering etching. CONSTITUTION:The adhesiveness of the surface can be increased without reducing piezoelectric modulus by sputtering etching under a discharge condition of 0.1-200W.sec/cm and the surface reformation of polyfluoride vinylidene. Pattern electrode formation is performed to a polyfluoride vinylidene resin sheet with reformed surface by printing with conductive coating ink or the like. In this way, an electrode pattern having high adhesive strength with little danger in working is formed at low cost.

7. 发明专利

JPH11121645A CERAMIC MULTI-LAYER SUBSTRATE AND METHOD FOR MANUFACTURING IT 失效
公开(公告)号：JPH11121645A
公开(公告)日：1999-04-30
申请号：JP28011197
申请日：1997-10-14
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： MORI NOBORU , MATSUNAGA HAYASHI , HAYAMA MASAAKI
IPC分类号： H01L21/48 , H01L21/56 , H01L23/12 , H05K1/03 , H05K1/09 , H05K3/12 , H05K3/20 , H05K3/38 , H05K3/40 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide more minute line width of a conductor pattern and to reduce a wiring resistance for higher wiring density by printing a first insulating layer on a first conductor pattern where a pattern of a conductive paste is transferred onto a ceramics substrate and sintered, and then printing a second conductor pattern of a it. SOLUTION: On the surface of a flexible resin base material, fine first and second grooves are formed, used as an intaglio, which is filled with a conductor paste, and then deareated and dried. In order to compensate for reduction in volume due to drying, a process where an additional conductor paste is re-filled, re-deareated, and re-dried is repeated by a specified number of times so that the groove part is filled with a condensed conductor material. The intaglio and a ceramics substrate 2 are pasted together, and the conductor material packed in the groove part is transferred onto the ceramics substrate 2 and then sintered for a fine first conductor pattern 3. A first insulating layer 21 is printed on the first conductor pattern, and further, a second conductor pattern 4 is printed on the first insulating layer 21, which is to be a ceramics multi-layer substrate.

8. 发明专利

JPH09330843A MANUFACTURE OF ELECTRONIC PARTS 失效
公开(公告)号：JPH09330843A
公开(公告)日：1997-12-22
申请号：JP14881496
申请日：1996-06-11
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： HAYAMA MASAAKI , MORI NOBORU , MURAKAWA SATORU , MATSUNAGA HAYASHI , MIZUNO MASAYUKI
IPC分类号： H01F17/00 , H01F41/04 , H01L21/48 , H05K1/03 , H05K1/16 , H05K3/12 , H05K3/20 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide an electronic parts manufacturing method by which a fine pattern can be formed with high accuracy and, at the same time, the high- performance laminated structure of a conductor pattern can be manufactured easily, by simultaneously forming via hole electrodes at the time of performing intaglio printing for forming the conductor pattern on an insulating substrate by transfer. SOLUTION: A conductor pattern is formed in such a way that, after an intaglio printing 20 is formed by forming a pattern in which grooves at arbitrary positions are made deeper than those at the other positions on the surface of a flexible resin layer by laser beam machining and a strippable layer 23 on the surface of the pattern, the printing 20 is filled up with an Ag paste 24, and the paste 24 is dried. Then, the printing 20 is put on an insulating surface 2 carrying a water-soluble resin 28 on its surface, by utilizing a pressurizing section 26 of a press and transferring the pattern of the paste 24 to the resin 28 by removing the printing 20 from a substrate 2 after freezing the resin 28, and then, baking the resin pattern.

9. 发明专利

JPH09219420A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH09219420A
公开(公告)日：1997-08-19
申请号：JP2638796
申请日：1996-02-14
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： MATSUNAGA HAYASHI , IWATA MASAO
IPC分类号： H01L21/60 , H01L23/50
摘要： PROBLEM TO BE SOLVED: To make it possible to make low a lead inductance in a semiconductor device and to obtain a large capacitance by a method wherein the first terminal of a second planar conductor and a ground terminal are connected with each other. SOLUTION: A first terminal 31-1 of a second planar conductor 31 and a ground terminal 29 are connected with each other via a wiring pattern 35 and bonding pads 26-1 for signal input/output use on an IC die 26 are connected with signal input/output terminals 27 through a wiring pattern 35 which is provided on a substrate 25. A dielectric material 32 is held between planar conductors 30 and 31, is superposed on the conductor 31 to constitute a capacitor and at the same time, a power current is made to flow through the conductor 30 going through a first terminal 30-1 of a first planar conductor from a power terminal 28. A return current is made to flow through the conductor 31 going through a second terminal 31-2 of the conductor 31 from a bonding pad 26-3 for grounding use of the die 26. Moreover, as the return current is made to flow to the terminal 29 via the terminal 31-1 of the conductor 31, the capacitor provides a distributed capacitance to a current path and noise can be passed in a wide band.

10. 发明专利

JPH09191028A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH09191028A
公开(公告)日：1997-07-22
申请号：JP121996
申请日：1996-01-09
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： ANPO TAKEO , MATSUNAGA HAYASHI
IPC分类号： H01L21/60 , H01L39/02
摘要： PROBLEM TO BE SOLVED: To obtain a semiconductor device with excellent heat radiation. SOLUTION: This semiconductor device is so constituted that connecting conductors 2b are buried into a via hole electrically connecting a surface to be mounted with semiconductor devices 4 of a wiring substrate 1 whereon metal devices 4 of a wiring substrate 1 and a face whereon metal balls 3 facing to this surface are to be arranged and directly under these connecting conductors 2b metal balls 3 are formed. Thereby, sufficient heat radiation of a semiconductor device can be performed as well as a junction strength of the metal balls 3 can be strengthened thus obtaining a semiconductor device with excellent reliability.

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