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1. 发明专利

JP2004156147A Tin or tin alloy plated copper alloy for multi-pole terminal, and method of producing the same 有权
公开(公告)号：JP2004156147A
公开(公告)日：2004-06-03
申请号：JP2004060583
申请日：2004-03-04
申请人： Kobe Steel Ltd , 株式会社神戸製鋼所
发明人： ISONO MASAAKI , MANAKO TAKAHIRO , SHINTANI YASUHIRO
IPC分类号： C25D5/10 , C23C30/00 , C25D5/48
摘要： PROBLEM TO BE SOLVED: To reduce the inserting force of an automobile multi-pole terminal, and to lessen the fatigue of operators and the reduction of operability on assembling au automobile.
SOLUTION: The tin or tin alloy plated copper alloy for a multi-pole terminal has a first layer with a thickness of 0.1 to 0.4 μm consisting of a copper-tin intermetallic compound or a nickel-tin intermetallic compound, and a tin or tin alloy plating layer of 0.1 to 1.2 μm on the surface thereof. The dynamic friction coefficient between the materials is ≤0.3. The terminal obtained form the plating materials has a low friction coefficient, and the inserting force of the terminal can be reduced.
COPYRIGHT: (C)2004,JPO

2. 发明专利

JP2005171366A Copper or copper alloy sheet or strip for press working and method for manufacturing the same 审中-公开
标题翻译：铜或铜合金板或用于压制工艺的条带及其制造方法
公开(公告)号：JP2005171366A
公开(公告)日：2005-06-30
申请号：JP2003416534
申请日：2003-12-15
申请人： Kobe Steel Ltd , 株式会社神戸製鋼所
发明人： SUGISHITA YUKIO , TOKUNAGA HIROMOTO , TSUNO RIICHI , HARADA MUNEKAZU , INOUE YOICHI , MIWA YOSUKE , ISONO MASAAKI
IPC分类号： B21D22/02 , C23F11/00 , C23F11/14
摘要： PROBLEM TO BE SOLVED: To impart a rust preventive effect (discoloration prevention and corrosion prevention) to a copper or copper alloy sheet or strip by subjecting the copper or copper alloy sheet or strip to rust preventive treatment by benzotriazole or its derivative and simultaneously to prevent the deposition of green powder on a wiping pad at the time of press working, such as punching.
SOLUTION: The surface of the copper or copper alloy sheet or strip is subjected to the rust preventive treatment by the benzotriazole or its derivative and thereafter a press oil or rolling mill lubricant is applied thereto. The oil of a viscosity 1 to 30 cst is preferably applied thereto at a coating weight of 0.01 to 10 mg/m
2 . By the coating application of the oil, the dislodgment of the rust inhibitive film by the benzotriazole from the surface of the sheet or strip is substantially prevented, the generation of the green powder is suppressed and the deposition of the green powder of the wiping pad is prevented.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：通过对铜或铜合金板或带进行苯并三唑或其衍生物的防锈处理，使铜或铜合金板或带材具有防锈效果（防变色和防腐蚀）同时防止在冲压加工时诸如冲压之间的绿色粉末沉积在擦拭垫上。解决方案：通过苯并三唑或其衍生物对铜或铜合金板或带材的表面进行防锈处理，然后对其施加压榨油或轧机润滑剂。粘度为1〜30cst的油优选以0.01〜10mg / m 2的涂布重量施加于其上。通过油的涂布，基本上防止了苯并三唑从片材或带的表面脱落防锈膜，抑制了绿色粉末的产生，擦拭垫的绿色粉末的沉积是预防。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2000219996A PRODUCTION OF COPPER OR COPPER ALLOY SHEET FOR ELECTRONIC PARTS 失效
公开(公告)号：JP2000219996A
公开(公告)日：2000-08-08
申请号：JP2441699
申请日：1999-02-01
申请人： KOBE STEEL LTD
发明人： KURODA TARO , MARUO SATOSHI , ISONO MASAAKI
IPC分类号： B21B3/00 , B21B15/00 , B21B45/00 , B21B45/02 , C22C9/00 , C22F1/00 , C22F1/08 , C25D3/12 , C25D5/34 , C25D7/00
摘要： PROBLEM TO BE SOLVED: To obtain an Ni plated copper or copper alloy sheet for electronic parts excellent in Ni plating properties. SOLUTION: A copper or copper alloy sheet is annealed and is thereafter subjected to mechanical grinding to control the surface roughness Ra to 0.05 to 0.5 μm, and, after that, final cold rolling is executed. When the copper or copper alloy sheet produced by the producing method is applied with Ni plating by using an Ni plating soln. contg. saccharin or/and the salt thereof as a brightener, the Ni plating high in glossiness and free from the generation of blistering caused by heating can be obtd. This Ni plated copper or copper alloy material is suitable for the wire bonding of Al wires.

4. 发明专利

JPH11102739A ENGAGING TYPE CONNECTING TERMINAL 失效
公开(公告)号：JPH11102739A
公开(公告)日：1999-04-13
申请号：JP27984497
申请日：1997-09-25
申请人： KOBE STEEL LTD
发明人： ISONO MASAAKI , SHINTANI YASUHIRO , HARA TOSHIHISA
IPC分类号： C23C30/00 , H01R13/03
摘要： PROBLEM TO BE SOLVED: To reduce the apparent friction factor of a terminal for reducing insertion force in an engaging type connecting terminal, capable of obtaining electrical connection by fitting of a female terminal and a male terminal. SOLUTION: Either of a male terminal or a female terminal has a 0.3 μm or more tin plating layer on the outermost surface of the sliding part, and the other terminal has a 0.05 μm or more but 0.5 μm or less plating layer of either one from among Au, Pd, Ag, Ni, Co, and Zn on the outermost surface of the sliding part and furthermore has a 0.3 μm or more tin plating layer under this plating layer. Since the tin plating layer comes in contact with the plating layer of Au, Pd, Ag, Ni, Co, or Zn having different crystalline structures from that of tin plating layer, adhesion is hardly produced, and friction factor can be reduced.

5. 发明专利

JPH10302864A CONNECTION TERMINAL OF FITTING TYPE 失效
公开(公告)号：JPH10302864A
公开(公告)日：1998-11-13
申请号：JP11089597
申请日：1997-04-28
申请人： HARNESS SOGO GIJUTSU KENKYUSHO , SUMITOMO WIRING SYSTEMS , SUMITOMO ELECTRIC INDUSTRIES , KOBE STEEL LTD
发明人： NAKAMURA ATSUSHI , SHIOTANI JUN , FUJII ATSUHIKO , ISONO MASAAKI , SHINTANI YASUHIRO , KAWAGUCHI MASAHIRO
IPC分类号： H01R13/03
摘要： PROBLEM TO BE SOLVED: To provide a connection terminals of fitting type which can reduce the inserting force of terminals with stable contact resistance maintained. SOLUTION: Tinning thickness of one of a male terminal 10 or a female terminal 20 is set for 0.1 μm to 0.3 μm, and the other tinning thickness is set for 0.1 μm or above. As the tinning gets thinner, hardness of copper or a copper alloy begins to affect hardness of the terminals, then apparent hardness of the terminals gets higher. Consequently cohesion of the tinning is inhibited, and the terminal inserting force can be reduced by at least 10% or above compared with the benchmark (10 μm in both of male and female terminals). The inserting force can be reduced by 30% or above, particularly when thickness of the male terminal 10 is set for 0.1 μm, and thickness of the female terminal 20 is set for 0.3 μm to 1.0 μm.

6. 发明专利

JPH07150272A TIN PLATED COPPER ALLOY MATERIAL FOR ELECTRICAL AND ELECTRONIC PARTS AND PRODUCTION THEREOF 失效
公开(公告)号：JPH07150272A
公开(公告)日：1995-06-13
申请号：JP29787693
申请日：1993-11-29
申请人： KOBE STEEL LTD
发明人： ISONO MASAAKI , MARUO SATOSHI
IPC分类号： C23C26/00 , C22C9/00 , C22C9/02 , C22C9/04
摘要： PURPOSE:To produce a tin plated copper alloy material for electrical and electronic parts excellent in solderability even if a tin plating layer therein is thin and furthermore excellent in thermal peeling resistance and to provide a method for producing the same. CONSTITUTION:This material is the one in which the middle of a copper alloy and a tin plating layer is provided with an intermetallic compound layer of iron and tin formed by melting having 0.1 to 0.4mum thickness. The surface of the copper alloy is applied with an iron or iron alloy plating layer of 0.08 to 0.3mum, and the surface is furthermore applied with tin plating and the tin plating layer is thereafter reflowed, by which the middle of the copper alloy material and tin plating layer is provided with the intermetallic compound layer of iron and tin having 0.1 to 0.4mum thickness. Moreover, the surface of the copper alloy is applied with the iron or iron alloy plating layer of 0.08 to 0.3mum, which is thereafter immersed in molten tin and is applied with tin plating, and at the same time, the middle of the copper alloy material and tin plating layer is provided with the intermetallic compound layer of iron and tin having 0.1 to 0.4mum thickness.

7. 发明专利

JPH01180951A MANUFACTURE OF NICKEL-PLATED COPPER ALLOY BAR FOR TERMINAL AND CONNECTOR 失效
公开(公告)号：JPH01180951A
公开(公告)日：1989-07-18
申请号：JP348388
申请日：1988-01-11
申请人： KOBE STEEL LTD
发明人： SOEDA MASUMITSU , HOSOKAWA ISAO , TSUNO MAIICHI , NAKAMURA HIROSHI , ISONO MASAAKI
IPC分类号： C22F1/08 , C22F1/00 , C25D5/50 , H01B5/02
摘要： PURPOSE:To improve spring characteristic, bendability, and solderability by applying Ni plating to a copper-alloy bar stock containing specific amounts of Ni and Sn and then subjecting the above to annealing, cold rolling, and low-temp. annealing. CONSTITUTION:Ni plating is applied to a bar stock of a copper alloy having a composition consisting of, by weight, 3.0-15.0% Ni, 1.0-4.0% Sn, and the balance Cu with inevitable impurities to 0.6-10mum thickness. The above bar stock is annealed at 580-800 deg.C for 5-30sec, cold-rolled at 5-50% draft, and further subjected to low-temp. annealing at 350-450 deg.C for 5min-5hr. By this method, a copper alloy bar for terminal and connector excellent in bendability and corrosion resistance can be obtained with high productivity. It is desirable to use a plating bath free from organic matters at the time of Ni plating and also to provide luster to the surface of the Ni layer by means of cold rolling. Moreover, it is also desirable that the crystals in the Ni layer are formed by being recrystallized from the structure of electrodeposition plating layer into the structure of metallic Ni.

8. 发明专利

JP2000249789A COPPER ALLOY USED FOR RADIOACTIVE SUBSTANCE CONVEYING/ STORING CONTAINER 失效
公开(公告)号：JP2000249789A
公开(公告)日：2000-09-14
申请号：JP5171899
申请日：1999-02-26
申请人： KOBE STEEL LTD
发明人： MIWA YOSUKE , ISONO MASAAKI
IPC分类号： G21F5/008 , C22C9/00 , C22C9/04 , C22C9/06 , G21F5/002 , G21F5/005 , G21F9/36
摘要： PROBLEM TO BE SOLVED: To provide a copper alloy provided with a sufficient heat transmitting property, strength, heat resistance, radiation shielding ability and used for a heat transmitting rib, a fin, or a main body of a radioactive substance conveying/storing container. SOLUTION: This copper alloy consists of 1.0-10 wt.% of Ni, 0.2-2.5 wt.% of Si, and the rest of Cu and avoidable impurities substantially. If necessary, the copper alloy can properly contain 0.001-1.0 wt.% of one or more kinds of substances among Sn, Mn, Al, Ag, In, Pt, Au in total, 0.001-0.1 wt.% or one or more kinds of substances among Be, Mg, Ca, Ti, Cr, Zr in total, 1.0 or less wt.% of one or more kinds of substances among Li, B, C, Na, Cd, Hf in total, and 5 or less wt.% of Zn.

9. 发明专利

JP2000164279A Sn PLATED COPPER ALLOY MATERIAL FOR TERMINAL CONNECTOR 失效
公开(公告)号：JP2000164279A
公开(公告)日：2000-06-16
申请号：JP33964298
申请日：1998-11-30
申请人： KOBE STEEL LTD , HARNESS SYST TECH RES LTD , SUMITOMO WIRING SYSTEMS , SUMITOMO ELECTRIC INDUSTRIES
发明人： SHINTANI YASUHIRO , ISONO MASAAKI , SHIOTANI JUN , FURUKAWA KINGO
IPC分类号： H01R13/03 , C23C28/02
摘要： PROBLEM TO BE SOLVED: To provide a fitting terminal having low insertion force (apparent friction coefficient) when fitting and electric characteristics (contact resistance) similar to those of a Sn plated material. SOLUTION: A Sn plated alloy material for a terminal connector has a remaining Sn plated layer being 0-0.3 μm in thickness and a Sn oxide film being 10-300A (angstrom) in average thickness. The Sn plated copper alloy material is used in manufacturing at least either a male or female terminal.

10. 发明专利

JPH1143730A HIGH STRENGTH COPPER ALLOY EXCELLENT IN STAMPING PROPERTY AND SUITABLE FOR SILVER PLATING 失效
公开(公告)号：JPH1143730A
公开(公告)日：1999-02-16
申请号：JP21414897
申请日：1997-07-23
申请人： KOBE STEEL LTD
发明人： OGURA TETSUZO , HOSOKAWA ISAO , HAMAMOTO TAKASHI , MIWA YOSUKE , ISONO MASAAKI
IPC分类号： C22C9/06
摘要： PROBLEM TO BE SOLVED: To obtain a Cu-Ni-Si type high strength copper alloy excellent in silver plating suitableness as well as in stamping property. SOLUTION: This high strength copper alloy has a composition which consists of, by weight, 0.4-4.0% Ni, 0.05-1.0% Si, 0.1-5.0% Zn, 0.005-1.0% Mg, 0.0003-0.005% S, 0.0003-0.01% C, and the balance Cu with inevitable impurities and in which respective contents of Mg and S simultaneously satisfy the following (1) and (2):(1) -0.5[Mg]+0.005

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