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1. 发明专利

JP2007100220A Conducting material for connection parts and manufacturing method therefor 有权
标题翻译：连接部件的导电材料及其制造方法
公开(公告)号：JP2007100220A
公开(公告)日：2007-04-19
申请号：JP2007014499
申请日：2007-01-25
申请人： Kobe Steel Ltd , 株式会社神戸製鋼所
发明人： SUZUKI MOTOHIKO , SAKAMOTO HIROSHI , SUGISHITA YUKIO , TSUNO RIICHI
IPC分类号： C25D7/00 , C25D5/10
摘要： PROBLEM TO BE SOLVED: To obtain a conducting material for a fitting terminal which has a low friction coefficient (low insertion force), and can maintain low contact resistance even after being held at high temperature for long time.
SOLUTION: The conducting material has a Cu-Sn alloy covering layer consisting mainly of a Cu
6 Sn
5 phase, and an Sn covering layer, which are formed in this order on the surface of a base material composed of a Cu alloy plate strip. In the Cu-Sn alloy covering layer, an exposing area rate of the material surface is 3 to 75%, the average thickness is 0.1 to 3.0 μm, also, the Cu content is 20 to 70at%, and the average thickness of the Sn covering layer is 0.2 to 5.0 μm. The conducting material is produced by roughening the surface of the base material to have such surface roughness that the arithmetic average roughness Ra at least in either direction is ≥0.15 μm, and the arithmetic average roughness Ra in all directions is ≤4.0 μm, forming a Cu plating layer with the average thickness of 0.1 to 1.5 μm and an Sn plating layer with the average thickness of 0.3 to 8.0 μm on the surface of the base material in this order, and thereafter, performing reflow treatment.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了获得具有低摩擦系数（低插入力）的配件端子用导电材料，并且即使长时间保持在高温下也能够保持低接触电阻。
解决方案：导电材料具有主要由Cu 6 Sn 5 相组成的Cu-Sn合金覆盖层和形成于这种顺序在由Cu合金板条组成的基材的表面上。在Cu-Sn合金覆盖层中，材料表面的曝光面积率为3〜75％，平均厚度为0.1〜3.0μm，Cu含量为20〜70at％，Sn的平均厚度覆层为0.2〜5.0μm。导电材料通过使基材的表面粗糙化而具有表面粗糙度，使得至少在任一方向上的算术平均粗糙度Ra≥0.15μm，并且所有方向上的算术平均粗糙度Ra≤4.0μm，形成平均厚度为0.1〜1.5μm的Cu镀层和基材表面上的平均厚度为0.3〜8.0μm的Sn镀层，然后进行回流处理。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2006213999A Method for producing copper alloy sheet having excellent stress relaxation resistance 有权
标题翻译：生产具有优异应力松弛耐性的铜合金板的方法
公开(公告)号：JP2006213999A
公开(公告)日：2006-08-17
申请号：JP2005031151
申请日：2005-02-07
申请人： Kobe Steel Ltd , 株式会社神戸製鋼所
发明人： NOMURA YUKIYA , SAKAMOTO HIROSHI , TSUNO RIICHI , SUGISHITA YUKIO
IPC分类号： C22F1/08 , C22C9/02 , C22C9/06 , C22F1/00 , H01B1/02
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a copper alloy sheet having excellent stress relaxation resistance in the orthogonal direction to the rolling direction.
SOLUTION: A copper alloy ingot having a composition comprising, by mass, 0.4 to 1.6% Ni, 0.4 to 1.6% Sn, 0.01 to 0.15% P and 0.005 to 0.15% Fe, and in which the ratio between the Ni content and the P content, Ni/P is A ×a holding time X, so as to control its hardness to Hv 90 to 100, and is further subjected to cold rolling and stabilization annealing. The temperature T
A and the time X in the finish continuous annealing are set in such a manner that, at the time when the continuous annealing is performed at various temperatures for the time X to the copper alloy sheet after the cold rough rolling, in the case the peak value E
P of electrical conductivity is obtained at a temperature T
P , T
A >T
P is satisfied, and also, provided that the electrical conductivity obtained at the temperature T
A denotes as E
A , E
P -E
A >0.5% IACS is satisfied.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种在与轧制方向正交的方向上具有优异的耐应力松弛性的铜合金板的制造方法。解决方案：一种铜合金锭，其组成包括：质量为0.4〜1.6％的Ni，0.4〜1.6％的Sn，0.01〜0.15％的P和0.005〜0.15％的Fe，其中Ni含量并且P含量，Ni / P为<15，余量基本上为Cu与杂质进行均化处理，然后进行热轧和冷粗轧，在实际温度的条件下依次进行最终连续退火 T ×保持时间X，以将其硬度控制在90〜100℃，进一步进行冷轧和稳定化退火。在完成连续退火中的温度T A 和时间X设定为在对铜合金板的时间X进行各种温度的连续退火之后，在温度T P ，T A > T 下获得电导率的峰值E P 的情况下的冷粗轧， SB> P ，并且，只要在温度T A 下获得的电导率表示为E A ，E SB> -E A > 0.5％IACS。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2005171366A Copper or copper alloy sheet or strip for press working and method for manufacturing the same 审中-公开
标题翻译：铜或铜合金板或用于压制工艺的条带及其制造方法
公开(公告)号：JP2005171366A
公开(公告)日：2005-06-30
申请号：JP2003416534
申请日：2003-12-15
申请人： Kobe Steel Ltd , 株式会社神戸製鋼所
发明人： SUGISHITA YUKIO , TOKUNAGA HIROMOTO , TSUNO RIICHI , HARADA MUNEKAZU , INOUE YOICHI , MIWA YOSUKE , ISONO MASAAKI
IPC分类号： B21D22/02 , C23F11/00 , C23F11/14
摘要： PROBLEM TO BE SOLVED: To impart a rust preventive effect (discoloration prevention and corrosion prevention) to a copper or copper alloy sheet or strip by subjecting the copper or copper alloy sheet or strip to rust preventive treatment by benzotriazole or its derivative and simultaneously to prevent the deposition of green powder on a wiping pad at the time of press working, such as punching.
SOLUTION: The surface of the copper or copper alloy sheet or strip is subjected to the rust preventive treatment by the benzotriazole or its derivative and thereafter a press oil or rolling mill lubricant is applied thereto. The oil of a viscosity 1 to 30 cst is preferably applied thereto at a coating weight of 0.01 to 10 mg/m
2 . By the coating application of the oil, the dislodgment of the rust inhibitive film by the benzotriazole from the surface of the sheet or strip is substantially prevented, the generation of the green powder is suppressed and the deposition of the green powder of the wiping pad is prevented.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：通过对铜或铜合金板或带进行苯并三唑或其衍生物的防锈处理，使铜或铜合金板或带材具有防锈效果（防变色和防腐蚀）同时防止在冲压加工时诸如冲压之间的绿色粉末沉积在擦拭垫上。解决方案：通过苯并三唑或其衍生物对铜或铜合金板或带材的表面进行防锈处理，然后对其施加压榨油或轧机润滑剂。粘度为1〜30cst的油优选以0.01〜10mg / m 2的涂布重量施加于其上。通过油的涂布，基本上防止了苯并三唑从片材或带的表面脱落防锈膜，抑制了绿色粉末的产生，擦拭垫的绿色粉末的沉积是预防。版权所有（C）2005，JPO＆NCIPI

4. 发明专利

JP2007258156A Conductive material for connection component 有权
标题翻译：连接组件导电材料
公开(公告)号：JP2007258156A
公开(公告)日：2007-10-04
申请号：JP2007022206
申请日：2007-01-31
申请人： Kobe Steel Ltd , 株式会社神戸製鋼所
发明人： SUZUKI MOTOHIKO , SAKAMOTO HIROSHI , TSUNO RIICHI , SUGISHITA YUKIO , MASAGO YASUSHI , OZAKI RYOICHI
IPC分类号： H01R13/03 , C23C28/02 , C25D5/12 , C25D5/50 , C25D7/00
摘要： PROBLEM TO BE SOLVED: To provide a conductive material for a connection component low in a friction coefficient (low in insertion force), and capable of keeping reliability (low contact resistance) of electrical connection, and of providing solderability at the same time.
SOLUTION: This conductive material 1 for a connection component is composed by forming, on a roughened surface of a base material 3 made of a Cu sheet strip, a Ni coating layer 4 having an average thickness of 0.1-3.0 μm, a Cu coating layer 5 having an average thickness not greater than 0.1 μm, a Cu-Sn alloy coating layer 6 having an average thickness of 0.2-3.0 μm, and a Sn coating layer 7 in that order. In a vertical cross section 1a for a surface 1b of the material 1, the diameter D1 of the minimum inscribed circle of the Sn coating layer 7, the diameter D2 of the maximum inscribed circle thereof, and the height difference (y) between the foremost point 1A of the material 1 and the foremost point 6B of the Cu-Sn alloy coating layer 6 are not greater than 0.2 μm, 1.2-20 μm and not greater than 0.2 μm, respectively.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供低摩擦系数（插入力低）的连接部件的导电材料，并且能够保持电连接的可靠性（低接触电阻），并且能够提供可焊接性时间。解决方案：用于连接部件的导电材料1通过在由Cu片带制成的基材3的粗糙表面上形成平均厚度为0.1-3.0μm的Ni涂层4，平均厚度不大于0.1μm的Cu涂层5，平均厚度为0.2-3.0μm的Cu-Sn合金涂层6和Sn涂层7。在材料1的表面1b的垂直截面1a中，Sn涂层7的最小内切圆的直径D1，其最大内接圆的直径D2和最上面的高度差（y）材料1的点1A和Cu-Sn合金涂层6的最上点6B分别不大于0.2μm，1.2-20μm和不大于0.2μm。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2006183068A Conductive material for connecting part and method for manufacturing the conductive material 有权
标题翻译：用于连接导电材料的导电材料和制造导电材料的方法
公开(公告)号：JP2006183068A
公开(公告)日：2006-07-13
申请号：JP2004375212
申请日：2004-12-27
申请人： Kobe Steel Ltd , 株式会社神戸製鋼所
发明人： SUZUKI MOTOHIKO , SAKAMOTO HIROSHI , SUGISHITA YUKIO , TSUNO RIICHI
IPC分类号： C25D7/00 , C25D5/16 , C25D5/50 , H01R13/03 , H01R43/16
摘要： PROBLEM TO BE SOLVED: To provide a conductive material for a fitting terminal which has a low friction coefficient (low insertion force), and can maintain low contact resistance even in high temperature, corrosion, and vibration environments.
SOLUTION: The conductive material has a Cu-Sn alloy covering layer which contains a Cu of 20 to 70at% and has an average thickness of 0.2 to 3.0 m, and an Sn covering layer having an average thickness of 0.2 to 5.0 μm formed formed in this order on the surface of a base material composed of a Cu plate strip. The material surface is subjected to reflow processing, wherein the arithmetic average roughness Ra at least on one direction is 0.15μm or more, the arithmetic average roughness Ra in all the directions is 3.0 μm or less, and a part of the Cu-Sn alloy covering layer is exposed from the surface of the Sn covering layer, wherein an exposing area rate of the material surface is 3 to 75%. The conductive material is manufactured by applying reflow processing after forming an Ni plating layer, and further, a Cu plating layer and an Sn plating layer as needed on the roughened base material surface.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供具有低摩擦系数（低插入力）的配件端子的导电材料，并且即使在高温，腐蚀和振动环境下也可以保持低接触电阻。＆lt; P＆gt;解决方案：导电材料具有Cu-Sn合金覆盖层，其含有20〜70原子％的Cu，平均厚度为0.2〜3.0μm，Sn覆盖层的平均厚度为0.2〜5.0μm 在由Cu板条构成的基材的表面上依次形成。材料表面进行回流处理，其中至少在一个方向上的算术平均粗糙度Ra为0.15μm以上，所有方向的算术平均粗糙度Ra为3.0μm以下，一部分Cu-Sn合金覆盖层从Sn覆盖层的表面露出，其中材料表面的曝光面积率为3〜75％。导电材料通过在形成Ni镀层之后进行回流处理，以及根据需要在粗糙化的基材表面上形成Cu镀层和Sn镀层来制造。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2006077307A Electrically conductive material for connecting parts and production method therefor 有权
标题翻译：用于连接零件的导电材料及其生产方法
公开(公告)号：JP2006077307A
公开(公告)日：2006-03-23
申请号：JP2004264749
申请日：2004-09-10
申请人： Kobe Steel Ltd , 株式会社神戸製鋼所
发明人： SUZUKI MOTOHIKO , SAKAMOTO HIROSHI , SUGISHITA YUKIO , TSUNO RIICHI
IPC分类号： C25D5/10 , C25D5/12 , C25D5/34 , C25D5/50 , C25D7/00 , H01R13/03
摘要： PROBLEM TO BE SOLVED: To obtain an electrically conductive material for a fitting terminal having a low friction coefficient (low inserting force) and whose contact resistance can be kept low even after holding at a high temperature for a long time.
SOLUTION: The electrically conductive material is formed with, on the surface of a base metal composed of a Cu alloy sheet strip, a Cu-Sn alloy covering layer mainly made up of a Cu
6 Sn
5 phase and an Sn covering layer in this order, wherein the exposed area ratio of the Cu-Sn alloy covering layer in the surface of the material is 3 to 75%, its mean thickness is 0.1 to 3.0 μm, also, the content of Cu is 20 to 70at%, and the mean thickness of the Sn covering layer is 0.2 to 5.0 μm. The electrically conductive material is produced by roughening the surface of the base metal to a surface roughness in which the arithmetic mean roughness Ra at least in one direction satisfies ≥0.15 μm and the arithmetic mean roughness Ra in all the directions satisfies ≤4.0 μm, forming a Cu plating layer having a mean thickness of 0.1 to 1.5 μm and an Sn plating layer having a mean thickness of 0.3 to 8.0 μm on the surface of the base metal in this order, and thereafter performing reflow treatment.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了获得具有低摩擦系数（低插入力）的接合端子用导电材料，并且即使长时间保持在高温下，其接触电阻也可以保持较低。解决方案：导电材料在由Cu合金板条构成的基体金属的表面上形成主要由CuS 6 Sn合金构成的Cu-Sn合金覆盖层 5 相和Sn覆盖层，其中，该材料表面的Cu-Sn合金被覆层的露出面积比为3〜75％，平均厚度为0.1〜3.0 μm，Cu的含量也为20〜70at％，Sn覆盖层的平均厚度为0.2〜5.0μm。导电材料通过将母材表面粗糙化为至少在一个方向上的算术平均粗糙度Ra满足≥0.15μm并且所有方向上的算术平均粗糙度Ra满足≤4.0μm的表面粗糙度，形成平均厚度为0.1〜1.5μm的Cu镀层和平均厚度为0.3〜8.0μm的Sn镀层，然后进行回流处理。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JPH11199953A TIN-CONTAINING COPPER ALLOY MATERIAL FOR ELECTRONIC AND ELECTRICAL PART, EXCELLENT IN SILVER PLATABILITY 失效
公开(公告)号：JPH11199953A
公开(公告)日：1999-07-27
申请号：JP1797598
申请日：1998-01-14
申请人： KOBE STEEL LTD
发明人： MASAGO YASUSHI , KAWAGUCHI MASAHIRO , MATSUI TAKASHI , KANAO KENJI , TSUNO RIICHI
IPC分类号： G01N23/227 , C22C9/02 , C25D3/46 , C25D5/10 , C25D7/00 , C25D7/12 , H01L23/48
摘要： PROBLEM TO BE SOLVED: To obtain an Sn-containing copper alloy material for electronic and electrical parts, excellent in Ag platability after Cu undercoat plating as well as in Ag platability. SOLUTION: The amount of existence of Sn at the surface of an Sn- containing copper alloy material is regulated so that the value of Sn3d/Cu2p as the peak-area area ratio of quantitative analysis by the X-ray photoelectron spectroscopy becomes

8. 发明专利

JP2531777B2 失效
公开(公告)号：JP2531777B2
公开(公告)日：1996-09-04
申请号：JP4561089
申请日：1989-02-27
申请人： KOBE STEEL LTD
发明人： MYATO MOTOHISA , TSUNO RIICHI , KINOSHITA TATSUYA , TANAKA HITOSHI
IPC分类号： C22C9/00 , C22C9/04 , H01B1/02 , H05K1/09

9. 发明专利

JPH06220556A COPPER ALLOY FOR ELECTRICAL AND ELECTRONIC PARTS EXCELLENT IN HOT WORKABILITY AND MIGRATION RESISTANCE 失效
公开(公告)号：JPH06220556A
公开(公告)日：1994-08-09
申请号：JP907693
申请日：1993-01-22
申请人： KOBE STEEL LTD
发明人： MIYATO MOTOHISA , OGURA TETSUZO , TSUNO RIICHI
IPC分类号： C22C9/04
摘要： PURPOSE:To produce a copper alloy for electrical and electronic parts excellent in hot workability and migration resistance by preparing a copper alloy containing specific percentages of Fe, P, Zn, Sn, Mg, Al, Cr, Ti, Zr, and Mn. CONSTITUTION:A copper alloy having a composition consisting of, by weight, 1.5-3.0% Fe, 0.001-0.1% P, 1.0-5.0% Zn, 0.2-1.0% Sn, 0.001-0.01% (not including 0.01%) Mg, 0.001-0.02% Al, further 0.001-0.1%, in total, of one or more components selected from the group consisting of 0.001-0.01% Cr, 0.001-0.01% Ti, 0.001-0.01% Zr, and 0.01-0.1% Mn, and the balance Cu with inevitable impurities is prepared. By this method, the copper alloy for electrical and electronic parts, improved in brittleness at medium and high temps., capable of hot rolling, and excellent in mechanical properties can be obtained.

10. 发明专利

JPH0457733B2 失效
公开(公告)号：JPH0457733B2
公开(公告)日：1992-09-14
申请号：JP23179988
申请日：1988-09-16
申请人： KOBE STEEL LTD
发明人： MYATO MOTOHISA , TSUNO RIICHI , KINOSHITA TATSUYA , TANAKA HITOSHI
IPC分类号： C22C9/06

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