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1. 发明专利

JP2006203166A Semiconductor device and circuit device 有权
标题翻译：半导体器件和电路器件
公开(公告)号：JP2006203166A
公开(公告)日：2006-08-03
申请号：JP2005329184
申请日：2005-11-14
申请人： Kanto Sanyo Semiconductors Co Ltd , Sanyo Electric Co Ltd , 三洋電機株式会社 , 関東三洋セミコンダクターズ株式会社
发明人： SATO AKIHIRO , SEKIGUCHI SATOSHI , KAMATSUCHI KIYOKAZU , SAWAI TETSUO , IMAOKA SHUNICHI , KUROKAWA KAZUNARI , TSUBONOYA MAKOTO , MITA KIYOSHI , NABETA YOICHI
IPC分类号： H01L23/12
CPC分类号： H01L23/645 , H01F2017/008 , H01F2017/0086 , H01L23/49827 , H01L23/49838 , H01L23/552 , H01L24/48 , H01L24/73 , H01L25/16 , H01L2224/32225 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/07802 , H01L2924/12034 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19106 , H01L2924/30107 , H01L2924/3025 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： PROBLEM TO BE SOLVED: To provide a low-cost semiconductor device capable of reproducing an inductance characteristic and stability which are provided before being mounted after it is mounted, and of being easily mounted.
SOLUTION: The semiconductor device comprises a substrate 10, a semiconductor chip 20 secured to one side of the substrate, and a coil 30 which is spirally formed on the other side of the substrate and electrically connected to the semiconductor chip. The semiconductor device further comprises a conductive pattern 40 for stabilizing the inductance characteristic of the coil on the surface of the one side of the substrate that faces the semiconductor chip.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够再现在其安装之后提供的电感特性和稳定性的低成本半导体器件，并且易于安装。解决方案：半导体器件包括衬底10，固定在衬底的一侧的半导体芯片20和螺旋地形成在衬底的另一侧并与半导体芯片电连接的线圈30。半导体器件还包括导电图案40，用于稳定面向半导体芯片的衬底的一侧的表面上的线圈的电感特性。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2006229190A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2006229190A
公开(公告)日：2006-08-31
申请号：JP2005329185
申请日：2005-11-14
申请人： Kanto Sanyo Semiconductors Co Ltd , Sanyo Electric Co Ltd , 三洋電機株式会社 , 関東三洋セミコンダクターズ株式会社
发明人： SATO AKIHIRO , SEKIGUCHI SATOSHI , KAMATSUCHI KIYOKAZU , TSUBONOYA MAKOTO , MITA KIYOSHI , NABETA YOICHI
IPC分类号： H01L23/12
CPC分类号： H01L23/49838 , H01L23/3121 , H01L23/49822 , H01L23/552 , H01L23/645 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32225 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/07802 , H01L2924/12034 , H01L2924/14 , H01L2924/181 , H01L2924/19015 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/30107 , H01L2924/3025 , H03J2200/10 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device capable of keeping inductance a designated value set during packaging. SOLUTION: The device is characterized in that it comprises a semiconductor chip 20, a first coil 301 electrically connected with the semiconductor chip 20, a first electrode 301a electrically connected with the first coil 301, and a second electrode 302a which can be electrically connected to the first electrode 301a and a second coil 302 located outside the semiconductor device simultaneously, and in that an inductance consisting of the first and second coils can be obtained in such a way that the second electrode 302a is connected with the first electrode 301a and the second coil 302 by an interconnect line 303. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供能够将电感保持在包装期间设定的指定值的半导体器件。解决方案：该器件的特征在于它包括半导体芯片20，与半导体芯片20电连接的第一线圈301，与第一线圈301电连接的第一电极301a和可以与第一线圈301电连接的第二电极302a 电连接到第一电极301a和位于半导体器件外部的第二线圈302，并且可以以第二电极302a与第一电极301a连接的方式获得由第一和第二线圈组成的电感和第二线圈302通过互连线303.版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2011130186A Receiving apparatus 审中-公开
标题翻译：接收装置
公开(公告)号：JP2011130186A
公开(公告)日：2011-06-30
申请号：JP2009286758
申请日：2009-12-17
申请人： Sanyo Electric Co Ltd , Sanyo Semiconductor Co Ltd , 三洋半導体株式会社 , 三洋電機株式会社
发明人： KUROKAWA KAZUNARI , SEKIGUCHI SATOSHI
IPC分类号： H04B1/26 , H04B1/10
CPC分类号： H04B1/28
摘要： PROBLEM TO BE SOLVED: To prevent the interference between a desired signal and an image signal, even if a phase shift or a gain deviation occurs. SOLUTION: A receiving apparatus includes: a local oscillator 32 to output first- and second-local-oscillation signals whose phases are orthogonal to each other; mixers 33, 34 to output first- and second-intermediate-frequency signals each having a predetermined intermediate frequency by mixing a reception signal with the first- and second-local-oscillation signals, respectively; a first (second) filter 51 (52) to allow a component from a desired signal (image signal) to pass therethrough, and eliminate a component from an image signal (desired signal), in the first- and second-intermediate-frequency signals; a comparator 55 to compare levels between output signals of the first and second filters; and a control unit 31a to switch a frequency of the first- and second-local-oscillation signals to a difference frequency between a frequency of the desired signal and the intermediate frequency or a sum frequency of the frequency of the desired signal and the intermediate frequency, according to a comparison result of the comparator. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：即使发生相移或增益偏移，为了防止期望信号和图像信号之间的干扰。解决方案：接收装置包括：本地振荡器32，用于输出其相位彼此正交的第一和第二本地振荡信号; 混合器33,34分别通过将接收信号与第一和第二本地振荡信号混合来输出每个具有预定中间频率的第一和第二中频信号; 第一（第二）滤波器51（52），用于允许来自期望信号（图像信号）的分量通过其中，并且在第一和第二中频信号中从图像信号（期望信号）中消除分量 ; 比较器55，用于比较第一和第二滤波器的输出信号之间的电平; 以及控制单元31a，用于将第一和第二本地振荡信号的频率切换到期望信号的频率与中频之间的差频率或所需信号和中频频率的和频率，根据比较结果比较。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2008084414A Optical pickup device 审中-公开
标题翻译：光学拾取器件
公开(公告)号：JP2008084414A
公开(公告)日：2008-04-10
申请号：JP2006262090
申请日：2006-09-27
申请人： Sanyo Electric Co Ltd , Sanyo Optic Design Kk , 三洋オプテックデザイン株式会社 , 三洋電機株式会社
发明人： KAWASAKI RYOICHI , SEKIGUCHI SATOSHI
IPC分类号： G11B7/135 , G11B7/09
CPC分类号： G11B7/0903 , G11B7/1353 , G11B2007/0013
摘要： PROBLEM TO BE SOLVED: To solve the problem that when a signal recorded in one signal recording layer of a double-layer optical disk is reproduced, stray light reflected from the other signal recording layer adversely affects a tracking control operation. SOLUTION: This device is provided with a laser diode 1 for emitting a laser beam, and a diffraction grating 2 on which the laser beam emitted from the laser diode 1 is made incident, and which generates a main beam as a 0th-order beam, and sub-beams as ± 1st beams, and the ratio of light quantity of the sub-beam to light quantity of the main beam is roughly set to 1:7. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了解决当记录在双层光盘的一个信号记录层中的信号被再现时，从另一个信号记录层反射的杂散光对跟踪控制操作有不利影响的问题。解决方案：该器件设置有用于发射激光束的激光二极管1和从激光二极管1发射的激光束入射的衍射光栅2，并且其产生主光束作为第0- 次光束和副光束作为±第一光束，并且子光束的光量与主光束的光量的比率大致设置为1:7。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2006074129A Temperature characteristic correction circuit 审中-公开
标题翻译：温度特性校正电路
公开(公告)号：JP2006074129A
公开(公告)日：2006-03-16
申请号：JP2004251930
申请日：2004-08-31
申请人： Sanyo Electric Co Ltd , 三洋電機株式会社
发明人： KOBORI HIROSHI , SEKIGUCHI SATOSHI
IPC分类号： H03F1/30 , G05F3/02
摘要： PROBLEM TO BE SOLVED: To provide a temperature characteristic correction circuit which is used as circuits having various temperature dependent characteristics through an easy design change. SOLUTION: The temperature characteristic correction circuit is provided with: a first current generating circuit for generating a prescribed first current independently of a temperature change; a second current generating circuit connected in series with the first current generating circuit and generating a second current that is increased when the temperature rises and is equal to the first current at a reference temperature; a third current generating circuit connected to a direct connection point between the first and second current generating circuits and generating a third current that corresponds to a difference between the first and second currents when the temperature deviates toward one side from the reference temperature; a fourth current generating circuit for generating a fourth current that increases when the temperature rises; a fifth current generating circuit connected in series with the fourth current generating circuit and generating a fifth current that is constant independently of a temperature change and equal to the fourth current at the reference temperature; a sixth current generating circuit connected to a series connection point between the fourth and fifth current generating circuits and generating a sixth current corresponding to a difference between the fourth and sixth currents when the temperature deviates toward the other side from the reference temperature; and a current output circuit that provides an output of a constant current changed by an amount of the third or sixth current. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种温度特性校正电路，其通过简单的设计改变用作具有各种温度依赖特性的电路。解决方案：温度特性校正电路设置有：独立于温度变化产生规定的第一电流的第一电流产生电路; 与第一电流产生电路串联连接的第二电流产生电路，产生当温度升高时等于第一电流的第二电流; 连接到第一和第二电流产生电路之间的直接连接点的第三电流产生电路，并且当温度偏离基准温度时，产生对应于第一和第二电流之间的差的第三电流; 用于产生当温度升高时增加的第四电流的第四电流产生电路; 与第四电流产生电路串联连接的第五电流产生电路，产生与温度变化无关的第五电流，并等于参考温度下的第四电流; 连接到第四和第五电流产生电路之间的串联连接点的第六电流产生电路，并且当温度偏离基准温度的另一侧时，产生对应于第四和第六电流之间的差的第六电流; 以及电流输出电路，其提供以第三或第六电流的量改变的恒定电流的输出。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2000077686A Mounting structure of semiconductor device 审中-公开
标题翻译：半导体器件的安装结构
公开(公告)号：JP2000077686A
公开(公告)日：2000-03-14
申请号：JP24377898
申请日：1998-08-28
申请人： Sanyo Electric Co Ltd , 三洋電機株式会社
发明人： KUNII HIDEO , TAKADA KIYOSHI , OCHIAI AKIRA , INOGUCHI HIROSHI , ISHIKAWA TSUTOMU , SEKIGUCHI SATOSHI , KOBORI HIROSHI
IPC分类号： H01L31/0232 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/64 , H01L33/00
CPC分类号： H01L25/167 , H01L33/54 , H01L33/60 , H01L2224/32245 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To obtain a mounting structure of a photo semiconductor device that improves fluctuation of a light signal and heat radiation by mounting a semiconductor device that is thinned by transferring the light signal from the side wall of a package so as to fix the rear surface of an island to a printed-circuit board.
SOLUTION: At least a photo detector is fixed onto an island 21, and a periphery is molded with transparent resin as a sealing body 25. A reflection surface 27 is formed at the upper part of a photo detector 3, and a lens is formed on the side surface of the sealing body. Signal light 6 that is emitted from a light-emitting device is reflected on the reflection surface 27, and emits from the lens on the side surface. On the rear surface of the sealing body 25, the rear surfaces of islands 21 and 22 are exposed. The exposed rear surfaces are soldered and fixed onto printed wiring 33 of a printed-circuit board 30.
COPYRIGHT: (C)2000,JPO
摘要翻译：要解决的问题：为了获得通过安装通过从封装的侧壁传递光信号而变薄的半导体器件来安装来改善光信号和散热的波动的光半导体器件的安装结构，以便将岛的后表面到印刷电路板。解决方案：将至少一个光电检测器固定在岛21上，并且用透明树脂作为密封体25模制周边。反射表面27形成在光电检测器3的上部，并且透镜形成在密封体的侧面。从发光装置发射的信号光6在反射面27上反射，从侧面的透镜发射。在密封体25的后表面上露出岛21,22的后表面。暴露的后表面被焊接并固定到印刷电路板30的印刷布线33上。

7. 发明专利

JP2013131284A Optical pickup device 审中-公开
标题翻译：光学拾取器件
公开(公告)号：JP2013131284A
公开(公告)日：2013-07-04
申请号：JP2012251735
申请日：2012-11-16
申请人： Sanyo Electric Co Ltd , 三洋電機株式会社
发明人： IIZUKA HAJIME , SEKIGUCHI SATOSHI
IPC分类号： G11B7/1267 , G11B7/1263 , G11B7/135
CPC分类号： G11B7/1263 , G11B7/12 , G11B7/1275 , G11B2007/0006
摘要： PROBLEM TO BE SOLVED: To reduce a transmission path between an optical pickup device and a control circuit.SOLUTION: The optical pickup device includes: a first laser light source for emitting first laser light of a first wavelength; a first photodetector for outputting a first monitor signal indicating intensity of the first laser light; a second laser light source for emitting second laser light of a second wavelength; a second photodetector for outputting a second monitor signal indicating intensity of the second laser light; a signal selection section for selecting the first monitor signal when information is recorded in or read from a first optical disk, and selecting the second monitor signal when information is recorded in or read from a second optical disk; and a signal transmission section for transmitting the first monitor signal or the second monitor signal having been selected by the signal selection section to a control circuit for controlling the intensities of the first laser light and the second laser light through a common transmission path.
摘要翻译：要解决的问题：减少光学拾取装置和控制电路之间的传输路径。解决方案：光学拾取装置包括：第一激光源，用于发射第一波长的第一激光; 第一光电检测器，用于输出指示第一激光的强度的第一监视信号; 用于发射第二波长的第二激光的第二激光光源; 第二光电检测器，用于输出指示第二激光的强度的第二监视信号; 信号选择部，用于当信息被记录在第一光盘中或从第一光盘读取时选择第一监视信号，以及当信息被记录在第二光盘中或从第二光盘读取时，选择第二监视信号; 以及信号发送部，用于将由信号选择部选择的第一监视信号或第二监视信号发送到用于通过公共传输路径控制第一激光和第二激光的强度的控制电路。

8. 发明专利

JP2000077788A Optical semiconductor device 有权
标题翻译：光学半导体器件
公开(公告)号：JP2000077788A
公开(公告)日：2000-03-14
申请号：JP24377598
申请日：1998-08-28
申请人： Sanyo Electric Co Ltd , 三洋電機株式会社
发明人： SEKIGUCHI SATOSHI , ISHIKAWA TSUTOMU , KOBORI HIROSHI , KUNII HIDEO , TAKADA KIYOSHI , OCHIAI AKIRA , INOGUCHI HIROSHI
IPC分类号： G11B7/125 , H01L31/02 , H01S5/00 , H01S5/30
摘要： PROBLEM TO BE SOLVED: To provide an optical semiconductor device that is lessened in size and thickness. SOLUTION: Laser rays emitted from a first semiconductor chip 13 are reflected from a plane 17. The reflected light from the plane 17 are projected form the upside of a resin-sealed body 16. A monitoring semiconductor chip 15 receives the transmitted light that passes through the plane 17 so as to monitor its intensity. Furthermore, external light impinging on the plane 17 of the resin-sealed body 16 is detected by a receiving semiconductor chip 14, passing through the plane 17.
摘要翻译：要解决的问题：提供减小尺寸和厚度的光学半导体器件。解决方案：从第一半导体芯片13发射的激光从平面17反射。来自平面17的反射光从树脂密封体16的上侧突出。监视半导体芯片15接收透过的透射光飞机17，以监控其强度。此外，入射到树脂密封体16的平面17上的外部光被接收半导体芯片14检测，通过平面17。

9. 发明专利

JP2000077719A Optical semiconductor device 审中-公开
标题翻译：光学半导体器件
公开(公告)号：JP2000077719A
公开(公告)日：2000-03-14
申请号：JP24524998
申请日：1998-08-31
申请人： Sanyo Electric Co Ltd , 三洋電機株式会社
发明人： KUNII HIDEO , TAKADA KIYOSHI , OCHIAI AKIRA , INOGUCHI HIROSHI , ISHIKAWA TSUTOMU , SEKIGUCHI SATOSHI , KOBORI HIROSHI
IPC分类号： H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/00
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To form the external shape of a light-emitting element and a photodetector as thin as possible, and to enable a miniaturization of the elements also in a module or a set with these elements incorporated therein. SOLUTION: An optical semiconductor device is provided with semiconductor chips 23 and 24 as its light-emitting element and photodetector, and a resin sealed body 25 for sealing these chips consists of a material transparent to light. Moreover, recessed parts 27 are respectively formed in the region, where the light is emitted from the light-emitting element and the region, where the light is incident in the photodetector, and reflective surfaces 26 are respectively constituted on these recesses 27. As a result, it becomes possible that the light is emitted and incident from the light-emitting element and in the photodetector via the side surface E of the sealed body 25. Moreover, as each wall is formed on the ends of the recesses 27, the intensity of the light is strong.
摘要翻译：要解决的问题：为了形成尽可能薄的发光元件和光电检测器的外形，并且也可以在包含这些元件的模块或组中使元件小型化。解决方案：光半导体器件设置有半导体芯片23和24作为其发光元件和光电检测器，并且用于密封这些芯片的树脂密封体25由透明的材料构成。此外，凹部27分别形成在光从发光元件发射的区域和光入射到光电检测器中的区域中，并且反射表面26分别构成在这些凹部27上。作为结果，可以通过密封体25的侧面E从发光元件和光电检测器射出光并入射。此外，当在凹部27的端部形成每个壁时，强度的光线很强。

10. 发明专利

JP2000077775A Optical semiconductor device 审中-公开
标题翻译：光学半导体器件
公开(公告)号：JP2000077775A
公开(公告)日：2000-03-14
申请号：JP24229498
申请日：1998-08-27
申请人： Sanyo Electric Co Ltd , 三洋電機株式会社
发明人： KOBORI HIROSHI , ISHIKAWA TSUTOMU , SEKIGUCHI SATOSHI , KUNII HIDEO , TAKADA KIYOSHI , OCHIAI AKIRA , INOGUCHI HIROSHI
IPC分类号： H01S5/00 , H01S5/30
摘要： PROBLEM TO BE SOLVED: To provide an optical semiconductor device that is lessened in size and thickness.
SOLUTION: First infrared rays emitted from a first semiconductor chip 13 are reflected from the reflecting plane 16a of a V-shaped groove 17 and projected outside through a lens 18 or the side face of a resin-sealed body 15. Second infrared rays emitted from a second semiconductor chip 14 are reflected from the reflecting plane 16b of a V-shaped groove 17 and projected outside from the side face of the resin-sealed body 15 through the intermediary of the lens 18.
COPYRIGHT: (C)2000,JPO
摘要翻译：要解决的问题：提供减小尺寸和厚度的光学半导体器件。解决方案：从第一半导体芯片13发射的第一红外线从V形槽17的反射面16a反射并通过透镜18或树脂密封体15的侧面突出到外部。第二半导体芯片14从V形槽17的反射面16b反射并通过透镜18从树脂密封体15的侧面突出到外侧。

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