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1. 发明专利

JP2000183480A WIRING BOARD AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JP2000183480A
公开(公告)日：2000-06-30
申请号：JP35702198
申请日：1998-12-16
申请人： IBM , HITACHI CHEMICAL CO LTD
发明人： KOBAYASHI SHIGETAKA , OTSUKA OSAMU , ISO TOSHIAKI , KUROKAWA HIROSHI , OSAWA MASAYUKI
IPC分类号： H05K1/11 , H05K1/14 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a wiring board with improved suppression of short- circuiting failures, and its manufacturing method. SOLUTION: A wiring board is provided with a plurality of conductors 6 for terminal which are in parallel at the end part of a substrate 1, and is also provided with a conductor 3 to a first terminal, that is formed over an outer shape line 2 of the end part before subjecting it to shape machining and a conductor 4 for a second terminal, that is formed only on the inside from the outer shape line 2 of the end part. The conductor 3 for the first terminal and the conductor 4 for the second terminal are formed alternately.

2. 发明专利

JP2000114693A MANUFACTURE OF WIRING BOARD 失效
公开(公告)号：JP2000114693A
公开(公告)日：2000-04-21
申请号：JP28393998
申请日：1998-10-06
申请人： HITACHI CHEMICAL CO LTD
发明人： KUROKAWA HIROSHI , OSAWA MASAYUKI , OTSUKA OSAMU , ISO TOSHIAKI , CHIAKI YOSHIRO
IPC分类号： H05K3/42 , H05K3/06
摘要： PROBLEM TO BE SOLVED: To provide a method by which such an economic wiring board can be manufactured that the difference between the top width and bottom width of a circuit is small and a wiring pattern can be maintained at such a thickness that the same peeling strength as that of the conventional wiring board can be secured without increasing the electric resistance. SOLUTION: In a method for manufacturing wiring board a wiring board is manufactured in such a way that the copper coil 1 of copper-plated laminated board formed by sticking the copper foil 1 to both surfaces of a substrate 2 is etched off in the thickness direction and a hole 3 is made through the laminated board. Then conductive particles are stuck to the whole surface of the laminated board including the internal surface of the hole 3 and a plating resist 5 is formed on the surface of the laminated board except the portion which becomes a circuit. Thereafter, the surface of the laminated body is electroplated 6 except the portion coated with the resist 5 and the resist 5 is stripped off. Finally, the copper foil 1 left in the portion from which the resist 5 has been stripped off is etched off.

3. 发明专利

JPH07122315A ELECTRICAL CONNECTION JIG AND ELECTRICAL CONNECTION METHOD USING THIS JIG 失效
公开(公告)号：JPH07122315A
公开(公告)日：1995-05-12
申请号：JP26705893
申请日：1993-10-26
申请人： HITACHI CHEMICAL CO LTD
发明人： KUROKAWA HIROSHI
IPC分类号： H01R4/48 , H05K1/14 , H05K3/32 , H05K3/36 , H01R9/09
摘要： PURPOSE:To conduct the connection of a flexible circuit board to a rigid circuit board by one operation to enhance efficiency of connection work time by installing a supporting plate, a ratchet pin, a metallic plate with a spring, and a guide pin. CONSTITUTION:An electrical connection jig has a supporting plate 1, a ratchet pin 3, a metallic plate 2 with a spring, and a guide pin 13. By using this jig, terminals installed in a flexible circuit board 4 and a rigid circuit board 8 are piled so as to contact each other. The guide pin 13 passes through the board 4 and the board 8 so as to fix the terminal positions, and at least the pin 3 passes through the board 8. The pin 3 passing through the board 8 is energized together with the metallic plate 2 so that terminals of the boards are brought into contact each other at specified pressure.

4. 发明专利

JPH06226942A LAMINATING JIG 失效
公开(公告)号：JPH06226942A
公开(公告)日：1994-08-16
申请号：JP2003493
申请日：1993-02-08
申请人： HITACHI CHEMICAL CO LTD
发明人： KUROKAWA HIROSHI
IPC分类号： B29C65/48 , B32B37/16 , H05K3/00 , B32B31/04
摘要： PURPOSE:To provide a laminating jig which responds to the dimensional change of a flexible wiring board in the horizontal and vertical directions and which does not deform guide hole. CONSTITUTION:The laminating jig consists of a plurality of movable guides 1 and a support 2 for softly receiving the movable guides, each of the movable guides 1 consists of a guide pin 11 and a plate-like guide support board 12 joined vertically therewith and the guide support board 12 alone is received in the support 2. A guide receiving part 21 is provided having the hole parts 211 capable of moving the guide support board 12 within such a range as to permit absorption of the dimensional change of a flexible wiring board in the same number as the movable guide and a support cover 22 is further provided having the guide hole parts 221 in the same number as the movable guide, so that the guide pin alone is projected from the surface of the support 2 with the movable guide received therein.

5. 发明专利

JPH0582931A FLEXIBLE PRINTED WIRING BOARD 失效
公开(公告)号：JPH0582931A
公开(公告)日：1993-04-02
申请号：JP24131091
申请日：1991-09-20
申请人： HITACHI CHEMICAL CO LTD
发明人： YAMADA HITOSHI , INANOBE MICHIO , KUROKAWA HIROSHI , YOSHIE SHUYA , IMAIZUMI KOYO , KUDO SATOYUKI , YOSHITOMI YASUNOBU
IPC分类号： H05K1/11 , H05K1/14 , H05K3/36
摘要： PURPOSE:To provide a flexible board markedly improved in soldering workability and soldering reliability during connecting the flexible board to another board. CONSTITUTION:In a flexible board comprising a conductor circuit 1 laid over one side or both sides of a support film 2, part of the flexible board has a terminal conductor circuit 3 for connection use to dispense with the support film 2 between both side faces of the connection conductor circuit.

6. 发明专利

JPH0786700A ELECTRIC CONNECTION JIG AND ELECTRIC CONNECTION METHOD USING THE JIG 失效
公开(公告)号：JPH0786700A
公开(公告)日：1995-03-31
申请号：JP22939093
申请日：1993-09-16
申请人： HITACHI CHEMICAL CO LTD
发明人： KUROKAWA HIROSHI
IPC分类号： H05K1/02 , H05K3/30
摘要： PURPOSE:To enhance simplified connection reliability by fixedly placing a metal plate on an elastic body on a support board in this order in such a fashion that a projection of the metal plate may agree to a spring unit of the elastic body and installing a fixing pin to the surface of the support board on which the metal plate and the elastic body are fixed. CONSTITUTION:There are provided a support board 1 made of a plastic molded component and a metal plate 2 having a stainless steel-made spring unit 2 and an elastic body 3 having a projection made of rubber molded component and a fixing pin 4 made of a plastic molded component. They are placed one upon another on the support board 1 in this order in such a fashion that the projection of the metal plate may agree to the spring unit and fixed with a bonding agent. A hole is bored on the surface of the support board on which the metal plate 2 and the elastic body 3 are fixed, thereby fixing the fixing pin 4 with the bonding agent. Two types of pins are used for the fixing pin 4. One is a pin 4 to which no slot is installed while the other is a pin 5 to which a ratchet is installed.

7. 发明专利

JPH02128500A MANUFACTURE OF FLEXIBLE PRINTED WIRING BOARD 失效
公开(公告)号：JPH02128500A
公开(公告)日：1990-05-16
申请号：JP28219188
申请日：1988-11-08
申请人： HITACHI CHEMICAL CO LTD
发明人： YOSHITOMI YASUNOBU , TAZAWA KAZUYUKI , ICHIGE HIROBUMI , KUROKAWA HIROSHI , YOSHIE SHUYA
IPC分类号： H05K13/04 , H05K1/00 , H05K3/34
摘要： PURPOSE:To prevent an adhesive agent or a adhesive film from being left unremoved on a wiring board by a method wherein an adhesive sheet whose front side and rear side are different from each other in adhesive power is interposed between a support sheet and a support plate in lamination making its smaller side in adhesive power face the support sheet and its other side larger in adhesive power face the support plate and heated. CONSTITUTION:Two or more wiring conductors 1 are supported with a support film 2, and an adhesive sheet 3 whose front and rear side are different from each other in adhesive power is interposed in lamination between the support sheet 2 of a flexible printed wiring board provided with an insulating film which coats for insulation a part of the wiring conductors 1 other than the part required for the connection and a support plate making its smaller side in adhesion power face the support film 2 and its other side larger in adhesive power face a support plate and bonded together with pressure. By this setup, when a flexible printed wiring board is separated off from a support plate, an adhesive sheet can be almost prevented from being left unremoved on the wiring board.

8. 发明专利

JP2001217539A METHOD OF MANUFACTURING WIRING BOARD 失效
公开(公告)号：JP2001217539A
公开(公告)日：2001-08-10
申请号：JP2000027175
申请日：2000-01-31
申请人： HITACHI CHEMICAL CO LTD
发明人： KUROKAWA HIROSHI , KONNO TATSUHIKO
IPC分类号： H05K3/42
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board which is superior in forming of micro-wirings, can form a high density circuit pattern more than the conventional one without needing plated leads for lines and through- holes, and keeps the variation accuracy of the circuit height at a high accuracy to avoid deteriorating the connection reliability. SOLUTION: The wiring board manufacturing method comprises a step (a) of boring holes for through-holes into a copper-clad laminate board, a step (b) of forming a layer susceptive of electrolytic plating or electroless plating on the inner walls of the holes for through-holes, a step (c) of selectively coating a plating resist on the surface except for the holes for through-holes and their vicinities, a step (d) of forming a plating layer of nickel or its alloy on at least the inner walls of the holes by electrolytic or electroless plating, a step (e) of stripping the selectively coated plating resist, a step (f) of forming an etching resist for protecting the plating layer on the through-hole inner walls and for forming required wirings, and a step (g) of selectively etching and removing copper foil portions uncovered with the etching resist.

9. 发明专利

JPH1154910A MANUFACTURE OF WIRING BOARD 失效
公开(公告)号：JPH1154910A
公开(公告)日：1999-02-26
申请号：JP21181797
申请日：1997-08-06
申请人： HITACHI CHEMICAL CO LTD
发明人： OSAWA MASAYUKI , IKEZOE YOSHIYUKI , OTSUKA OSAMU , KUROKAWA HIROSHI , ISO TOSHIAKI
IPC分类号： H05K3/42
摘要： PROBLEM TO BE SOLVED: To form fine wiring without deteriorating the connection reliability of the wiring by forming a layer for receiving an electroplated film on the internal surface of a hole which becomes a through hole and, at the same time, forming a plated layer of nickel or its alloy on at least the internal surface of the hole by electroplating. SOLUTION: A hole 6 which becomes a through hole is bored through a copper-plated epoxy resin-impregnated glass cloth laminate substrate manufactured by sticking copper foil 1 to both surfaces of a substrate 2 and a plated copper layer having a thickness of 0.5 μm is formed as a layer 3 for receiving an electroplated film. Then the layer 3 on the internal surface of the hole 6 is protected and, at the same time, an etching resist 4 is formed in the shape of leads on the layer 3 for receiving necessary wiring and electroplated film. Then the part of the copper on which the etching resist 4 is not formed is selectively etched off and a plated-nickel layer 5 having a thickness of 5 μm is formed. Therefore, fine wiring can be formed without deteriorating the connection reliability of the wiring.

10. 发明专利

JPH1146062A MANUFACTURING METHOD OF WIRING BOARD 失效
公开(公告)号：JPH1146062A
公开(公告)日：1999-02-16
申请号：JP19946997
申请日：1997-07-25
申请人： HITACHI CHEMICAL CO LTD
发明人： OSAWA MASAYUKI , IKEZOE YOSHIYUKI , OTSUKA OSAMU , KUROKAWA HIROSHI , ISO TOSHIAKI
IPC分类号： H05K3/42
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of wiring board economically and dramatically superior in the formation of fine wiring, without losing the reliability of connection. SOLUTION: This manufacturing method of wiring board consists of the five steps mentioned s follows: a. a through-hole 6 is made in copper plated laminated board. b. a layer 3 to be electroplated not to be non-electrolytically plated is formed on the inner wall of the through-hole 6. c. the layer 3 on the inner wall of the hole 6 is protected to be formed of an etching resist 4 taking the lead shape for electroplasting step. d. the copper part, not formed of the etching resist, is selectively etched away. e. a nickel or nickel alloy plating layer 5 is formed at least on the hole 6 inner wall by electroplating step.

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