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1. 发明专利

JP2000114693A MANUFACTURE OF WIRING BOARD 失效
公开(公告)号：JP2000114693A
公开(公告)日：2000-04-21
申请号：JP28393998
申请日：1998-10-06
申请人： HITACHI CHEMICAL CO LTD
发明人： KUROKAWA HIROSHI , OSAWA MASAYUKI , OTSUKA OSAMU , ISO TOSHIAKI , CHIAKI YOSHIRO
IPC分类号： H05K3/42 , H05K3/06
摘要： PROBLEM TO BE SOLVED: To provide a method by which such an economic wiring board can be manufactured that the difference between the top width and bottom width of a circuit is small and a wiring pattern can be maintained at such a thickness that the same peeling strength as that of the conventional wiring board can be secured without increasing the electric resistance. SOLUTION: In a method for manufacturing wiring board a wiring board is manufactured in such a way that the copper coil 1 of copper-plated laminated board formed by sticking the copper foil 1 to both surfaces of a substrate 2 is etched off in the thickness direction and a hole 3 is made through the laminated board. Then conductive particles are stuck to the whole surface of the laminated board including the internal surface of the hole 3 and a plating resist 5 is formed on the surface of the laminated board except the portion which becomes a circuit. Thereafter, the surface of the laminated body is electroplated 6 except the portion coated with the resist 5 and the resist 5 is stripped off. Finally, the copper foil 1 left in the portion from which the resist 5 has been stripped off is etched off.

2. 发明专利

JPH0429389A FLEXIBLE PRINTED CIRCUIT BOARD 失效
公开(公告)号：JPH0429389A
公开(公告)日：1992-01-31
申请号：JP13470890
申请日：1990-05-24
申请人： HITACHI CHEMICAL CO LTD
发明人： OTSUKA OSAMU , YOSHITOMI YASUNOBU , ICHIGE HIROBUMI
IPC分类号： H05K1/02 , H05K1/00
摘要： PURPOSE:To improve a surface mounting efficiency and yield in the case of surface mounting on a working panel by forming a part or all of a circuit board in U or L shape, and bending an insulating base material side or an insulating coating surface side in a cable state. CONSTITUTION:A cable I of a flexible printed circuit board of a predetermined shape is formed in a U or L shape, bent to an insulating base surface side or an insulation coating side at a bent position (a), and then bent to an insulation coating side of an insulating base surface side at a bent position (c) in a cable state. The bending may be performed by initially bending at the bending position (c) and then bending at the bending position (a). As the insulation base material and the insulating coating material, flexible insulating plastic film such as polyimide, polyester, etc., may be employed. Thus, the flexible circuit board can be efficiently surface mounted on a working panel, and a long printed circuit board of an application range or more of a manufacturing facility can be obtained.

3. 发明专利

JPH0427193A MULTILAYER FLEXIBLE PRINTED WIRING BOARD 失效
公开(公告)号：JPH0427193A
公开(公告)日：1992-01-30
申请号：JP13230890
申请日：1990-05-22
申请人： HITACHI CHEMICAL CO LTD
发明人： HANEHIRO HIDEKI , YOSHIDA MASATOSHI , OTSUKA OSAMU
IPC分类号： H05K3/46
摘要： PURPOSE:To improve the shape of a through hole and improve the reliability in connection by providing the inner layer of the through hole, whose circuit is connected with the conductor pattern of an inner layer, with a dummy land in the same shape as the land of a through hole whose circuit is connected. CONSTITUTION:An ultraviolet-ray hardening type etching resist is laminated on the film 1, both whose sides are lines with copper, to become an inner layer, and it is expose to the UV light through a negative film and is developed to form a resist pattern. Then, it is etched to form an inner layer circuit pattern, and through an interlayer adhesive 3, films 2, one side each of which is lined with copper, are stuck to both sides of the film 1 lined with copper. Then, using a numerical control boring machine, boring is performed at the specified position of the wiring board, and electrolytic plating is applied to form through hole copper plating 4. Subsequently, an outer layer circuit pattern is formed by the same process as the inner layer circuit processing.

4. 发明专利

JP2000212253A PRINTED CIRCUIT BOARD 失效
公开(公告)号：JP2000212253A
公开(公告)日：2000-08-02
申请号：JP1123999
申请日：1999-01-20
申请人： HITACHI CHEMICAL CO LTD
发明人： TAKANO MARE , ARATA MICHITOSHI , SASE SHIGEO , ISHIGAMI FUMIO , ISO TOSHIAKI , OTSUKA OSAMU , OSAWA MASAYUKI
IPC分类号： H05K1/03 , B32B27/38 , C08G59/40
摘要： PROBLEM TO BE SOLVED: To provide a printed circuit board an insulating substrate board of which is prepared from a material which has low moisture absorption properties and gives a copper-clad laminate exhibiting a low residual stress by using, as the material, an epoxy resin composition containing a phenol-added conjugated diene polymer, urea or its derivative, and a curing accelerator. SOLUTION: Preferably, the phenol-added diene polymer is a phenol-added butadiene polymer and the amount of a phenol added is 0.25 mol or lower based on 100 g of the polymer. Preferably, urea or its derivative is urea and/or a urea silane (e.g. γ-carbamylpropyltriethoxysilane). Preferably, the curing accelerator is an imidazole compound having the sec-amino group masked. The epoxy resin composition contains an epoxy resin having a viscosity at 25 deg.C 100 Pa.s or lower together with the above ingredients.

5. 发明专利

JP2000183486A CONNECTING MEMBER 失效
公开(公告)号：JP2000183486A
公开(公告)日：2000-06-30
申请号：JP35702298
申请日：1998-12-16
申请人： IBM , HITACHI CHEMICAL CO LTD
发明人： KOBAYASHI SHIGETAKA , OKI NORIO , NAGASAWA TAKASHI , ISO TOSHIAKI , OTSUKA OSAMU , MESAKI KUNIO , TAKAMOTO MITSUO
IPC分类号： H05K1/14
摘要： PROBLEM TO BE SOLVED: To enhance suppression of a short-circuit caused by an operating error by connecting conductors at the same pitch on a predetermined part as a pitch of connecting pads, and providing dummy conductors having the same pitch as that of the predetermined part even on a larger part than the connecting pitch. SOLUTION: A second board 21 has a part having a predetermined pitch of connecting pads and a part having larger pitch than that of the predetermined part. A width of a conductor 101 is preferably set to a width of 1/3 or less of a width of the connecting pad 201 of a second board 21, and 2/3 of the width of connecting pad 201 of the board 21. In the case of aligning for the connection, 2/3 of the width of the pad 201 of the board 21 can be prepared for the error. Further, a width of a conductor 101 of a surface not brought into contact with an insulating board 102 can be set to 1/3 or below of the width of the pad 201 of the board 21 by utilizing that a width of the conductor 101 of the surface not brought into contact with an insulating base material 102 becomes smaller than that of the conductor 101 of the surface brought into contact therewith. A pitch between the conductors is preferably in a range of 0.02 to 2 mm.

6. 发明专利

JPH1187884A PRODUCTION OF WIRING BOARD 失效
公开(公告)号：JPH1187884A
公开(公告)日：1999-03-30
申请号：JP20438997
申请日：1997-07-30
申请人： HITACHI CHEMICAL CO LTD
发明人： IWASAKI YORIO , SHIMIZU AKIRA , YAMAKAWA MASAE , TSUBOMATSU YOSHIAKI , OTSUKA OSAMU
IPC分类号： H05K3/00 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To stabilize adhesion by employing two or four copper foils having size substantially equal to one half or a quarter that of a board while arranging side by side, or making a slit in the copper toil such that the area thereof is divided substantially equal to one half or a quarter that of the board. SOLUTION: A copper foil 6 is laminated on a flexible board such that the adhesive of stage B touches the copper foil, a cushion material 8 is applied to the flexible board side and then they are hot pressed by two end plates and integrated. Subsequently, unnecessary copper foil is removed by etching to form a wiring pattern. In this regard, the size of the cushion member 8 is set substantially equal to one half or a quarter that of the flexible board or a slit is made so that such a relationship of size can be attained thus reducing the area to be pressed. According to the arrangement, fluctuation of pressure is suppressed and adhesion between the copper foil and the adhesive is stabilized.

7. 发明专利

JPH1154910A MANUFACTURE OF WIRING BOARD 失效
公开(公告)号：JPH1154910A
公开(公告)日：1999-02-26
申请号：JP21181797
申请日：1997-08-06
申请人： HITACHI CHEMICAL CO LTD
发明人： OSAWA MASAYUKI , IKEZOE YOSHIYUKI , OTSUKA OSAMU , KUROKAWA HIROSHI , ISO TOSHIAKI
IPC分类号： H05K3/42
摘要： PROBLEM TO BE SOLVED: To form fine wiring without deteriorating the connection reliability of the wiring by forming a layer for receiving an electroplated film on the internal surface of a hole which becomes a through hole and, at the same time, forming a plated layer of nickel or its alloy on at least the internal surface of the hole by electroplating. SOLUTION: A hole 6 which becomes a through hole is bored through a copper-plated epoxy resin-impregnated glass cloth laminate substrate manufactured by sticking copper foil 1 to both surfaces of a substrate 2 and a plated copper layer having a thickness of 0.5 μm is formed as a layer 3 for receiving an electroplated film. Then the layer 3 on the internal surface of the hole 6 is protected and, at the same time, an etching resist 4 is formed in the shape of leads on the layer 3 for receiving necessary wiring and electroplated film. Then the part of the copper on which the etching resist 4 is not formed is selectively etched off and a plated-nickel layer 5 having a thickness of 5 μm is formed. Therefore, fine wiring can be formed without deteriorating the connection reliability of the wiring.

8. 发明专利

JPH1146062A MANUFACTURING METHOD OF WIRING BOARD 失效
公开(公告)号：JPH1146062A
公开(公告)日：1999-02-16
申请号：JP19946997
申请日：1997-07-25
申请人： HITACHI CHEMICAL CO LTD
发明人： OSAWA MASAYUKI , IKEZOE YOSHIYUKI , OTSUKA OSAMU , KUROKAWA HIROSHI , ISO TOSHIAKI
IPC分类号： H05K3/42
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of wiring board economically and dramatically superior in the formation of fine wiring, without losing the reliability of connection. SOLUTION: This manufacturing method of wiring board consists of the five steps mentioned s follows: a. a through-hole 6 is made in copper plated laminated board. b. a layer 3 to be electroplated not to be non-electrolytically plated is formed on the inner wall of the through-hole 6. c. the layer 3 on the inner wall of the hole 6 is protected to be formed of an etching resist 4 taking the lead shape for electroplasting step. d. the copper part, not formed of the etching resist, is selectively etched away. e. a nickel or nickel alloy plating layer 5 is formed at least on the hole 6 inner wall by electroplating step.

9. 发明专利

JP2000183480A WIRING BOARD AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JP2000183480A
公开(公告)日：2000-06-30
申请号：JP35702198
申请日：1998-12-16
申请人： IBM , HITACHI CHEMICAL CO LTD
发明人： KOBAYASHI SHIGETAKA , OTSUKA OSAMU , ISO TOSHIAKI , KUROKAWA HIROSHI , OSAWA MASAYUKI
IPC分类号： H05K1/11 , H05K1/14 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a wiring board with improved suppression of short- circuiting failures, and its manufacturing method. SOLUTION: A wiring board is provided with a plurality of conductors 6 for terminal which are in parallel at the end part of a substrate 1, and is also provided with a conductor 3 to a first terminal, that is formed over an outer shape line 2 of the end part before subjecting it to shape machining and a conductor 4 for a second terminal, that is formed only on the inside from the outer shape line 2 of the end part. The conductor 3 for the first terminal and the conductor 4 for the second terminal are formed alternately.

10. 发明专利

JP2000049433A CONNECTING MEMBER 失效
公开(公告)号：JP2000049433A
公开(公告)日：2000-02-18
申请号：JP21494698
申请日：1998-07-30
申请人： HITACHI CHEMICAL CO LTD
发明人： OKI NORIO , NAGASAWA TAKASHI , ISO TOSHIAKI , OTSUKA OSAMU , MESAKI KUNIO
IPC分类号： H05K1/14 , G09F9/00
摘要： PROBLEM TO BE SOLVED: To suppress short-circuiting due to operation errors by providing a part which comprises an insulating base and a conductor and is connected to terminals of a substrate with a conductor of specified thickness and of the same width as the part. SOLUTION: A connecting member comprises terminals of conductor and an insulating base supporting the conductor. Since a conductor less than 0.02 mm wide can not be subject to etching and a conductor of more than 1 mm width can be connected without heating and stretching the connecting member, the range between 0.03 and 0.1 mm is preferable. The pitch between terminals where the pitch is constant is in the range between 0.04 mm-0.02 mm since the etching can not be performed when the pitch is more than 2 mm and connection can be performed without heating and stretching when the pitch is more than 2 mm. By providing the part where the substrate and terminals are connected with conductor of width 1/3 or less than the width of the part, short- circuits due to operation errors can be suppressed.

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