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    • 1. 发明专利
    • Electroplating apparatus for blind hole
    • 用于盲孔的电镀设备
    • JP2013159832A
    • 2013-08-19
    • JP2012023300
    • 2012-02-06
    • Honda Motor Co Ltd本田技研工業株式会社
    • AKIYOSHI HIROKAZUOGAWA YOSHIMITSUTOMIYA SHINGOORIHARA MASAYUKIFURUKAWA YUKI
    • C25D13/14C25D17/00C25D17/12
    • PROBLEM TO BE SOLVED: To provide an electroplating apparatus for a blind hole, which is capable of forming a consistent plating film, and excellent in productivity.SOLUTION: A electroplating apparatus 10 for electroplating the inner side of a blind hole H having an opening part on one end and a bottom wall part B on the other end, includes: treatment tanks 11a-11d for storing liquid; a manifold 14 to be communicated with the treatment tanks via pipes 12, 13 having a valve mechanism; a tubular non-soluble anode 16 having a first liquid flow passage 15 in which the liquid is supplied from the manifold, or the liquid is discharged to the manifold; a power source unit PS for supplying the voltage so that the non-soluble anode forms an anode and the blind hole forms a cathode; a magnet chuck 18 having a second liquid flow passage 17 in which the liquid is discharged from the blind hole to the manifold, or the liquid is supplied from the manifold to the blind hole, and the non-soluble anode is positioned to the blind hole irrespective of the position of the opening part; and a pump P for running the liquid from the treatment tanks via the first and the second liquid flow passages.
    • 要解决的问题:提供一种能够形成一致的镀膜的盲孔电镀装置,并且生产率优异。解决方案:一种用于电镀具有开口部分的盲孔H的内侧的电镀装置10, 另一端的一端和底壁部分B包括:用于储存液体的处理槽11a-11d; 歧管14,经由具有阀机构的管道12,13与处理槽连通; 具有第一液体流道15的管状非可溶性阳极16,液体从歧管供应,或液体被排出到歧管; 用于提供电压的电源单元PS,使得非可溶性阳极形成阳极,盲孔形成阴极; 具有第二液体流道17的磁体卡盘18,液体从盲孔排出到歧管,或者液体从歧管供应到盲孔,并且非可溶性阳极被定位到盲孔 不管开口部分的位置如何; 以及用于经由第一和第二液体流动通道从处理槽运行液体的泵P.