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1. 发明专利

JP2005219116A Metal thin sheet butt welding method 有权
标题翻译：金属薄板焊接方法
公开(公告)号：JP2005219116A
公开(公告)日：2005-08-18
申请号：JP2004032416
申请日：2004-02-09
申请人： Honda Motor Co Ltd , 本田技研工業株式会社
发明人： TAKAHASHI TOMOJI , NAKAJIMA KATSUYUKI , ORIHARA MASAYUKI
IPC分类号： B23K10/02 , B23K9/095 , B23K26/00 , B23K26/20 , B23K103/04
摘要： PROBLEM TO BE SOLVED: To provide a metal thin sheet butt welding method capable of suppressing evaporation of Mn in a metal sheet consisting of Mn-containing austenitic stainless steel. SOLUTION: A heat source 2 is scanned along butted parts 11 at which edges of metal sheets 1 consisting of austenitic stainless steel containing Mn are butted to each other, and the butted parts 11 is irradiated with energy from the heat source 2 to melt and integrate the butted parts 11 with each other. The heat source 2 has the power density in the range of 0.3-5 kW/mm 2 . The heat source 2 is semi-conductor laser or plasma arc. The width of a molten part 17 formed when irradiating the butted parts 11 with the energy from the heat source 2 is set to be in the range of 3.9-7.8 times of the thickness of the metal sheets 1. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供能够抑制由含Mn奥氏体不锈钢构成的金属板中的Mn的蒸发的金属薄片对接焊接方法。解决方案：沿着对接部件11扫描热源2，在该对接部件11处，由含有Mn的奥氏体不锈钢构成的金属板1的边缘彼此对接，并且将对接部件11从来自热源2的能量照射到将对接部分11彼此融化并整合。热源2的功率密度在0.3-5kW / mm 2的范围内。热源2是半导体激光或等离子弧。将来自热源2的能量照射对接部11时形成的熔融部17的宽度设定为金属板1的厚度的3.9〜7.8倍的范围。版权所有（C））2005年，日本特许厅和NCIPI

2. 发明专利

JP2005219115A Butt welding method of metallic sheet 审中-公开
标题翻译：金属片的焊接方法
公开(公告)号：JP2005219115A
公开(公告)日：2005-08-18
申请号：JP2004032415
申请日：2004-02-09
申请人： Honda Motor Co Ltd , 本田技研工業株式会社
发明人： NAKAJIMA KATSUYUKI , ORIHARA MASAYUKI , TAKAHASHI TOMOJI
IPC分类号： B23K26/00 , B23K26/20
摘要： PROBLEM TO BE SOLVED: To provide a butt welding method of a metallic sheet by which the generation of blowholes having a size of ≥ 40 μm in the diameter is prevented. SOLUTION: By making a heat source 12 scan along the butted part 11 where the edges of the metallic sheet are butted each other and forming a molten zone 17 including the butted part 11 by irradiating energy from the heat source 12 and the butted part 11 is integrated. The heat source 12 is provided with the power density of 3-5 kW/mm 2 and the butted part 11 is irradiated with the energy from the heat source 12 so that the width of the molten zone 17 is ≥ 3.9 times the thickness of the metallic sheet 1. The butted part 11 is irradiated with the energy from the heat source 12 so that the width of the molten zone 17 is preferably in the range of 3.9-7.8 times the thickness of the metallic sheet 1, furthermore, preferably in the range of 4.8-7.8 times. The heat source 12 is a semiconductor laser or a plasma arc. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种金属板的对接焊接方法，通过该方法可以防止直径产生≥40μm尺寸的气孔。解决方案：通过使热源12沿着对接部分11扫描，金属片的边缘彼此对接并且通过照射来自热源12的能量和对接形成包括对接部分11的熔融区17 第11部分是集成的。热源12具有3-5kW / mm 2的功率密度，并且对接部分11被来自热源12的能量照射，使得熔融区17的宽度为 ≥金属片1的厚度的3.9倍。对接部分11被来自热源12的能量照射，使得熔融区17的宽度优选在金属片的厚度的3.9-7.8倍的范围内 1，此外优选在4.8-7.8倍的范围内。热源12是半导体激光器或等离子弧。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2013159832A Electroplating apparatus for blind hole 审中-公开
标题翻译：用于盲孔的电镀设备
公开(公告)号：JP2013159832A
公开(公告)日：2013-08-19
申请号：JP2012023300
申请日：2012-02-06
申请人： Honda Motor Co Ltd , 本田技研工業株式会社
发明人： AKIYOSHI HIROKAZU , OGAWA YOSHIMITSU , TOMIYA SHINGO , ORIHARA MASAYUKI , FURUKAWA YUKI
IPC分类号： C25D13/14 , C25D17/00 , C25D17/12
摘要： PROBLEM TO BE SOLVED: To provide an electroplating apparatus for a blind hole, which is capable of forming a consistent plating film, and excellent in productivity.SOLUTION: A electroplating apparatus 10 for electroplating the inner side of a blind hole H having an opening part on one end and a bottom wall part B on the other end, includes: treatment tanks 11a-11d for storing liquid; a manifold 14 to be communicated with the treatment tanks via pipes 12, 13 having a valve mechanism; a tubular non-soluble anode 16 having a first liquid flow passage 15 in which the liquid is supplied from the manifold, or the liquid is discharged to the manifold; a power source unit PS for supplying the voltage so that the non-soluble anode forms an anode and the blind hole forms a cathode; a magnet chuck 18 having a second liquid flow passage 17 in which the liquid is discharged from the blind hole to the manifold, or the liquid is supplied from the manifold to the blind hole, and the non-soluble anode is positioned to the blind hole irrespective of the position of the opening part; and a pump P for running the liquid from the treatment tanks via the first and the second liquid flow passages.
摘要翻译：要解决的问题：提供一种能够形成一致的镀膜的盲孔电镀装置，并且生产率优异。解决方案：一种用于电镀具有开口部分的盲孔H的内侧的电镀装置10，另一端的一端和底壁部分B包括：用于储存液体的处理槽11a-11d; 歧管14，经由具有阀机构的管道12,13与处理槽连通; 具有第一液体流道15的管状非可溶性阳极16，液体从歧管供应，或液体被排出到歧管; 用于提供电压的电源单元PS，使得非可溶性阳极形成阳极，盲孔形成阴极; 具有第二液体流道17的磁体卡盘18，液体从盲孔排出到歧管，或者液体从歧管供应到盲孔，并且非可溶性阳极被定位到盲孔不管开口部分的位置如何; 以及用于经由第一和第二液体流动通道从处理槽运行液体的泵P.

4. 发明专利

JP2013159831A Surface treatment method of die cooling hole part, and die 有权
标题翻译： DIE冷却孔部件和DIE的表面处理方法
公开(公告)号：JP2013159831A
公开(公告)日：2013-08-19
申请号：JP2012023299
申请日：2012-02-06
申请人： Honda Motor Co Ltd , 本田技研工業株式会社
发明人： AKIYOSHI HIROKAZU , OGAWA YOSHIMITSU , TOMIYA SHINGO , ORIHARA MASAYUKI
IPC分类号： C23C28/00 , B21D37/01 , B21D37/16 , B21D37/20 , C21D1/06 , C23C8/02 , C23C8/26 , C23C8/80 , C25D5/02 , C25D7/00
摘要： PROBLEM TO BE SOLVED: To provide a surface treatment method of a die cooling hole part, which is excellent in stress corrosion cracking resistance, and to provide a die.SOLUTION: A surface treatment method of a die cooling hole part, for performing the surface treatment of a cooling hole part H formed in a die M, includes: a vacuum pulse nitriding treatment step of forming a nitrided layer 40 in the cooling hole part H by the vacuum pulse nitriding treatment which performs the vacuuming at least once during the nitriding treatment; and a sacrifice anti-corrosion treatment step of forming a metal layer consisting of a metal with the ionization tendency larger than that of Fe, on the nitrided layer 40.
摘要翻译：要解决的问题：提供一种模具冷却孔部分的表面处理方法，其具有优异的耐应力腐蚀开裂性，并提供模具。解决方案：模具冷却孔部分的表面处理方法，用于执行表面在模具M中形成的冷却孔部分H的处理包括：真空脉冲氮化处理步骤，通过真空脉冲氮化处理在冷却孔部分H中形成氮化层40，在氮化处理期间进行至少一次抽真空 ; 以及在氮化层40上形成电离倾向大于Fe的金属构成的金属层的牺牲防腐蚀处理工序。

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