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1. 发明专利

JP2003309224A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2003309224A
公开(公告)日：2003-10-31
申请号：JP2002115768
申请日：2002-04-18
申请人： Hitachi Ltd , Nitto Shinko Kk , 日東シンコー株式会社 , 株式会社日立製作所
发明人： OGAWA TOSHIO , NAKATSU KINYA , YAGAWA MASAYUKI , FUJIKI ATSUSHI , KATSUDA KOJI
IPC分类号： H01L23/14 , H01L25/07 , H01L25/18
CPC分类号： H01L24/73 , H01L2224/32245 , H01L2224/45124 , H01L2224/48247 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/00012 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device having high reliability and low thermal resistance. SOLUTION: The semiconductor device has such a structure that a lead frame 13 which constitutes a conductor of a main circuit is bonded on a base plate 17 via resin insulating layers 15 and 16, and a semiconductor element 11 for switching is fastened on the lead frame 13. The resin insulation layer is composed of a plurality of resin layers formed of different materials, with the layer (B layer) 16 in contact with the base plate formed of a resin material having high insulation reliability and the layer (L layer) 15 in contact with the lead frame having a low elastic modulus in a high temperature region of 100°C or higher. The elastic modulus of the L layer is adjusted to not more than 0.01 times as that of the B layer at 100°C. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供具有高可靠性和低热阻的半导体器件。解决方案：半导体器件具有这样的结构：构成主电路的导体的引线框架13通过树脂绝缘层15和16接合在基板17上，并将用于切换的半导体元件11紧固在引线框13.树脂绝缘层由多个由不同材料形成的树脂层组成，层（B层）16与由绝缘可靠性高的树脂材料形成的基板接触，层（L 层）在100℃以上的高温区域与具有低弹性模量的引线框接触。在100℃下将L层的弹性模量调整为不超过B层的弹性模量的0.01倍。版权所有（C）2004，JPO

2. 发明专利

JP2010035347A Power conversion device and electric vehicle 有权
标题翻译：电力转换装置和电动车
公开(公告)号：JP2010035347A
公开(公告)日：2010-02-12
申请号：JP2008195341
申请日：2008-07-29
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： NAKATSU KINYA , SUZUKI HIDEYO , NISHIKIMI FUSANORI , MATSUO SOJI , SATO TOSHIYA
IPC分类号： H02M7/48 , B60K11/02 , B60L9/18 , B60L11/14 , H01L23/34
CPC分类号： H05K5/0026 , B60L11/00 , B60L2200/26 , H01L2224/48091 , H01L2224/48472 , H01L2224/49111 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H02J7/0029 , H02M7/003 , H05K7/1432 , H05K7/20927 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a power conversion device wherein it is possible to cool the wiring boards of a power module and a capacitor and yet reduce the inductance of wiring connecting the capacitor and the power module. SOLUTION: A metal case includes an enclosure 12 comprising a side wall portion, an upper case 10, and a lower case 16. A first area S1 is formed between a cooling jacket 19A provided at the inner circumferential portion of the side wall portion and the lower case 16. The area between the cooling jacket 19A and the upper case 10 is divided into a second area S2 positioned underneath and a third area S3 positioned above by a metal base plate 11. First and second power modules 300 are fixed on the upper face 410S of the cooling jacket 19A. A capacitor module 500 is provided in the first area S1; drive circuits 174A, 174B that respectively drive the inverter circuits 144, 145 of the individual power modules 300 are provided in the second area S2; and a control circuit 172 that controls the driver circuits 174A, 174B is provided in the third area S3. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种电力转换装置，其中可以冷却功率模块和电容器的布线板，并且还可以降低连接电容器和电源模块的布线的电感。解决方案：金属外壳包括包括侧壁部分，上壳体10和下壳体16的外壳12.第一区域S1形成在设置在侧壁的内周部分的冷却套19A之间部分和下壳16.冷却套19A和上壳体10之间的区域被划分为位于下方的第二区域S2和位于金属底板11上方的第三区域S3。第一和第二功率模块300固定在冷却套19A的上表面410S上。电容器模块500设置在第一区域S1中; 分别驱动各个功率模块300的反相器电路144,145的驱动电路174A，174B设置在第二区域S2中; 并且在第三区域S3中设置有控制驱动电路174A，174B的控制电路172。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2009081993A Power converter 有权
标题翻译：电源转换器
公开(公告)号：JP2009081993A
公开(公告)日：2009-04-16
申请号：JP2009000018
申请日：2009-01-05
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： AZUMA KATSUNORI , MORI MUTSUHIRO , NAKATSU KINYA
IPC分类号： H02M7/48 , H01L25/07 , H01L25/18
CPC分类号： H01L2224/48137 , H01L2224/48139 , H01L2224/49111 , H01L2224/49175 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/19107 , H01L2924/30107 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a power converter that achieves high reliability by reducing a parasitic inductance. SOLUTION: The power converter includes each capacitor module having a DC terminal, each inverter for converting a DC current into an AC current, and each heat-dissipating fin set for cooling each inverter. The inverter has each power module having a plurality of power semiconductor elements. The power module is provided with a metal base, an insulating substrate provided on one face of the metal base, a power semiconductor element fixed to the insulating substrate, and a DC terminal. The heat-dissipating fin set is provided on the other face of the metal base. The DC terminal of the power module and that of the capacitor module are respectively composed by laminating flat-plate conductors via each insulator. Each tip part of the positive/negative DC terminals is mutually bent in an opposite direction. The bent face is made as a connecting face between the power module and the capacitor module. Each insulator overlaps with each other on the connecting face. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供通过减小寄生电感实现高可靠性的功率转换器。电源转换器包括具有DC端子的每个电容器模块，用于将DC电流转换为AC电流的每个逆变器，以及用于冷却每个逆变器的每个散热片。逆变器具有每个功率模块具有多个功率半导体元件。功率模块设置有金属基体，设置在金属基体的一个面上的绝缘基板，固定到绝缘基板的功率半导体元件和DC端子。散热翅片组设置在金属基体的另一面上。功率模块的直流端子和电容器模块的直流端子分别通过每个绝缘体层压平板导体。正/负直流端子的每个尖端部分在相反的方向相互弯曲。弯曲面作为电源模块和电容器模块之间的连接面。每个绝缘体在连接面上彼此重叠。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2008061282A Power conversion device 审中-公开
标题翻译：电源转换器件
公开(公告)号：JP2008061282A
公开(公告)日：2008-03-13
申请号：JP2006231460
申请日：2006-08-29
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： AZUMA KATSUNORI , MORI MUTSUHIRO , NAKATSU KINYA
IPC分类号： H02M7/00
CPC分类号： H01G4/228 , H01G2/08 , H01G4/224
摘要： PROBLEM TO BE SOLVED: To provide a power conversion device with reduced inductance. SOLUTION: The power conversion device is provided with a metal cabinet having a refrigerant passage, a power module which is loaded on the metal cabinet and has a plurality of power semiconductor elements, a capacitor module having a plurality of capacitors and a laminated body where a first plate conductor and a second plate conductor for electrically connecting the power module and the capacitors are laminated through an insulating member. The laminated body is provided with a first connection terminal which is constituted of a part of the first plate conductor and is brought into contact with a third connection terminal of the power module and a second connection terminal which is constituted of a part of the second plate conductor and is brought into contact with a fourth connection terminal of the power module. The laminated body is constituted in such a way that the first plate conductor and the second plate conductor extend while being laminated via the insulating member from the capacitor module to just before the first connection terminal and the second connection terminal. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供具有降低的电感的功率转换装置。解决方案：电力转换装置设置有具有制冷剂通道的金属柜，负载在金属柜上的功率模块，并具有多个功率半导体元件，具有多个电容器的电容器模块和层压其中用于电连接功率模块和电容器的第一板导体和第二板导体通过绝缘构件层压。层叠体设置有第一连接端子，该第一连接端子由第一板状导体的一部分构成并与功率模块的第三连接端子接触，第二连接端子由第二板的一部分构成并与电源模块的第四连接端子接触。层叠体构成为使得第一板状导体和第二板状导体在通过绝缘构件从电容器模块层叠到第一连接端子和第二连接端子之前延伸。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2008004953A Semiconductor module, and power converting device using the same 有权
标题翻译：半导体模块和使用该模块的功率转换器件
公开(公告)号：JP2008004953A
公开(公告)日：2008-01-10
申请号：JP2007203754
申请日：2007-08-06
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： HACHIMAN KOICHI , NAKATSU KINYA
IPC分类号： H01L25/07 , H01L25/18 , H02M7/00
CPC分类号： H01L2224/45124 , H01L2224/48091 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/19107 , H01L2924/30107 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor module capable of having a smoothing capacitor built-in the module, miniaturizing the module, and reducing a cost, and to provide a power converting device using the same. SOLUTION: The semiconductor module including a module case 7, a base 1 provided in the case 7, a ceramic substrate 2 that is placed on the base 1 and has a wiring member on its surface, a power semiconductor element 3 that is placed on the substrate 2 and is electrically connected to the wiring member, a lead frame 6 electrically connected to the element 3, an output side conductive member electrically connected to the element 3, and the capacitor 64 electrically connected to the frame 6, wherein the capacitor 64 can be configured by the one having a plurality of capacitor terminals 11 that electrically connect a capacitor element 10 fixed to the case 7, the element 10, and the frame 6. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够具有内置该模块的平滑电容器的半导体模块，使模块小型化并降低成本，并提供使用该半导体模块的电力转换装置。解决方案：半导体模块包括模块壳体7，设置在壳体7中的基座1，陶瓷基板2，放置在基座1上并且在其表面上具有布线构件，功率半导体元件3是电连接到基板2上并与布线部件电连接，与元件3电连接的引线框架6，与元件3电连接的输出侧导电部件和与框架6电连接的电容器64，其中，电容器64可以由具有多个电容端子11的电容器构成，电容器端子11电连接固定到壳体7的电容器元件10，元件10和框架6.版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2004335625A Semiconductor module and power conversion apparatus using the same 有权
公开(公告)号：JP2004335625A
公开(公告)日：2004-11-25
申请号：JP2003127641
申请日：2003-05-06
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： HACHIMAN KOICHI , NAKATSU KINYA
IPC分类号： H01L25/07 , H01L25/18 , H02M7/48
CPC分类号： H01L2224/45124 , H01L2224/48091 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/19107 , H01L2924/30107 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor module capable of having a built-in smoothing capacitor, and realizing miniaturization and low cost, and to provide a power conversion apparatus using the same. SOLUTION: The semiconductor module has a module case 7, a base 1 provided on the module case 7, ceramic substrate 2 being placed on the base 1 and having a wiring member on its surface, power semiconductor element 3 being placed on the ceramic substrate 2 and electrically connected to the wiring member, lead frame 6 electrically connected to the semiconductor element 3, output side conductive member electrically connected to the semiconductor element 3, and smoothing capacitor 64 electrically connected to the lead frame 6. The smoothing capacitor 64 is constituted by a capacitor having a capacitor element 10 fixed on the module case 7 and a plurality of capacitor terminals 11 for electrically connecting the capacitor element 10 to the lead frame 6. COPYRIGHT: (C)2005,JPO&NCIPI

7. 发明专利

JP2009044891A Power converter 有权
标题翻译：电源转换器
公开(公告)号：JP2009044891A
公开(公告)日：2009-02-26
申请号：JP2007208505
申请日：2007-08-09
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： NISHIKIMI FUSANORI , NAKATSU KINYA
IPC分类号： H02M7/48 , B60K6/26 , B60K6/445 , B60L3/00 , B60L9/18
CPC分类号： H02M7/5387 , H01L2224/48091 , H01L2224/48137 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/19107 , H02M7/003 , H02M7/219 , H05K7/20927 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To obtain improvement in reliability, reduction in size and in weight, and improvement in the assemblability of a power converter provided with a power module including series circuits of lower and upper arms, and to provide a capacitor module for smoothing a power supply, and a cooling part that includes a cooling-water flow passage. SOLUTION: The power converter 200 is provided with a power module 300 having an inverter circuit and a metal base, a capacitor module 500 for smoothing, and a cooling part 9 having a cooling-water flow passage 19. The power module 300 and the capacitor module 500 have a sandwich structure, sandwiching the cooling-water flow passage 19 therebetween. DC positive electrode-negative electrode terminals 314, 316 of the power module are connected directly to capacitor terminals 504, 506 of the capacitor module, without making another connector interpose therebetween. Holes provided in AC bus-bars 308, 310 and 312 of the power module 300 are fitted with protruding parts, provided on a case so as to support the AC busbars 308, 310 and 312, while isolating them from external vibration. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决方案：为了获得可靠性的提高，尺寸和重量的减小，以及具有包括下臂和上臂的串联电路的功率模块的功率转换器的组装性的提高，并且提供电容器模块用于使电源平滑，以及包括冷却水流动通道的冷却部件。电源转换器200设置有具有逆变器电路和金属基座的电力模块300，用于平滑的电容器模块500和具有冷却水流动通道19的冷却部件9.功率模块300 并且电容器模块500具有将冷却水流路19夹在其间的夹层结构。功率模块的直流正极 - 负极端子314,316直接连接到电容器模块的电容器端子504,506，而不会在其间插入另一个连接器。设置在功率模块300的AC母线308,310和312中的孔装配有突出部分，其设置在壳体上，以便支撑AC母线308,310和312，同时将它们与外部振动隔离。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2007299781A Electronic circuit device, electronic circuit module and power conversion device 有权
标题翻译：电子电路装置，电子电路模块和电力转换装置
公开(公告)号：JP2007299781A
公开(公告)日：2007-11-15
申请号：JP2006123835
申请日：2006-04-27
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： TOKUYAMA TAKESHI , NAKATSU KINYA , KAWABATA ATSUSHI
IPC分类号： H01L25/07 , B60L9/18 , H01L25/18 , H02M7/48
CPC分类号： H05K7/02 , H01G2/08 , H01G4/224 , H01L24/73 , H01L2224/32245 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/73215 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H02M7/003 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To mainly provide an electric circuit device capable of establishing compatibility between improvement of cooling capability and reduction of loss in operation due to a wiring inductance. SOLUTION: The above problem can be solved by configuring a plurality of planar conductors electrically connected to a plurality of semiconductor chips, so that the conductors are thermally connected to both chip surfaces of each of the semiconductor chips, heat can be radiated from the chip surfaces of each of the semiconductor chips and, of the planar conductors, conductor surfaces of the planar conductor for a DC positive electrode and the planar conductor for a DC negative electrode oppose to each other. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：主要提供一种电路装置，其能够在由于布线电感引起的冷却能力的提高和操作损耗的减少之间建立兼容性。解决方案：通过配置电连接到多个半导体芯片的多个平面导体，可以解决上述问题，使得导体热连接到每个半导体芯片的两个芯片表面，热量可以从每个半导体芯片和平面导体的芯片表面，用于DC正极的平面导体的导体表面和用于DC负极的平面导体彼此相对。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2007115946A Power module, power conversion device, and on-vehicle electrical machinery system 有权
标题翻译：电力模块，动力转换装置和车载电机系统
公开(公告)号：JP2007115946A
公开(公告)日：2007-05-10
申请号：JP2005306820
申请日：2005-10-21
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： INABA MASAMITSU , AZUMA KATSUNORI , MORI MUTSUHIRO , NAKATSU KINYA
IPC分类号： H01L25/07 , B60L11/14 , H01L25/18 , H02M7/48 , H02M7/5387 , H02P27/06
CPC分类号： H01L2224/48111 , H01L2224/49111 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/19107 , H01L2924/30107 , Y02T10/642 , Y02T10/7077 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a power module which is capable of reducing inductance around its output terminal and furthermore reducing a surge voltage, and to provide a power conversion device and an on-vehicle electrical machinery system. SOLUTION: In the power module, an anode-side emitter conductor 3 connected to the emitter electrode of an anode-side power semiconductor device Mpu is electrically connected to an output terminal U with two or more aluminum wires 7, a cathode-side collector conductor 4 connected to the collector electrode of a cathode-side power semiconductor device Mnu is electrically connected to the output terminal U with two or more aluminum wires 9, and the anode-side emitter conductor 3 connected to the emitter electrode of the anode-side power semiconductor device Mpu is electrically connected with two or more aluminum wires 8 to the cathode-side collector conductor 4 connected to the collector electrode of the cathode-side power semiconductor device Mnu. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供能够降低其输出端子周围的电感并进一步降低浪涌电压的电源模块，以及提供电力转换装置和车载电机系统。解决方案：在功率模块中，连接到阳极侧功率半导体器件Mpu的发射极的阳极侧发射极导体3通过两根或多根铝线7电连接到输出端U，与阴极侧功率半导体器件Mnu的集电极连接的侧面集电体导体4通过两根以上的铝线9与输出端子U电连接，阳极侧发射极导体3与阳极的发射电极连接侧功率半导体器件Mpu与两根以上的铝线8电连接到与阴极侧功率半导体元件Mnu的集电极连接的阴极侧集电体导体4。版权所有（C）2007，JPO＆INPIT

10. 发明专利

JP2007028793A Ac motor driver and control method of the same 有权
标题翻译：交流电机驱动器及其控制方法
公开(公告)号：JP2007028793A
公开(公告)日：2007-02-01
申请号：JP2005207199
申请日：2005-07-15
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： YASUJIMA TOSHIYUKI , MIYAZAKI HIDEKI , IWAJI YOSHITAKA , NOUCHI TAKAO , NAKATSU KINYA
IPC分类号： H02P27/06
CPC分类号： H02P6/18
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive and small-footprint AC motor driver, an AC motor controller for accurately controlling a torque in a range from a zero speed to a high-speed rotation independent of a PWM pulse pattern, an electric actuator, or a vehicle. SOLUTION: The AC motor driver is provided with an inverter 1 for supplying an AC motor 300 with power, a current sensor for detecting a current flowing in the motor or the inverter, a rotation sensor 340 for detecting a rotation of a rotor in the motor, and a controller for driving the inverter. The controller estimates a three-phase motor current value by using a current detection value detected by the current sensor and a rotor rotation position, and controls the inverter by using on the motor current estimation value. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供廉价且占地面积小的AC电动机驱动器，AC电动机控制器用于在与PWM脉冲模式无关的零速度至高速旋转的范围内精确地控制转矩，电动执行器或车辆。
解决方案：交流电动机驱动器设置有用于向AC电动机300供电的逆变器1，用于检测在电动机或逆变器中流动的电流的电流传感器，用于检测转子的旋转的旋转传感器340 在电动机中，以及用于驱动逆变器的控制器。控制器通过使用由电流传感器检测的电流检测值和转子旋转位置来估计三相电动机电流值，并且通过使用电动机电流估计值来控制逆变器。版权所有（C）2007，JPO＆INPIT

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