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1. 发明专利

JPS57122556A Lead frame and manufacture of semiconductor device using the same 失效
标题翻译：使用相同的半导体器件的引线框架和制造
公开(公告)号：JPS57122556A
公开(公告)日：1982-07-30
申请号：JP793081
申请日：1981-01-23
申请人： Hitachi Ltd , Hitachi Tokyo Electronics Co Ltd
发明人： FUJIOKA SHIYUNICHIROU
IPC分类号： H01L23/04 , H01L23/495 , H01L23/50
CPC分类号： H01L23/49548 , H01L2224/48 , H01L2224/48091 , H01L2224/48247 , H01L2924/15153 , H01L2924/15165 , H01L2924/16152 , H01L2924/00014 , H01L2924/00
摘要： PURPOSE:To facilitate the bending of the prescribed position of a lead frame of flat or bent shape by forming a recess at a part or the entirety of the part to be bent of the lead, thereby maintaining the strength of the bent part. CONSTITUTION:A recess 2 is formed in advance at the bent part 1B of a lead frame 1 to be formed in a flat shape. This frame is, for example, fusion-bonded to a ceramic substrate 3 via a glass layer 4, a pellet 5 is mounted, is hermetically sealed with a cap 8, and the lead is bent at the part 1A to be bent. Or, after the lead 1 is bent at the recess 2, the pellet 5 is mounted and hermetically sealed. The hermetical seal may also be performed by a method of molding resin. In this manner, the residual stress produced at the bent part can be reduced, thereby sufficiently maintaining the strength and facilitating the binding of the frame.
摘要翻译：目的：通过在引线的弯曲部分的一部分或全部形成凹部来促进平面或弯曲形状的引线框架的规定位置的弯曲，从而保持弯曲部分的强度。构成：在引线框架1的弯曲部1B处预先形成凹部2，以形成为平坦形状。该框架例如通过玻璃层4与陶瓷基板3熔接，安装有颗粒5，用盖8气密地密封，引线在弯曲部分1A弯曲。或者，在引线1在凹部2弯曲之后，将颗粒5安装并密封。气密密封也可以通过树脂模塑的方法进行。以这种方式，可以减少在弯曲部处产生的残余应力，从而充分地保持强度并且便于框架的结合。

2. 发明专利

JPS5923532A Wire bonder 失效
标题翻译： WIRE BONDER
公开(公告)号：JPS5923532A
公开(公告)日：1984-02-07
申请号：JP13196982
申请日：1982-07-30
申请人： Hitachi Ltd , Hitachi Tokyo Electronics Co Ltd
发明人： FUJIOKA SHIYUNICHIROU
IPC分类号： H01L21/60
CPC分类号： H01L2224/45 , H01L2224/45124 , H01L2224/78 , H01L2224/78268 , H01L2224/78301 , H01L2224/85 , H01L2224/85045 , H01L2924/00014 , H01L2924/01013 , H01L2224/48 , H01L2924/00012 , H01L2924/00
摘要： PURPOSE:To preferably perform a bonding with a stable ball by varying the voltage or current over discharge starting period, ball forming period and stable ball forming period when applying a high voltage between a fine metal wire and an opposite electrode to form by discharge a metal ball at the end of the wire, thereby obtaining stable ball. CONSTITUTION:A capillary 11 which is passed through a bonding arm 12 is disposed on a movable lower electrode 14, and aluminum or aluminum alloy wire 12 inserted into the capillary 11 is contacted with an article to be welded and placed on the electrode 14. Then, a high voltage is applied from a power source 15 connected to the capillary 11 and the electrode 14 to produce a discharge therebetween for bonding. In this configuration, a control unit 16 which can control the high voltage value in an ageing menner is connected to the power source 15, and a synchronizing signal generator 17 having the prescribed timing is connected to the mechanism which is connected to the arm 12 and the electrode 14. A voltage detector 18 is provided in the circuit of the power source 15.
摘要翻译：目的：为了优选通过改变电压或电流超过放电开始周期，球形成周期和稳定的球形成周期，通过在金属细线和相对电极之间施加高电压以形成通过放电金属而形成稳定的球球线末端，从而获得稳定的球。构成：穿过结合臂12的毛细管11设置在可动下电极14上，插入毛细管11中的铝或铝合金线12与待焊接物品接触并放置在电极14上。然后从连接到毛细管11和电极14的电源15施加高电压以在其间产生用于接合的放电。在这种结构中，将能够控制老化时的高电压值的控制部16连接到电源15，将具有规定时机的同步信号发生器17连接到与臂12连接的机构，在电源15的电路中设置有电压检测器18。

3. 发明专利

JPS60192352A Sealing process of integrated circuit device 失效
标题翻译：集成电路设备的密封工艺
公开(公告)号：JPS60192352A
公开(公告)日：1985-09-30
申请号：JP22576084
申请日：1984-10-29
申请人： Hitachi Ltd
发明人： TANIMOTO MICHIO , UEMATSU SHIYUNEI , SUGANO TOSHIO , TAKASHIMA KAZUHISA , FUJIOKA SHIYUNICHIROU
IPC分类号： H01L23/02 , H01L21/50
CPC分类号： H01L21/50
摘要： PURPOSE:To seal a semiconductor element regularly without heating the same by a method wherein a part of glass layer cracked or peeled off is partially and externally supplied with hot jet air, laser beams or infrared lays, etc. CONSTITUTION:During the bonding process of a lead 5, there exist a possibility that a glass layer 10 may be cracked or peeled off from the boundary due to the bonding force exerted on the lead 5. At this time, a part of glass layer 10 cracked or peeled off is partially heated by hot air 11 to soften and melt the glass again temporarily sealing the peeled off part or filling the cracked part with glass to remove the crack. The upper and lower parts of a base 1 and a cap 7 are not heated at all since the ends of nozzles 12 of jet air 11 are relatively displaced along the glass layer 10 for heating. The softened and melted part of glass layer 10 may be displaced slowly by means of shifting the nozzle 12 of hot jet air 11 to remove the crack or distortion on the glass layer 10 completely.
摘要翻译：目的：通过其中一部分玻璃层破裂或剥离的方法部分地和外部地供应热喷射空气，激光束或红外线敷设等方法来定期密封半导体元件而不加热半导体元件。构成：在粘合过程中引线5，由于施加在引线5上的结合力，存在玻璃层10从边界破裂或剥离的可能性。此时，玻璃层10的一部分被剥离或剥离被部分加热通过热空气11再次软化和熔融玻璃，暂时密封剥离的部分或用玻璃填充裂纹部分以除去裂纹。底座1和盖7的上部和下部完全不加热，因为喷射空气11的喷嘴12的端部沿着玻璃层10相对移位以进行加热。玻璃层10的软化和熔融部分可以通过移动热喷射空气11的喷嘴12而缓慢移动，以完全去除玻璃层10上的裂纹或变形。

4. 发明专利

JPS6084828A METHOD FOR WIRE BONDING 失效
公开(公告)号：JPS6084828A
公开(公告)日：1985-05-14
申请号：JP19250284
申请日：1984-09-17
申请人： HITACHI LTD
发明人： FUJIOKA SHIYUNICHIROU , UEMATSU SHIYUNEI
IPC分类号： H01L21/60
摘要： PURPOSE:To contrive the wire bonding wherein the timing is easily set without variation of a bonding load and a mechanical trouble by performing a return operation of a clamper between the first bond and the second bond where there is a time margin comparatively because a loop is formed for a wire. CONSTITUTION:A wire 16 is fed with being still clamped on the first bonding side. A clamper moves from the third position to the first position. After bonding of the first bonding side, clamper jaws 5, 5 open before clamper starts to move to the second bonding side. After starting movement to the second bonding side, the clamper jaws 5, 5 are restored a little. The clamper moves from the first position to the second position regarding a relation with a tool. The second bond is made and during that, the wire 16 is clamped and then it is cut and the clamper moves from the second position to the third position.

5. 发明专利

JPS5998538A MANUFACTURE OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS5998538A
公开(公告)日：1984-06-06
申请号：JP20617882
申请日：1982-11-26
申请人： HITACHI LTD
发明人： FUJIOKA SHIYUNICHIROU , UEMATSU SHIYUNEI
IPC分类号： H01L23/02 , H01L21/50 , H01L23/50
摘要： PURPOSE:To make a sealing operation simply and easily without using a sealing jig by making a hermetic seal by the method wherein a low-melting point glass for sealing is previously coated on a circumferential part of a lower surface of a cap which is placed on a sealed region of a lead frame and fusing of the low- melting glass in a sealing oven is done with leaving the cap on the lead frame. CONSTITUTION:In the process B, lead pins 14 on both sides are bent by a predetermined angle and a ceramic cap 16 which is previously coated with a low-melting point glass 17 for sealing on a circumferential part of its lower surface is put on a sealed region of an inner lead part 15 of a lead frame 10, a semiconductor element 12 and etc. from the upper. In the process C, a outer frame 11 slides along a guide groove of a chute keeping the set state of the devices which are carried into a sealing oven successively thereby. The low-melting point glass 17 on the circumferential part of the lower surface of the cap 16 is fused by heating and by following cooling, the cap 16 is sealed to be attached to a base 13 sandwiching the sealed region of the lead frame 10 and the semiconductor element 12 is hermetically sealed in a package.

6. 发明专利

JPS58161332A WIRE BONDING DEVICE 失效
公开(公告)号：JPS58161332A
公开(公告)日：1983-09-24
申请号：JP4259582
申请日：1982-03-19
申请人： HITACHI LTD , HITACHI OME ELECTRONIC CO
发明人： FUJIOKA SHIYUNICHIROU
IPC分类号： H01L21/603 , H01L21/60
摘要： PURPOSE:To prevent the coarsening of crystal grains in the root section of the ball of a wire, and to obtain a bonding loop of stable height by providing a cooling device which can cool the root section of the ball of the wire. CONSTITUTION:A ball 9 is formed at the tip of wire 8 penetrated into a bonding tool 7. A cooling element 10 is fitted to the lower section of the tool 7, and cools the lower section of the tool. Consequently, the root section of the ball 9 is cooled through the bonding tool 7 cooled by the cooling element 10 in the wire 8, and crystal grains 3A in a section B are made finer and stronger than those through conventional systems. Accordingly, the strength of the wire is improved, and the stable loop can be obtained.

7. 发明专利

JPS57197846A AIRTIGHT SEALING METHOD FOR LEAD WIRE 失效
公开(公告)号：JPS57197846A
公开(公告)日：1982-12-04
申请号：JP8663782
申请日：1982-05-24
申请人： HITACHI LTD
发明人： UEMATSU SHIYUNEI , TANIMOTO MICHIO , FUJIWARA SHIYUNICHI , FUJIOKA SHIYUNICHIROU
IPC分类号： H01L23/12 , H01L21/50 , H01L23/02 , H01L23/50
摘要： PURPOSE:To seal a flat lead frame in airtight form by executing a process in which an insulator is softened. CONSTITUTION:The lead frame 3 is placed under a condition that a glass layer 2 on a base 1 is melted. An element 4 is attached, and wire bonding is conducted. A cap 7 is placed onto a pellet 4, wires 6 and a lead 5, glass layers 2, 8 are softened again in a nitrogen atmosphere, and the pellet, the wires and the lead are sealed temporarily. The outer frame section 9 of the lead frame is cut, and bent at a predetermined position. The whole is heated up to the softening temperature (440 deg.C) of glass in the nitrogen atmosphere again, and cracks in the glass layers generated in a previous process are removed.

8. 发明专利

JPS5531531A MANIPULATOR 失效
公开(公告)号：JPS5531531A
公开(公告)日：1980-03-05
申请号：JP10178978
申请日：1978-08-23
申请人： HITACHI LTD
发明人： KIYOUMASU RIYUUICHI , FUJIOKA SHIYUNICHIROU , UEMATSU SHIYUNEI
IPC分类号： B25J9/16 , B25J5/02

9. 发明专利

JPS5366170A LEAD FRAME WITH PRODJECTION 失效
公开(公告)号：JPS5366170A
公开(公告)日：1978-06-13
申请号：JP14126176
申请日：1976-11-26
申请人： HITACHI LTD
发明人： UEMATSU SHIYUNEI , FUJIOKA SHIYUNICHIROU
IPC分类号： H01L23/50 , H01L23/48
摘要： PURPOSE:To simplify frame piling-up and prevent frames from being hooked at a taking-out time by providing projections at least in two positions on the frame surface.

10. 发明专利

JPS5352138A DISTORTION CORRECTOR OF MICROSCOPE 失效
公开(公告)号：JPS5352138A
公开(公告)日：1978-05-12
申请号：JP12611876
申请日：1976-10-22
申请人： HITACHI LTD
发明人： FUJIOKA SHIYUNICHIROU
IPC分类号： G02B21/00 , G02B27/00 , H01L21/66
摘要： PURPOSE:To perform the correction of distortion a microscopic image by using a distortion-correcting lens which undergoes position and inclination control.

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