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1. 发明专利

JPS5887842A WIRE BONDING DEVICE 失效
公开(公告)号：JPS5887842A
公开(公告)日：1983-05-25
申请号：JP18542081
申请日：1981-11-20
申请人： HITACHI LTD
发明人： UEMATSU SHIYUNEI
IPC分类号： H01L21/60 , H01L21/607
摘要： PURPOSE:To enhance precision of the rotational position of a column, while to enhance the responding property to a rotation of the column at the wire bonding device by a method wherein a rotating shaft of the column and a rotating shaft on a driving motor side are coupled with a belt means, while a brake means is provided at a part of the rotating shaft of the column. CONSTITUTION:The rotating shaft 19 is provided at the lower edge of the column 10, and is bore being enabled to rotate by a fixed housing through a pair of bearings 20, 20, while a follow-up pulley 21 is fixed at a part of the lower part thereof. The motor 22 as the driving power source is fixedly provided to the fixed housing 24 on the side of the column 10 making a rotating output shaft 23 as to come in parallel with the rotating shaft 19, and moreover the output shaft 23 is bore by bearings 25, 25. A driving pulley 26 is fixed to the rotating output shaft 23, and a belt 27 is wound around between the follow-up pulley 21 to constitute a belt means 28. In the meanwhile, a circular disk 29 consisting of a ferromagnetic material is fixed concentrically to a part of the upper side of the rotating shaft 19, and electromagnets 30 are arranged at the position facing to the axial direction of the disk 29 thereof to constitute a brake means 31.

2. 发明专利

JPS55140248A METHOD OF PACKAGING SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS55140248A
公开(公告)日：1980-11-01
申请号：JP4796279
申请日：1979-04-20
申请人： HITACHI LTD
发明人： FUJIOKA SHIYUNICHIROU , UEMATSU SHIYUNEI
IPC分类号： H01L23/02 , H01L23/057 , H01L23/50
摘要： PURPOSE:To prevent occurrence of improper package of a semiconductor device by bonding the flat portion between a package base and a frame with glass, bending the lead wire by utilizing the adhering strength and an auxiliary pressing force by a jig and attaching a cover thereon. CONSTITUTION:A flat frame 3 is mounted on a package base 2 secured with a semiconductor pellet 1 thereto and connected to a wire 4. A lead wire 5 is secured via a jig 6 by utilizing the adhering strength of the frame 3 to the base 2 and bent in predetermined shape. According to this method, the package base 2 can be effectively isolated from the frame 3. A cover 3 is finally coated thereon.

3. 发明专利

JPS5599732A WIRE BONDER 失效
公开(公告)号：JPS5599732A
公开(公告)日：1980-07-30
申请号：JP712579
申请日：1979-01-26
申请人： HITACHI LTD
发明人： UEMATSU SHIYUNEI
IPC分类号： H01L21/60
摘要： PURPOSE:To prevent relief of wire, by providing a mechanism for bending prolonged wire at tip of connecting tool. CONSTITUTION:At the side of pellet 29 on package 28, supersonic wave oscillation is performed for wire bonding. Secondary, wedge is moved and supersonic oscillation is made at lead 30 side, then wire is cut and fed. At this time, while moving, wire bending lever 14 is worked bending the wire which is extended from wedge 6 and thus relief of wire is prevented.

4. 发明专利

JPS53124073A SEALING UNIT FOR GLASS SEALING TYPE SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS53124073A
公开(公告)日：1978-10-30
申请号：JP3852977
申请日：1977-04-06
申请人： HITACHI LTD
发明人： TANIMOTO MICHIO , TAKASHIMA KAZUHISA , FUJIOKA SHIYUNICHIROU , UEMATSU SHIYUNEI , KANNO TOSHIO
IPC分类号： H01L23/02 , H01L21/56
摘要： PURPOSE:To manufacture a high-accuracy glass sealing type semiconductor device in an automatic and continuous way with no use of the tools.

5. 发明专利

JPS5240065A LEAD FRAME 失效
公开(公告)号：JPS5240065A
公开(公告)日：1977-03-28
申请号：JP11562575
申请日：1975-09-26
申请人： HITACHI LTD
发明人： TANIMOTO MICHIO , UEMATSU SHIYUNEI , FUJIOKA SHIYUNICHIROU
IPC分类号： H01L23/50 , H01L23/48
摘要： PURPOSE:To form the ends of lead frame to a larger size by mutually sliding the ends thereby improving the yield of wire bonding.

6. 发明专利

JPS522177A STRUCTURE OF GRIP OF MANIPULATOR 失效
公开(公告)号：JPS522177A
公开(公告)日：1977-01-08
申请号：JP7656175
申请日：1975-06-24
申请人： HITACHI LTD
发明人： UEMATSU SHIYUNEI
IPC分类号： B23P21/00 , B25J15/00 , H01L21/60
摘要： PURPOSE:To improve operability and to provide efficient workability by reducing operating force of grip of manipulator.

7. 发明专利

JPS60192352A Sealing process of integrated circuit device 失效
标题翻译：集成电路设备的密封工艺
公开(公告)号：JPS60192352A
公开(公告)日：1985-09-30
申请号：JP22576084
申请日：1984-10-29
申请人： Hitachi Ltd
发明人： TANIMOTO MICHIO , UEMATSU SHIYUNEI , SUGANO TOSHIO , TAKASHIMA KAZUHISA , FUJIOKA SHIYUNICHIROU
IPC分类号： H01L23/02 , H01L21/50
CPC分类号： H01L21/50
摘要： PURPOSE:To seal a semiconductor element regularly without heating the same by a method wherein a part of glass layer cracked or peeled off is partially and externally supplied with hot jet air, laser beams or infrared lays, etc. CONSTITUTION:During the bonding process of a lead 5, there exist a possibility that a glass layer 10 may be cracked or peeled off from the boundary due to the bonding force exerted on the lead 5. At this time, a part of glass layer 10 cracked or peeled off is partially heated by hot air 11 to soften and melt the glass again temporarily sealing the peeled off part or filling the cracked part with glass to remove the crack. The upper and lower parts of a base 1 and a cap 7 are not heated at all since the ends of nozzles 12 of jet air 11 are relatively displaced along the glass layer 10 for heating. The softened and melted part of glass layer 10 may be displaced slowly by means of shifting the nozzle 12 of hot jet air 11 to remove the crack or distortion on the glass layer 10 completely.
摘要翻译：目的：通过其中一部分玻璃层破裂或剥离的方法部分地和外部地供应热喷射空气，激光束或红外线敷设等方法来定期密封半导体元件而不加热半导体元件。构成：在粘合过程中引线5，由于施加在引线5上的结合力，存在玻璃层10从边界破裂或剥离的可能性。此时，玻璃层10的一部分被剥离或剥离被部分加热通过热空气11再次软化和熔融玻璃，暂时密封剥离的部分或用玻璃填充裂纹部分以除去裂纹。底座1和盖7的上部和下部完全不加热，因为喷射空气11的喷嘴12的端部沿着玻璃层10相对移位以进行加热。玻璃层10的软化和熔融部分可以通过移动热喷射空气11的喷嘴12而缓慢移动，以完全去除玻璃层10上的裂纹或变形。

8. 发明专利

JPS6084828A METHOD FOR WIRE BONDING 失效
公开(公告)号：JPS6084828A
公开(公告)日：1985-05-14
申请号：JP19250284
申请日：1984-09-17
申请人： HITACHI LTD
发明人： FUJIOKA SHIYUNICHIROU , UEMATSU SHIYUNEI
IPC分类号： H01L21/60
摘要： PURPOSE:To contrive the wire bonding wherein the timing is easily set without variation of a bonding load and a mechanical trouble by performing a return operation of a clamper between the first bond and the second bond where there is a time margin comparatively because a loop is formed for a wire. CONSTITUTION:A wire 16 is fed with being still clamped on the first bonding side. A clamper moves from the third position to the first position. After bonding of the first bonding side, clamper jaws 5, 5 open before clamper starts to move to the second bonding side. After starting movement to the second bonding side, the clamper jaws 5, 5 are restored a little. The clamper moves from the first position to the second position regarding a relation with a tool. The second bond is made and during that, the wire 16 is clamped and then it is cut and the clamper moves from the second position to the third position.

9. 发明专利

JPS6035530A POSITIONING DEVICE 失效
公开(公告)号：JPS6035530A
公开(公告)日：1985-02-23
申请号：JP14387683
申请日：1983-08-08
申请人： HITACHI HOKKAI SEMICONDUCTOR , HITACHI LTD
发明人： TERASHIMA TAKASHI , UEMATSU SHIYUNEI , KAWADA YASUO
IPC分类号： H01L21/67 , H01L21/68
摘要： PURPOSE:To enable to shorten the exchange time of a housing jig for matters to be bonded in a semiconductor pellet bonding device by a method wherein a positioning of the housing jig is performed just after an exchange of the housing jig ended. CONSTITUTION:As an X-Y table 1 is shifted, a contact pin 14 is made to contact to the inclined plane 16 of a contact block 15 and is made to slide, a link bar 9 is rotated and a positioning pin 4 is made to vertically moved. While the X-Y table 1 is being made to shift to a pellet jig exchange position, the contact pin 14 is made to contact to the inclined plane 16, and at the same time, the tip of the positioning pin 4 is made to descend to a position lower than the lower surface of a housing jig 7, and the jig 7 is housed in the X-Y table 1 by a drive system 6 through a jig pusher 5 and an exchange of the jig is performed. Just after the accomodation and exchange ended, the X-Y table 1 is made to shift, the positioning pin 4 is made to ascend up to a position higher than the jig 7 and a positioning of the jig 7 is performed.

10. 发明专利

JPS5998538A MANUFACTURE OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS5998538A
公开(公告)日：1984-06-06
申请号：JP20617882
申请日：1982-11-26
申请人： HITACHI LTD
发明人： FUJIOKA SHIYUNICHIROU , UEMATSU SHIYUNEI
IPC分类号： H01L23/02 , H01L21/50 , H01L23/50
摘要： PURPOSE:To make a sealing operation simply and easily without using a sealing jig by making a hermetic seal by the method wherein a low-melting point glass for sealing is previously coated on a circumferential part of a lower surface of a cap which is placed on a sealed region of a lead frame and fusing of the low- melting glass in a sealing oven is done with leaving the cap on the lead frame. CONSTITUTION:In the process B, lead pins 14 on both sides are bent by a predetermined angle and a ceramic cap 16 which is previously coated with a low-melting point glass 17 for sealing on a circumferential part of its lower surface is put on a sealed region of an inner lead part 15 of a lead frame 10, a semiconductor element 12 and etc. from the upper. In the process C, a outer frame 11 slides along a guide groove of a chute keeping the set state of the devices which are carried into a sealing oven successively thereby. The low-melting point glass 17 on the circumferential part of the lower surface of the cap 16 is fused by heating and by following cooling, the cap 16 is sealed to be attached to a base 13 sandwiching the sealed region of the lead frame 10 and the semiconductor element 12 is hermetically sealed in a package.

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