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1. 发明专利

JP2007052004A Semiconductor radiation detector, radiation detector module and diagnostic device for nuclear medicine 审中-公开
标题翻译：半导体辐射检测器，辐射检测器模块和核医学诊断装置
公开(公告)号：JP2007052004A
公开(公告)日：2007-03-01
申请号：JP2006189421
申请日：2006-07-10
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： KIYONO TOMOYUKI , YANAGIDA NORIFUMI , TAKAI TOSHIAKI , YODA TOMOKO , MATSUSHIMA NAOKI
IPC分类号： G01T1/24 , C09J9/02 , C09J201/00 , G01T1/161 , H01L31/0264 , H01L31/09
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor detector, radiation detector module, and diagnostic device for nuclear medicine that are superior in energy resolution and time precision.
SOLUTION: The semiconductor radiation detector is constituted, such that the platy element 211 of cadmium telluride and metallic conductive members 22 and 23 are adhered with a conductive adhesive 21A, and laminated the plate-like element 211 of cadmium telluride with the conductive members 22 and 23, while alternating the conductive members 22 and 23. The longitudinal elastic modulus of the conductive adhesive 21A are 350-1,000 MPa, and the linear expansion coefficient of the conductive members 22 and 23 are materials in the range of 5×10
-6 /°C to 7×10
-6 /°C. The conductive members are selected from among Fe-Ni alloy, Fe-Ni-Co alloy, Cr and Te, and are respectively arranged between the electrodes of the same kind of the facing plate-like elements 211 of cadmium telluride.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供能量分辨率和时间精度优越的用于核医学的半导体检测器，辐射检测器模块和诊断装置。解决方案：半导体辐射检测器被构造成使得碲化镉和金属导电构件22和23的板状元件211用导电粘合剂21A粘合，并且将碲化镉的板状元件211与导电构件22和23，同时交替导电构件22和23.导电粘合剂21A的纵向弹性模量为350-1,000MPa，并且导电构件22和23的线膨胀系数为5×10 -6 /℃至7×10 -6 /℃。导电构件选自Fe-Ni合金，Fe-Ni-Co合金，Cr和Te中，分别设置在同一种类的碲化镉的面板状元件211的电极之间。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2006072171A Optical module 审中-公开
标题翻译：光学模块
公开(公告)号：JP2006072171A
公开(公告)日：2006-03-16
申请号：JP2004257978
申请日：2004-09-06
申请人： Hitachi Ltd , Opnext Japan Inc , 日本オプネクスト株式会社 , 株式会社日立製作所
发明人： TAKAI TOSHIAKI , YOSHIMOTO KENJI , SASAKI HIROYASU , OKAYASU MASANOBU , MATSUSHIMA NAOKI
IPC分类号： G02B6/42
CPC分类号： G02B6/4201 , G02B6/4206 , G02B6/4267 , G02B6/4268 , G02B6/4271
摘要： PROBLEM TO BE SOLVED: To provide a small and high reliability optical module in which a light emitting element and an optical function element significantly different in thermal expansion coefficient are mounted in the same case.
SOLUTION: As for the case 8 of the optical module 100, a material of which the thermal expansion coefficient is almost equal to that of the optical function element 5 is selected. In a mounting part 8a for mounting the light emitting element 1 and an thermoelectric module 9 mounted with the light emitting element 1 to the case, a material which is matched with a heat sink 9c of the light emitting element 1 and the thermoelectric module 9 in the thermal expansion coefficient is embedded.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种小型和高可靠性光学模块，其中在相同的情况下安装了热膨胀系数显着不同的发光元件和光学功能元件。解决方案：对于光学模块100的情况8，选择热膨胀系数几乎等于光学功能元件5的材料。在用于将发光元件1和安装有发光元件1的热电模块9安装到壳体的安装部分8a中，与发光元件1的散热器9c和热电模块9相配合的材料热膨胀系数嵌入。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2012037818A Photoelectric composite wiring module and manufacturing method thereof 审中-公开
标题翻译：光电复合布线模块及其制造方法
公开(公告)号：JP2012037818A
公开(公告)日：2012-02-23
申请号：JP2010179932
申请日：2010-08-11
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： HAMAMURA SAORI , NAKAJO TOKUO , TAKAI TOSHIAKI , ISHIDA SUSUMU , MATSUSHIMA NAOKI , MATSUOKA YASUNOBU , SUGAWARA TOSHIKI , KAWAMURA DAICHI
IPC分类号： G02B6/122
CPC分类号： G02B6/10 , G02B6/4206 , G02B6/4214 , G02B6/4274
摘要： PROBLEM TO BE SOLVED: To provide a photoelectric composite wiring module having excellent properties and mass productivity, in which electrical wiring between a drive circuit or an amplifier circuit LSI of an optical element, and the optical element are connected by a thin film wiring layer at a short distance, so that a transfer rate per channel can be increased and increase in power consumption can be prevented, and also a connection mode to a transmission device is simple such as using a connector and the LSI can be mounted using a conventional technique, so that easy assembling and high reliability can be realized.SOLUTION: In a photoelectric composite wiring module, optical elements 2a, 2b are arranged on a circuit board 1 so as to be optically coupled with an optical waveguide 11 formed on the circuit board 1, an electrical wiring layer 3 is laminated to an upper layer of the optical elements so that electrodes of the optical elements and wiring of the electrical wiring layer 3 are electrically connected, a peripheral portion of the optical elements is encapsulated with resin so that the optical elements are protected from stress or moisture, and an LSI is mounted on the electrical wiring layer 3 and electrically connected.
摘要翻译：要解决的问题：提供一种光学复合布线模块，其具有优异的性能和质量生产率，其中光学元件的驱动电路或放大器电路LSI之间的电线与光学元件通过薄膜连接布线层，从而可以提高每个通道的传输速率，并且可以防止功率消耗的增加，并且传输设备的连接模式如使用连接器那样简单，并且可以使用常规技术，从而可以实现易于组装和高可靠性。解决方案：在光电复合布线模块中，将光学元件2a，2b布置在电路板1上，以与形成在电路板1上的光波导11光学耦合，将电布线层3层压到光学元件的上层，使得光学元件的电极和电布线层3的布线电连接，光学元件的周边部分被树脂封装，使得光学元件免受应力或潮湿的影响，以及 LSI电连接在电气布线层3上。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2010212387A Junction structure of semiconductor device, manufacturing method therefor and alloy foil for junction 审中-公开
标题翻译：半导体器件的结构结构及其制造方法及合金箔
公开(公告)号：JP2010212387A
公开(公告)日：2010-09-24
申请号：JP2009055885
申请日：2009-03-10
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： HATA SHOHEI , TAKAI TOSHIAKI , SAKIKAWA YUKIO
IPC分类号： H01L23/10 , G01P15/08 , G01P15/12 , H01L21/52 , H01L23/02
CPC分类号： H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/10253 , H01L2924/1461 , H01L2924/19107 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a junction method that achieves joining by reducing a pressurizing force because, when joining a semiconductor such as Si or the like by utilizing eutectic reaction of Au with Si, an Si oxide film is broken and Si and Au are brought into contact with each other, so that a large pressurizing force is necessary and a manufacturing apparatus is made larger in size at high cost. SOLUTION: When joining by using alloy a substrate 12 wherein Si or the like tends to form an oxide on its surface, Au, an element Au-Ge layer 10 for lowering the melting point of Au, an element Al layer 6 for reducing an Si oxide SiO2 layer 11 and an alloy layer containing a Ti layer 9 as an adhesion layer are used to melt an alloy of Au at comparatively low temperature, and an oxide such as Si or the like on the surface is reduced and broken by elements having a reducing force in the melted alloy. Thus, the substrate 12 is joined by the reaction of Au with a semiconductor substrate containing Si or the like. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过降低加压力来实现接合的接合方法，因为当通过利用Au与Si的共晶反应来接合诸如Si等的半导体时，Si氧化物膜被破坏，Si 并且Au彼此接触，因此需要大的加压力，并且使制造装置的尺寸更大，成本更高。解决方案：通过使用其中Si等倾向于在其表面上形成氧化物的基底12接合Au，用于降低Au的熔点的元素Au-Ge层10，用于降低Au的熔点的元素Al层6 减少Si氧化物SiO 2层11和含有作为粘合层的Ti层9的合金层用于在相对低的温度下熔化Au的合金，并且表面上的诸如Si等氧化物被减少并破坏在熔融合金中具有还原力的元件。因此，基板12通过Au与含有Si等的半导体基板的反应而接合。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2011210758A Method of manufacturing wafer-bonded semiconductor device 有权
标题翻译：制造半结晶半导体器件的方法
公开(公告)号：JP2011210758A
公开(公告)日：2011-10-20
申请号：JP2010074081
申请日：2010-03-29
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： TAKAI TOSHIAKI , SAKIKAWA YUKIO
IPC分类号： H01L23/12 , H01L23/02
CPC分类号： H01L23/10 , H01L21/50 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/83 , H01L27/14618 , H01L33/0079 , H01L2224/04026 , H01L2224/05155 , H01L2224/05644 , H01L2224/2732 , H01L2224/2745 , H01L2224/29082 , H01L2224/291 , H01L2224/2919 , H01L2224/29294 , H01L2224/293 , H01L2224/29324 , H01L2224/29355 , H01L2224/29363 , H01L2224/29366 , H01L2224/32225 , H01L2224/32237 , H01L2224/83011 , H01L2224/83121 , H01L2224/83192 , H01L2224/83193 , H01L2224/8321 , H01L2224/83444 , H01L2224/83801 , H01L2224/8381 , H01L2224/83815 , H01L2224/83862 , H01L2924/01327 , H01L2924/09701 , H01L2924/12042 , H01L2924/15159 , H01L2924/181 , H01L2924/3511 , H01L2924/3651 , H01L2924/3656 , H01S5/02208 , H01S5/02272 , H01S5/02296 , H01S5/423 , H01L2924/014 , H01L2924/00014 , H01L2924/01006 , H01L2224/81121 , H01L2924/00013 , H01L2924/00015 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a wafer-bonded semiconductor device reducing a warpage in case of a wafer junction by a simple process at low cost.SOLUTION: The manufacturing method of the wafer-bonded semiconductor device bonding a first wafer board 1 and a second wafer board 2 includes: a first step of previously forming bonding members 3 and 5 having a bonding function in case of a heating on the wafer bonding surface sides of the first wafer board 1 and the second wafer board 2; and a second step of supplying the surfaces of the bonding members formed by the first step with flux paste 4 containing at least two pulverulent-powder materials having a reactivity. The manufacturing method of the wafer-bonded semiconductor device further includes a third step of conducting an excitation for starting the reaction of the flux paste 4 supplied by the second step.
摘要翻译：要解决的问题：提供一种通过简单的方法以低成本在晶片接合的情况下减少翘曲的晶片接合半导体器件。解决方案：将晶片接合的半导体器件的制造方法接合第一晶片板1和第二晶片板2包括：在第一晶片板1和第二晶片板2的晶片接合表面侧加热的情况下，预先形成具有接合功能的接合构件3和5的第一步骤; 以及第二步骤，将由第一步骤形成的接合部件的表面供给含有至少两种具有反应性的粉末状粉末材料的焊膏4。晶片接合半导体器件的制造方法还包括进行第二工序供给的助焊剂4的反应开始的激励的第三工序。

6. 发明专利

JP2010186090A Optical transceiver module 审中-公开
标题翻译：光收发模块
公开(公告)号：JP2010186090A
公开(公告)日：2010-08-26
申请号：JP2009030638
申请日：2009-02-13
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： SAKIKAWA YUKIO , TAKAI TOSHIAKI , HATA SHOHEI
IPC分类号： G02B6/42
CPC分类号： G02B6/4215 , G02B6/4201 , G02B6/4214 , G02B6/423 , G02B6/424 , G02B6/4244 , G02B6/4245 , G02B6/4246 , G02B6/4253 , G02B6/4257 , G02B6/4259 , H04B10/40
摘要： PROBLEM TO BE SOLVED: To provide a compact and low-cost optical module that is used as a terminal for wavelength multiplexed optical transmission and single-core bidirectional optical transmission in which light with a plurality of wavelengths is transmitted by a single-optical fiber, and also to provide a manufacturing method of the module.
SOLUTION: A base 23 with a plurality of optical elements placed is prepared, as is an optical multiplexer/demultiplexer 3 with a wavelength selection filter and a mirror formed on the front and back faces of a substrate. These two components are mounted on a package 50 so that the optical element mounted face and the filter surface are substantially parallel to each other in the angle, with the optical elements being arranged so as to obliquely emit/receive a light with respect to the base 23. Consequently, the optical multiplexer/demultiplexer 3 can be mounted in parallel to the X-Y plane which facilitates machining of the package by using a lathe, and thus the cost can be reduced.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种紧凑且低成本的光学模块，其用作波长复用光传输和单芯双向光传输的终端，其中具有多个波长的光通过单个光传输来传输，光纤，并且还提供该模块的制造方法。解决方案：准备放置多个光学元件的基座23，以及形成在基板的正面和背面上的具有波长选择滤光器和反射镜的光复用器/解复用器3。这两个部件安装在封装件50上，使得光学元件安装面和滤光片表面在角度上基本上彼此平行，其中光学元件布置成相对于基座倾斜地发射/接收光因此，光学多路复用器/解复用器3可以平行于XY平面安装，这有利于通过使用车床来加工封装，因此可以降低成本。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2010109204A Optical module 有权
标题翻译：光学模块
公开(公告)号：JP2010109204A
公开(公告)日：2010-05-13
申请号：JP2008280697
申请日：2008-10-31
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： TAKAI TOSHIAKI , SAKIKAWA YUKIO , HATA SHOHEI
IPC分类号： H01S5/022 , G02B6/42
CPC分类号： G02B6/4246 , G02B6/29367 , H01S5/005 , H01S5/02212 , H01S5/02228 , H01S5/02284 , H01S5/02296 , H01S2301/176
摘要： PROBLEM TO BE SOLVED: To provide an optical module for obtaining good light-receiving sensitivity by suppressing an optical crosstalk caused by leak light without causing deterioration in characteristics and deterioration in reliability of a light-emitting element with a simple structure.
SOLUTION: An optical module includes a plurality of light-emitting elements 11 and light-receiving elements 12 mounted on a substrate 1 mounting optical elements. In the optical module, a light absorbing resin 6 for absorbing the light with a luminescence wavelength of the light-emitting element 11 is arranged in such a manner as to cover the side of the light-emitting element 11. Between the light absorbing resin 6 and the optical element mounting substrate 1, a non-adhesive layer 7 comprising a material that is non-adhesive to the light absorbing resin 6 is arranged.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：提供一种用于通过抑制由漏光引起的光学串扰而获得良好的光接收灵敏度的光学模块，而不会导致特性劣化和发光元件的简单结构的可靠性的劣化。解决方案：光学模块包括安装在安装光学元件的基板1上的多个发光元件11和光接收元件12。在光学模块中，以覆盖发光元件11的侧面的方式配置吸收具有发光元件11的发光波长的光的吸光树脂6.在光吸收树脂6 并且配置光学元件安装基板1，包括与光吸收树脂6不粘合的材料的非粘合层7。版权所有（C）2010，JPO＆INPIT

8. 发明专利

JP2005352230A Optical module 有权
标题翻译：光学模块
公开(公告)号：JP2005352230A
公开(公告)日：2005-12-22
申请号：JP2004173611
申请日：2004-06-11
申请人： Hitachi Ltd , Opnext Japan Inc , 日本オプネクスト株式会社 , 株式会社日立製作所
发明人： YOSHIMOTO KENJI , SASAKI HIROYASU , OKAYASU MASANOBU , TAKAI TOSHIAKI , MATSUSHIMA NAOKI
IPC分类号： G02F1/03 , G02B3/00 , G02B6/42 , G02B7/00 , G02B7/02 , G02B9/00 , H01S5/022
CPC分类号： G02B6/4204 , G02B7/008
摘要： PROBLEM TO BE SOLVED: To provide an optical module of a small size and high reliability constituted by mounting a light emitting element and an optical modulator element having extremely different thermal expansion coefficients in the same case. SOLUTION: The optical module is -6 [1/K] in the difference between the thermal expansion coefficient of the light emitting element 11 and the thermal expansion coefficient of the case 30 and is ≥5x10 -6 [1/K] in the difference between the thermal expansion coefficient of the optical modulator element 2 and the thermal expansion coefficient of the case 30. The width in an optical axis direction of a portion for fixing the optical modulator element 2 and the case 30 is confined within 10 mm. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供在相同情况下通过安装具有极不相同的热膨胀系数的发光元件和光调制元件而构成的小尺寸和高可靠性的光学模块。解决方案：在发光元件11的热膨胀系数与壳体30的热膨胀系数之间的差异中，光学模块为<5×10 -6 / SP> [1 / K]，为在光调制元件2的热膨胀系数与壳体30的热膨胀系数的差中，≥5×10 -6 [1 / K]。一部分的光轴方向的宽度用于固定光调制器元件2并且壳体30被限制在10mm内。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP2011217321A Peaking circuit, method for adjusting peaking, differential amplifier installing peaking circuit, laser diode driving circuit installing peaking circuit, and data processing unit installing peaking circuit 审中-公开
标题翻译：峰值电路，调整峰值的方法，安装峰值的差分放大器，安装峰值电路的激光二极管驱动电路和安装峰值电路的数据处理单元
公开(公告)号：JP2011217321A
公开(公告)日：2011-10-27
申请号：JP2010086024
申请日：2010-04-02
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： NAKAJO TOKUO , KAWAMATA TSUNEO , TAKAI TOSHIAKI
IPC分类号： H03F3/45
CPC分类号： H03F3/45183 , H03F3/211 , H03F2203/45366 , H03F2203/45466 , H03F2203/45702 , H03F2203/45731
摘要： PROBLEM TO BE SOLVED: To provide a peaking adjusting circuit for preventing frequency characteristics in a high frequency domain of a circuit handling a high-frequency signal from being deteriorated, while reducing power consumption.SOLUTION: A peaking circuit for adjusting peaking of a high-frequency signal includes: a first inductor; a second inductor which is coupled with the first inductor; a signal input section which receives an input signal; a transistor which adjusts a current passing through the second inductor according to the input signal inputted via the signal input section; and a signal output section which outputs a signal whose peaking has been adjusted by the first inductor. Mutual inductance of the second inductor and the first inductor coupled therewith is changed by the adjustment of the current passing through the second inductor is controlled by the transistor according to the input signal inputted from the signal input section, thereby adjusting the peaking of a signal waveform of the current passing through the first inductor, and the signal subjected to the peaking adjustment is outputted from the signal output section.
摘要翻译：要解决的问题：提供一种峰值调整电路，用于防止处理高频信号的电路的频率特性劣化，同时降低功耗。解决方案：一种用于调节高频信号的峰值峰值的峰值调节电路，频率信号包括：第一电感器; 与第一电感器耦合的第二电感器; 信号输入部，其接收输入信号; 晶体管，其根据经由所述信号输入部输入的输入信号，调整通过所述第二电感器的电流; 以及信号输出部，其输出由第一电感器调整了峰值的信号。通过根据从信号输入部输入的输入信号由晶体管控制通过第二电感器的电流来调整第二电感器和与其耦合的第一电感器的互感，由此调整信号波形的峰值的电流通过第一电感器，并且从信号输出部分输出经过峰值调整的信号。

10. 发明专利

JP2010060950A Optical module mounted with wdm filter and manufacturing method 审中-公开
标题翻译：光学模块安装WDM过滤器和制造方法
公开(公告)号：JP2010060950A
公开(公告)日：2010-03-18
申请号：JP2008227747
申请日：2008-09-05
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： HATA SHOHEI , MATSUSHIMA NAOKI , TAKAI TOSHIAKI , SAKIKAWA YUKIO , ARAI SATOSHI
IPC分类号： G02B6/293 , G02B5/28 , G02B6/42 , H01L31/0232
摘要： PROBLEM TO BE SOLVED: To give a novel structure mass-producible without a complicated mounting step to a filter element suitable for an optical communication module for performing transmission and receiving of three or more of optical signals differed in wavelength. SOLUTION: A filter element includes: a first glass substrate having a pair of parallel surfaces and a band pass filter arranged on one of the parallel surfaces; a pair of single-crystal substrates (Si wafers) each including a primary surface formed with a depression having an inclined surface with respect to the primary surface occupying at least one half of the opening of the depression; and a second glass substrate having an optical element. The primary surfaces of the single-crystal substrate pair are bonded to a pair of the surfaces of the glass substrate. The depressions are faced through the glass substrate and surround the band pass filter. By this configuration, the filter element is mass produced with a high accuracy and a low cost by the wafer-level process. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了给适合于用于执行波长不同的三个或更多个光信号的发送和接收的光通信模块的滤波器元件，提供大量生产而不需要复杂安装步骤的新颖结构。滤波器元件包括：具有一对平行表面的第一玻璃基板和布置在其中一个平行表面上的带通滤波器; 一对单晶基板（Si晶片），每个单晶基板包括形成有具有相对于主表面的倾斜表面的凹陷的主表面占据凹陷的开口的至少一半的一个; 以及具有光学元件的第二玻璃基板。单晶衬底对的主表面被接合到玻璃衬底的一对表面上。凹陷面向玻璃基板并围绕带通滤光片。通过这种构造，通过晶片级处理，以高精度和低成本大量生产过滤元件。版权所有（C）2010，JPO＆INPIT

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