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1. 发明专利

JP2014190875A Dynamic quantity measurement instrument and manufacturing method thereof 审中-公开
标题翻译：动态数量测量仪器及其制造方法
公开(公告)号：JP2014190875A
公开(公告)日：2014-10-06
申请号：JP2013067416
申请日：2013-03-27
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： SHIMOKAWA HIDEYOSHI , YAMAGUCHI TAKUTO , HATA SHOHEI , OTA HIROYUKI
IPC分类号： G01L1/18 , G01B7/16 , G01L9/00
CPC分类号： G01B7/20 , G01B7/16 , H01L24/29 , H01L24/83 , H01L2224/29083 , H01L2224/73265 , H01L2224/83101 , H01L2224/83801
摘要： PROBLEM TO BE SOLVED: To provide a junction structure which detects strain occurring in a measurement object, with high sensitivity even under a high temperature and allows accurate sensor output even when applied with long-tern strain, by optimizing a junction between a sensor chip having a strain detection part on a semiconductor substrate and abase substrate.SOLUTION: A dynamic quantity measurement instrument includes: a sensor chip having, on a semiconductor substrate, a strain detection part for detecting expansion/contraction in an in-plane direction; a base substrate; and a wiring part for drawing a wire from an electrode of the sensor chip to the outside. A sensor chip rear surface opposite to a surface on which the strain detection part is provided and a front surface of the base substrate are joined via a layer of an intermetallic compound and a metal layer having a high melting point.
摘要翻译：要解决的问题：为了提供检测测量对象中的应变的接合结构，即使在高温下也具有高灵敏度，并且即使在施加长期应变时也能够精确地传感器输出，通过优化具有一种半导体衬底上的应变检测部件和缓冲衬底。解决方案：一种动态量测量仪器包括：传感器芯片，其在半导体衬底上具有用于检测面内方向的伸缩的应变检测部件; 基底; 以及用于将导线从传感器芯片的电极拉到外部的布线部分。与设置有应变检测部的表面相对的传感器芯片后表面和基底基板的前表面通过金属间化合物层和具有高熔点的金属层接合。

2. 发明专利

JP2011129818A Semiconductor device, and method of producing the same 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2011129818A
公开(公告)日：2011-06-30
申请号：JP2009289149
申请日：2009-12-21
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： TANIE HISAFUMI , SHINTANI HIROSHI , HIRAMITSU SHINJI , OTA HIROYUKI
IPC分类号： H01L23/40 , H01L21/52 , H01L23/48
CPC分类号： H01L23/49562 , H01L21/565 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L24/34 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： PROBLEM TO BE SOLVED: To provide a pressure-welded semiconductor device such that a semiconductor element can be positioned inexpensively during manufacture, and to provide a method of producing the same. SOLUTION: The semiconductor device is produced by fixing positions of the semiconductor element and a metal lead frame with resin while positioning the semiconductor element using the metal lead frame, and then removing a lead frame portion used to position the semiconductor element. At this time, the lead frame and resin are fixed by engagement to eliminate the need for adhesive strength between the resin and lead frame. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种压焊半导体器件，使得半导体元件在制造期间可以廉价地定位，并提供其制造方法。解决方案：半导体器件通过使用树脂固定半导体元件和金属引线框架的位置，同时使用金属引线框定位半导体元件，然后去除用于定位半导体元件的引线框架部分来制造。此时，引线框架和树脂通过接合固定，以消除对树脂和引线框架之间的粘合强度的需要。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2010056259A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2010056259A
公开(公告)日：2010-03-11
申请号：JP2008218978
申请日：2008-08-28
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： HIRAMITSU SHINJI , OTA HIROYUKI , SASAKI KOJI , KITANO MAKOTO , MATSUYOSHI SATOSHI
IPC分类号： H01L23/48
CPC分类号： H01L24/01 , H01L2924/351 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device having high reliability and ability to correspond to the large electric power by making high stress relaxing performance compatible with heat radiating performance. SOLUTION: A semiconductor chip 10, a pair of electrode parts 12a, 21c facing each other with the semiconductor chip 10 held between them, and bonding layers 13, 14 to electrically bond them are laminated to form this semiconductor device. Electrode part restricting member 25 to suppress thermal expansion of the electrode parts 12a, 21c in the diameter direction is formed with the member abutting on the outer periphery of at least one electrode part of the pair of electrode parts 12a, 21c, the electrode part restricting member 25 is bonded to the semiconductor chip 10 through the bonding layer 13, the electrode part 21c where the electrode part restricting member 25 is formed has a protrusion, and the bonding surface of the protrusion which faces the semiconductor chip 10 protrudes further toward the semiconductor chip side than the bonding surface of the electrode part restricting member 25 which faces the semiconductor chip 10. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：通过提供与散热性能兼容的高应力松弛性能来提供具有高可靠性和对应于大功率的能力的半导体器件。解决方案：半导体芯片10，一对彼此面对的电极部分12a，21c，半导体芯片10保持在它们之间，并且将它们电连接的接合层13,14层压以形成该半导体器件。电极部限制部件25为了抑制电极部12a，21c在直径方向的热膨胀而形成有与该对电极部12a，21c的至少一个电极部的外周抵接的部件，构件25通过接合层13接合到半导体芯片10，形成有电极部限制构件25的电极部分21c具有突起，并且与半导体芯片10相对的突起的接合表面进一步朝向半导体芯片侧比面向半导体芯片10的电极部件限制件25的接合表面。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2007263781A Dynamic quantity measuring device 有权
标题翻译：动态数量测量装置
公开(公告)号：JP2007263781A
公开(公告)日：2007-10-11
申请号：JP2006089834
申请日：2006-03-29
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： SHIMAZU HIROMI , OTA HIROYUKI , TANNO YOHEI
IPC分类号： G01B7/16 , G01L1/18 , G01L5/16 , H01L29/84
CPC分类号： G01L1/2293 , G01B7/18 , G01L1/18
摘要： PROBLEM TO BE SOLVED: To provide a dynamic quantity measuring device capable of measuring a strain component in a specific direction precisely. SOLUTION: In a semiconductor single crystal substrate and a semiconductor chip, at least ≥2 sets of bridge circuits are formed. The bridge circuits are formed by the combination of one bridge formed with a n-type diffusion resistor in which the measurement direction (longitudinal direction) of resistance variation under the flowing current is parallel to the direction of the semiconductor single crystal substrate, and the other bridge formed with a p-type diffusion resistor which is parallel to the direction. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够精确地测量特定方向上的应变分量的动态量测量装置。解决方案：在半导体单晶衬底和半导体芯片中，形成至少≥2组桥式电路。桥式电路由形成有n型扩散电阻器的一个桥的组合形成，其中流动电流下的电阻变化的测量方向（纵向方向）平行于半导体单晶衬底的<100>方向，另一个桥形成有平行于<110>方向的p型扩散电阻器。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2007010444A Wireless-strain measuring system 有权
标题翻译：无线应变测量系统
公开(公告)号：JP2007010444A
公开(公告)日：2007-01-18
申请号：JP2005190872
申请日：2005-06-30
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： AOYAMA HIROSHI , OTA HIROYUKI , SUMIKAWA TAKASHI
IPC分类号： G01B7/16
摘要： PROBLEM TO BE SOLVED: To provide a wireless-strain measuring system that provides one chip integrating a strain-detector, an amplifier, and a signal transducer, and can simply measure changes in fatigue life, by a compact sensor, arised from strain changes of a resin material, a rubber material, and concrete of a general industrial machinery.
SOLUTION: Three RF sensors are respectively mounted on the plate 18 in strain measuring directions which are differently placed by an angle of 45 degrees. The plate 18 is bonded to the lower part of the inner surface of the recess of a rectangular parallelepiped 22 that has an elastic modulus of Young's modulus of silicon or less, which has an inside dimension nearly equal to one side of the plate 18. Three RF sensors are respectively mounted on the plate 19 in strain measuring directions which are differently placed by an angle of 45 degrees. The plate 19 is bonded to the side of the inner surface of the rectangular parallelepiped 22. Three RF sensors are respectively mounted on the plate 20 in strain measuring directions which are differently placed by an angle of 45 degrees. The plate 20 is bonded to the front of the inner surface of the rectangular parallelepiped 22. Then, a cover 23 with each side equal to length of that of the rectangular parallelepiped 22 is mounted on the upper part of the rectangular parallelepiped 22.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种无线应变测量系统，其提供集成应变检测器，放大器和信号传感器的一个芯片，并且可以通过紧凑的传感器简单地测量疲劳寿命的变化，由一般工业机械的树脂材料，橡胶材料和混凝土的应变变化。解决方案：三个RF传感器分别安装在板18上，应变测量方向不同地以45度的角度放置。板18结合到长方体22的凹部的内表面的下部，该长方体22的内部尺寸几乎等于板18的一侧，其弹性模量为杨氏模量或更小的杨氏模量。三 RF传感器分别安装在板19上，应变测量方向被不同地放置45度的角度。板19结合到长方体22的内表面的侧面。三个RF传感器分别以应变测量方向安装在板20上，其不同地以45度的角度放置。板20结合到长方体22的内表面的前部。然后，每个侧面等于长方体22的长度的盖23安装在长方体22的上部。
版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2005244143A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2005244143A
公开(公告)日：2005-09-08
申请号：JP2004055630
申请日：2004-03-01
申请人： Elpida Memory Inc , Hitachi Ltd , エルピーダメモリ株式会社 , 株式会社日立製作所
发明人： TANIE HISAFUMI , KUNO NAE , OTA HIROYUKI , IKEDA HIROAKI , ANJO ICHIRO , KATAGIRI MITSUAKI , WATANABE YUJI
IPC分类号： H01L25/18 , H01L23/48 , H01L25/065 , H01L25/07 , H01L25/10
CPC分类号： H01L25/0657 , H01L23/481 , H01L24/48 , H01L2224/05573 , H01L2224/05647 , H01L2224/13025 , H01L2224/16145 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73204 , H01L2225/06513 , H01L2225/0652 , H01L2225/06541 , H01L2225/06589 , H01L2225/06593 , H01L2924/00014 , H01L2924/01019 , H01L2924/01079 , H01L2924/01087 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device where a temperature rise at the time of an operation can be reduced. SOLUTION: An interface chip 2 is laminated on a plurality of laminated semiconductor elements 1. An Si interposer 3 and a resin interposer 4 are arranged below a plurality of the semiconductor elements 1. The Si interposer 3 is arranged between the resin interposer 4, and a plurality of semiconductor elements 1 is thicker than the semiconductor element 1; and moreover has a coefficient of linear expansion which is smaller than that of the resin interposer 4 and larger than that of a plurality of the semiconductor elements 1. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供可以减少操作时的温度上升的半导体器件。解决方案：在多个层叠半导体元件1上层叠界面芯片2.在多个半导体元件1的下方配置有Si插入体3和树脂插入体4.Si中介层3配置在树脂插入体 4，多个半导体元件1比半导体元件1厚; 而且具有小于树脂插入件4的线膨胀系数，并且大于多个半导体元件1的线性膨胀系数。（C）2005，JPO＆NCIPI

7. 发明专利

JP2008008694A Strain measuring apparatus 审中-公开
标题翻译：应变测量装置
公开(公告)号：JP2008008694A
公开(公告)日：2008-01-17
申请号：JP2006177486
申请日：2006-06-28
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： TANNO YOHEI , OTA HIROYUKI , SHIMAZU HIROMI
IPC分类号： G01B7/16 , H01L29/84
摘要： PROBLEM TO BE SOLVED: To solve the problem wherein strain sensitivity varies widely in measuring strains by using a strain measuring apparatus composed of a silicon substrate, since the silicon substrate is high in rigidity.
SOLUTION: At least a strain detecting section is disposed on the principal surface of the silicon substrate, and an insulating film is disposed on the upper surface of the strain detecting section, and a protection layer is disposed on the upper surface of the insulating film. Electric wiring connected electrically with the strain detecting section is arranged in the protection layer, and a mounting face is disposed on the surface of the protection layer. Since the strain detecting section is made close to an object to be measured without the intermediary of the silicon substrate having a high rigidity, the area where a property following strains is stable, is expanded, whereby the variation in strain sensitivity is reduced.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决问题：为了解决通过使用由硅基板构成的应变测量装置的应变灵敏度变化很大的问题，由于硅基板的刚性高。解决方案：至少一个应变检测部分设置在硅衬底的主表面上，并且绝缘膜设置在应变检测部分的上表面上，并且保护层设置在应变检测部分的上表面上绝缘膜。与应变检测部分电连接的电线布置在保护层中，并且安装面设置在保护层的表面上。由于应变检测部分靠近被测物体而不具有刚性高的硅基片，所以随后的应变特性的区域是稳定的，因此应变灵敏度的变化减小。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2007255953A Dynamic quantity measuring device 审中-公开
标题翻译：动态数量测量装置
公开(公告)号：JP2007255953A
公开(公告)日：2007-10-04
申请号：JP2006077951
申请日：2006-03-22
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： SHIMAZU HIROMI , OTA HIROYUKI
IPC分类号： G01B7/16 , H01L29/84
CPC分类号： G01B7/18
摘要： PROBLEM TO BE SOLVED: To inhibit a dynamic quantity measuring device composed of a single crystal silicone substrate from breaking by a large distortion.
SOLUTION: On the rear face of the sensor chip formed with a semiconductor single crystal substrate, a distortion detector mounted plate for measuring the distortion is provided. Even if a large distortion happens to occur, the distortion occurred in the object body to be measured can be controlled by the mounted plate, therefore the semiconductor single crystal substrate does't be broken. Consequently, the dynamic quantity measurement device of high reliability can be provided.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：抑制由单晶硅基板构成的动态量测量装置由于大的变形而破裂。解决方案：在形成有半导体单晶衬底的传感器芯片的背面上，提供用于测量失真的失真检测器安装板。即使发生大的失真，可以通过安装的板来控制待测物体发生的失真，因此半导体单晶基板不会断裂。因此，可以提供高可靠性的动态量测量装置。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2007243478A Sensor network system, base station, and relay method for sensing data 有权
标题翻译：传感器网络系统，基站和传感数据的继电器方法
公开(公告)号：JP2007243478A
公开(公告)日：2007-09-20
申请号：JP2006061732
申请日：2006-03-07
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： OGUSHI MINORU , MURO HIROAKI , OTA HIROYUKI
IPC分类号： H04B7/24 , H04L29/06 , H04Q9/00 , H04W4/04 , H04W4/18
CPC分类号： G06Q10/0875
摘要： PROBLEM TO BE SOLVED: To easily perform subscription of a new sensor nodes and adoption of a new telecommunication standard using a legacy sensor network system, while effectively utilizing restricted wireless communication resources. SOLUTION: A sensor node SN1 comprises a wireless communication SRF for transmitting a measurement value detected by a sensor SS and the identifier of the sensor node as a sensing data of binary format. A base station BST comprises: a wireless communication control unit BRF for receiving the sensing data from the sensor node SN1; a wired communication control unit BNIC for transmitting the received sensing data to a server SNS; a translation definition information selector for selecting a translation definition information corresponding to the identifier contained in the sensing data among a plurality of translation definition information established beforehand; and a translation engine for translating the sensing data of binary format into the sensing data of text format, based on the selected translation definition information. The server SNS comprises a database DB for storing the sensing data of text format received from the wired network. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：在有效利用受限的无线通信资源的同时，可以轻松地执行新传感器节点的订阅和使用传统传感器网络系统采用新的电信标准。传感器节点SN1包括用于发送由传感器SS检测的测量值和传感器节点的标识符作为二进制格式的感测数据的无线通信SRF。基站BST包括：用于从传感器节点SN1接收感测数据的无线通信控制单元BRF; 用于将接收到的感测数据发送到服务器SNS的有线通信控制单元BNIC; 翻译定义信息选择器，用于在预先建立的多个翻译定义信息中选择与包含在感测数据中的标识符相对应的翻译定义信息; 以及翻译引擎，用于基于所选择的翻译定义信息将二进制格式的感测数据转换为文本格式的感测数据。服务器SNS包括用于存储从有线网络接收的文本格式的感测数据的数据库DB。版权所有（C）2007，JPO＆INPIT

10. 发明专利

JP2006267051A Device and system for detecting article damage 审中-公开
标题翻译：用于检测物品损坏的装置和系统
公开(公告)号：JP2006267051A
公开(公告)日：2006-10-05
申请号：JP2005089452
申请日：2005-03-25
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： OTA HIROYUKI , SUMIKAWA TAKASHI , NAKAJIMA HIROSHI , TERADA SHUJI
IPC分类号： G01B7/16 , G08C17/00
摘要： PROBLEM TO BE SOLVED: To enable detection of article damages, regardless of the presence of a package and an attitude of an article. SOLUTION: A device for detecting article damages includes a detection plate 3 composed of a deformable plate, a semiconductor chip 4 having a strain sensor 15 bonded to the detecting plate 3, and a communication section 5 that wirelessly transmits the output of the strain sensor to the outside and are detected, by sticking the device for detecting article damages to an objective article 7, to transmit a read command from a reader 2, and then transmitting the detected output of the sensor 15 to the reader 2 from the communications section 5. COPYRIGHT: (C)2007,JPO&INPIT

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