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1. 发明专利

JP2011142724A Noncontact power transmission device and near field antenna for same 审中-公开
标题翻译：非相干电力传输装置及其相邻的场天线
公开(公告)号：JP2011142724A
公开(公告)日：2011-07-21
申请号：JP2010001254
申请日：2010-01-06
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： CHOE SEONG-HUN , KANAMARU MASATOSHI
IPC分类号： H02J17/00
CPC分类号： H02J50/12 , H01F38/14 , H02J5/005 , H04B5/0037 , H04B5/0081
摘要： PROBLEM TO BE SOLVED: To provide a structure for improving power transmission efficiency by rasing a Q-value of a near field antenna used in a noncontact power transmission device which utilizes magnet field coupling in a near field.
SOLUTION: In the near field antenna used in the noncontact power transmission device, a resonance circuit including a resonating first inductor 31 and a first capacitor 32 is linearly separated from a power transmission circuit or a power receiving circuit; electromagnetic coupling or induction coupling is applied between the power transmission circuit or the power receiving circuit and the near field antenna; by using a second inductor 33 or a second capacitor 34; and a high Q-value is maintained, even if the coupling between the antennas is lowered due to a separation distance between the antennas.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：提供一种用于通过在近场中利用磁场耦合的非接触式动力传递装置中使用的近场天线的Q值的提高来提高功率传输效率的结构。解决方案：在非接触式电力传输装置中使用的近场天线中，包括谐振的第一电感器31和第一电容器32的谐振电路与电力传输电路或电力接收电路线性分离; 在电力传输电路或受电电路与近场天线之间施加电磁耦合或感应耦合; 通过使用第二电感器33或第二电容器34; 并且即使天线之间的耦合由于天线之间的间隔距离而降低，也保持高Q值。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2006252646A Optical recording and reproducing device, optical head used for the same and method for manufacturing the same 审中-公开
标题翻译：光学记录和再现装置，用于其的光学头和用于制造它的方法
公开(公告)号：JP2006252646A
公开(公告)日：2006-09-21
申请号：JP2005066467
申请日：2005-03-10
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： KANAMARU MASATOSHI , HORINO MASAYA , KIMURA KATSUHIKO , SHIMANO TAKESHI
IPC分类号： G11B7/135 , G11B7/22
摘要： PROBLEM TO BE SOLVED: To attain higher recording density by allowing high precision positioning in a small-sized low-cost optical recording and reproducing device. SOLUTION: The optical recording and reproducing device 50 stores information in a recording medium 51 or reproduces the information in the recording medium 51 using laser beams and has an optical head 52 on which a microlens 6 for focusing the laser beams is loaded, a head support mechanism 53 which supports the optical head 52 and a driving gear 54 which drives the head support mechanism 53 so as to transfer the optical head 52 in the radial direction of the recording medium 51. The optical head 52 has a substrate consisting of a peripheral substrate part 18 supported to the head support mechanism 53 and a lens loading substrate part 19 supported at the center of the peripheral substrate part 18 to be displaced, the microlens 6 loaded on the lens loading substrate part 19 and a micromotion actuator 33 which drives the lens loading substrate part 19. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：通过允许在小尺寸的低成本光学记录和再现装置中的高精度定位来获得更高的记录密度。解决方案：光学记录和再现装置50将信息存储在记录介质51中，或者使用激光束再现记录介质51中的信息，并且具有加载用于聚焦激光束的微透镜6的光学头52，支撑光学头52的头部支撑机构53和驱动头部支撑机构53以沿着记录介质51的径向传送光学头52的驱动齿轮54.光学头52具有由支撑在头部支撑机构53上的周边基板部分18和支撑在待移动的周边基板部分18的中心处的透镜加载基板部分19，装载在透镜加载基板部分19上的微透镜6和微动作致动器33，驱动透镜加载基板部分19.版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JPH11274251A Manufacture of semiconductor device 失效
标题翻译：半导体器件的制造
公开(公告)号：JPH11274251A
公开(公告)日：1999-10-08
申请号：JP6978698
申请日：1998-03-19
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： KONO RYUJI , KITANO MAKOTO , MIURA HIDEO , OTA HIROYUKI , ENDO KIJU , HARADA TAKESHI , KANAMARU MASATOSHI , AKASHI TERUHISA , HOSOGANE ATSUSHI , ARIGA AKIHIKO , BAN NAOTO
IPC分类号： H01L21/66 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/26 , G01R31/28
CPC分类号： G01R1/07314 , G01R1/06744 , G01R3/00 , G01R31/2863
摘要： PROBLEM TO BE SOLVED: To enable collective inspection of a large region of an electrode pad of a wafer in an electric characteristic inspection process, by pressing a protrusion of an inspection structure body which is electrically connected with a pad on the opposite surface against a desired position of an object to be inspected, in a probing process and a burn-in inspection process.
SOLUTION: A first plate member 1 has a protrusion 11 group on a surface facing an object 2 to be inspected. On the tips of the protrusion 11 group, a wiring pattern 12 for obtaining electric continuity between the object 2 to be inspected and the outside is formed. The wiring pattern 12 is electrically connected with the rear of a surface of the first plate member 1 on which the protrusion 11 group is formed, through a penetrating hole 13. On the rear of the first plate member 1, an insulating film 3 is formed excepting a pad 121 part formed in the end portion of the wiring pattern 12. As a result, electric continuous paths of a pad to be inspected of the object 2 which exists in a projection surface of the first plate member 1 are all present in the projection surface of the first plate member 1. As a result, collective inspection of a large region of the electrode pad of a wafer in an electric characteristic inspection process is enabled.
COPYRIGHT: (C)1999,JPO
摘要翻译：要解决的问题：为了能够在电特性检查过程中对晶片的电极焊盘的大区域进行集体检查，通过将与相对表面上的焊盘电连接的检查结构体的突起压靠在期望的在检测过程和老化检查过程中要检查的物体的位置。解决方案：第一板构件1在面向待检查物体2的表面上具有突起11组。在突起11组的尖端上，形成用于获得被检查物体2与外部之间的电连续性的布线图案12。布线图案12通过贯通孔13与形成有突起11组的第一板构件1的表面的后部电连接。在第一板构件1的后部形成有绝缘膜3 除了形成在布线图案12的端部中的垫121部分之外。结果，存在于第一板构件1的突出表面中的被检体2的待检查的垫的电连续路径全部存在于从而能够在电特性检查处理中对晶片的电极焊盘的大区域进行集体检查。

4. 发明专利

JP2012009546A Thin-film manufacturing method, thin-film fitted substrate, and thin-film manufacturing apparatus 审中-公开
标题翻译：薄膜制造方法，薄膜基板和薄膜制造设备
公开(公告)号：JP2012009546A
公开(公告)日：2012-01-12
申请号：JP2010142776
申请日：2010-06-23
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： KANAMARU MASATOSHI , NAKAZATO NORIO , SANO YUICHIRO , IKEDA YUTAKA , TEI TERU , MIYASAKA TORU
IPC分类号： H05K3/10 , H01L31/04 , H05K1/09
CPC分类号： Y02E10/541 , Y02P70/521
摘要： PROBLEM TO BE SOLVED: To provide a method for producing fine thin-film efficiently by a metal nano-grain printing process and a manufacturing apparatus for the same.SOLUTION: A first composition layer is formed by applying a coating of paste or dispersion containing powder and nano-grain on a substrate, the layer being temporarily burned thereafter. Next, a coating of paste or dispersion containing powder and nano-grain is applied on the first composition layer to form a second composition layer, which is then temporarily burned. Finally, heating and pressurizing treatments are applied simultaneously to form a thin-film composition layer on the substrate.
摘要翻译：解决的问题：提供一种通过金属纳米粒子印刷法及其制造装置有效地制造精细薄膜的方法。解决方案：通过在基材上涂覆含有粉末和纳米颗粒的浆料或分散体涂层形成第一组合物层，此后该层被暂时燃烧。接下来，在第一组合物层上涂布含有粉末和纳米颗粒的糊剂或分散体涂层，形成第二组合物层，然后将其暂时燃烧。最后，同时施加加热和加压处理以在基材上形成薄膜组合物层。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2006236516A Optical head, optical information reproducing apparatus, and its manufacturing method 审中-公开
标题翻译：光学头，光学信息再现设备及其制造方法
公开(公告)号：JP2006236516A
公开(公告)日：2006-09-07
申请号：JP2005052252
申请日：2005-02-28
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： SHIMANO TAKESHI , KANAMARU MASATOSHI , HORINO MASAYA
IPC分类号： G11B7/135 , G11B7/22
CPC分类号： G11B7/08576 , G11B7/123 , G11B7/1374
摘要： PROBLEM TO BE SOLVED: To solve the problem that if a lens is miniaturized to be integrated with a light source and a photo detector, the lens or other optical parts have to be made small, and handling for assembling and adjustment becomes remarkably difficult. SOLUTION: An optical head comprises; a first substrate 109 having a lens 108 which condenses light on an information recording medium; a second substrate 101 having detectors 102 and 103 on its surface; and a layer 107 having a prism and a mirror 105 between the first and the second substrates, and in this layer, there is formed a cavity 106 in which a light source 104 is prepared. These lens, mirror, prism, light source, and photodetector are all arranged on a wafer adjusted by an alignment mark and formed. Thereby, adjustment is easy and it is not necessary to adjust small components by handling. The manufacturing of super small optical heads at low cost in a large quantity and at high precision becomes possible. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题为了解决如果将镜头小型化以与光源和光电检测器一体化的问题，则必须使透镜或其他光学部件变小，并且组装和调整的处理变得显着难。解决方案：光头包括：第一基板109，其具有将光聚光在信息记录介质上的透镜108; 在其表面上具有检测器102和103的第二基板101; 以及在第一和第二基板之间具有棱镜和反射镜105的层107，并且在该层中形成有其中制备光源104的空腔106。这些透镜，反射镜，棱镜，光源和光电检测器都布置在由对准标记调节并形成的晶片上。因此，调整容易，并且不需要通过处理来调整小部件。以低成本大量高精度制造超小型光头是可能的。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2010085139A Thin-film testing device 审中-公开
标题翻译：薄膜测试设备
公开(公告)号：JP2010085139A
公开(公告)日：2010-04-15
申请号：JP2008252133
申请日：2008-09-30
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： CHOE SEONG-HUN , KANAMARU MASATOSHI
IPC分类号： G01N3/00 , G01N3/08 , G01N3/20 , G01N3/22 , G01N3/32
摘要： PROBLEM TO BE SOLVED: To provide a thin-film testing device precisely measuring fatigue characteristics, such as bending, tensioning and twisting of a thin-film material in a micromachine without using any external actuators.
SOLUTION: The thin-film testing device includes: an evaluation chip formed with a thin film; a means for applying external force to the evaluation chip; and a measurement means for measuring the amount of distortion generated in the evaluation chip by external force. The evaluation chip has an external force generation board where a coil is formed at an upper side, a thin-film test piece, and a frame structure for supporting them, and is composed so that the external force generation board is displaced by Lorentz force generated when current is carried to the coil in the external force generation board and external force is applied to the thin-film test piece.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种薄膜测试装置，其不使用任何外部致动器来精确地测量诸如微机械中的薄膜材料的弯曲，张紧和扭曲的疲劳特性。薄膜测试装置包括：形成有薄膜的评估芯片; 用于将外力施加到评估芯片的装置; 以及用于通过外力测量在评估芯片中产生的失真量的测量装置。评价用芯片具有在上侧形成有线圈的外力产生板，薄膜测试片和用于支撑它们的框架结构，并且构成为使得外力产生板被产生的洛伦兹力产生位移当电流被传送到外力产生板中的线圈并且外力施加到薄膜测试片上时。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2004015030A Method of manufacturing semiconductor device 有权
公开(公告)号：JP2004015030A
公开(公告)日：2004-01-15
申请号：JP2002170774
申请日：2002-06-12
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： KANAMARU MASATOSHI , AONO TAKANORI , NAGATA TATSUYA , KAWAKAMI KENJI , AOKI HIDEYUKI
IPC分类号： G01R31/26 , G01R1/067 , G01R1/073 , G01R3/00 , H01L21/66
CPC分类号： G01R1/06761 , G01R1/0735 , G01R3/00
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device which allows the production of low-cost and reliable semiconductor devices, by including a process of bringing an inspection device into a reliable contact with electrode pads while controlling damages on the electrode pads by appropriate pressure, even if many electrodes are inspected, and thereby increasing a manufacturing yield in semiconductor manufacturing processes and reducing a manufacturing cost.
SOLUTION: In the semiconductor manufacturing processes, a substrate to be used for failure inspection of a semiconductor device comprises a beam, a projecting probe which is equipped in the beam and is to be brought into contact with the electrodes to be inspected (electrode pads) of a semiconductor device to be inspected, and a secondary electrode which is electrically connected to one side of the substrate opposite from the side where the probe is formed, via the probe and a conductive member. The semiconductor device manufacturing processes include an inspection process which is carried out by bringing the inspection device with the probe formed with a layer having many projections, into contact with the electrodes of the semiconductor device to be inspected. The failure test of the semiconductor device can be carried out by the inspection process.
COPYRIGHT: (C)2004,JPO

8. 发明专利

JP2003338529A Semiconductor device manufacturing method 审中-公开
标题翻译：半导体器件制造方法
公开(公告)号：JP2003338529A
公开(公告)日：2003-11-28
申请号：JP2002145554
申请日：2002-05-21
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： SAHO NORIHIDE , ISOKAMI HISASHI , KONO AKIOMI , KANAMARU MASATOSHI , SHIMIZU HIROYA
IPC分类号： H01L21/66
摘要： PROBLEM TO BE SOLVED: To test in a bated a large region of an electrode pad of a test body in an electrical characteristic test process that is one of semiconductor manufacturing processes. SOLUTION: The electrical characteristic test is performed by pressing a testing structure to a test body using a magnetic force. The testing structure is formed with electrically independent protrusions whose number is equal to that of test target conductors formed in a region targeted for the test of the test body. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：在作为半导体制造工艺之一的电特性测试过程中，在测试体的电极焊盘的大区域中进行测试。
解决方案：通过使用磁力将测试结构按压到测试体进行电特性测试。测试结构形成有电独立的突起，其数量等于在用于测试体的测试的区域中形成的测试目标导体的数量。版权所有（C）2004，JPO

9. 发明专利

JP2003045924A Apparatus for inspecting semiconductor element and its manufacturing method 审中-公开
标题翻译：检测半导体元件及其制造方法的装置
公开(公告)号：JP2003045924A
公开(公告)日：2003-02-14
申请号：JP2001234791
申请日：2001-08-02
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： KANAMARU MASATOSHI , ENDO KIJU , AONO TAKANORI , KONO RYUJI , SHIMIZU HIROYA , BAN NAOTO , AOKI HIDEYUKI
IPC分类号： G01R31/26 , G01R1/073 , G01R31/28 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing a semiconductor element, for cost reduction, where a contactor is positioned with high accuracy on the entire surface of a wafer for uniform contact, thus allowing inspection of a large diameter wafer.
SOLUTION: Grooves 25 for positioning are formed in a plurality of contactor blocks 1 that are divided, and the positioning of a plurality of contactor blocks 1 is carried out by positioning frames 2 using the groove 25. Because the plurality of contactor blocks 1 are divided from each other, when compared to the case that many contactors are unitedly formed without dividing them from each other, the uniformity of the surface is less damaged by a part of surface distortion influence on other portion, and thus a plurality of contactors 1 can be made to contact an inspected wafer 3 uniformly. Further, even if abnormality or the like occurs in a part of the contactor blocks 1, only the part of the contractor blocks 1 may be changed, and when compared to the case that many contactors are unitedly formed without dividing them from each other, replacement cost can be reduced.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了提供一种用于制造半导体元件的装置，为了降低成本，在接触器的整个表面上高精度地定位接触器以进行均匀接触，从而允许检查大直径晶片。解决方案：用于定位的槽25形成在被分割的多个接触器块1中，并且通过使用槽25定位框架2来执行多个接触器块1的定位。由于多个接触器块1被分割相比之下，与许多接触器相互并联形成而没有彼此分离的情况相比，表面的均匀性被其他部分的表面变形影响的一部分损坏较少，因此多个接触器1可以是使得被检查的晶片3均匀地接触。此外，即使在接触器块1的一部分中发生异常等，也可以只改变承载件块1的一部分，并且与多个接触器形成为一体但不分开的情况相比，更换成本可以降低。

10. 发明专利

JP2007219303A Fabrication method of microlens mold 审中-公开
标题翻译：微型模具的制造方法
公开(公告)号：JP2007219303A
公开(公告)日：2007-08-30
申请号：JP2006041346
申请日：2006-02-17
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： NANBA IRIZOU , NAKAMURA SHIGEO , KANAMARU MASATOSHI
IPC分类号： G02B3/00
CPC分类号： B29D11/00365 , B29C33/3842 , B29C33/56
摘要： PROBLEM TO BE SOLVED: To provide a fabrication method of a mold for manufacturing an aspherical microlens which has arbitrary flat aspherical surface and has such dimensions that lens diameter is 1 mm or less and thickness is 0.5 mm or more.
SOLUTION: A two-layered mask layer is formed on a single crystal silicon substrate, anisotropic etching and isotropic etching are performed by using a first mask layer to form a concave part having a diameter a little smaller than that of a desired microlens mold and, thereafter, isotropic etching is performed and the concave part is magnified by using a second mask layer to provide the microlens mold having a desired dimensions.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：提供一种用于制造具有任意平面非球面的非球面微透镜的模具的制造方法，并且具有使透镜直径为1mm以下且厚度为0.5mm以上的尺寸。解决方案：在单晶硅衬底上形成双层掩模层，通过使用第一掩模层进行各向异性蚀刻和各向同性蚀刻，以形成具有比期望的微透镜的直径稍小的直径的凹部然后进行各向同性蚀刻，并且通过使用第二掩模层来放大凹部以提供具有期望尺寸的微透镜模具。版权所有（C）2007，JPO＆INPIT

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