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    • 4. 发明专利
    • Inspection method using electron beam, and inspection device
    • 使用电子束的检查方法和检查装置
    • JP2009245953A
    • 2009-10-22
    • JP2009174889
    • 2009-07-28
    • Hitachi Ltd株式会社日立製作所
    • IWABUCHI HIROKOTODOKORO HIDEOMORI HIROYOSHISATO MITSUGIUSAMI YASUTSUGUICHIHASHI MIKIOFUKUHARA SATORUSHINADA HIROYUKIKANEKO YUTAKASUGIYAMA KATSUYATAKATO ATSUKOTOOYAMA HIROSHI
    • H01J37/28H01J37/147H01J37/244H01J37/29H01L21/66
    • PROBLEM TO BE SOLVED: To provide: an inspection method using an electron beam and capable of increasing the speed of inspection; and an inspection device. SOLUTION: An electron beam 36 from an electron gun 1 is converged by an objective lens 9, and decelerated by a retarding voltage applied to a sample 13; the sample 13 is scanned by the electron beam while moving; secondary electrons 33 generated from the sample 13 are accelerated by the retarding voltage, formed into a nearly parallel beam, deflected by an E×B deflector 18 arranged between the objective lens 9 and the sample 13 to irradiate a secondary electron generator 19; and second secondary electrons 20 are generated from the secondary electron generator 19 and detected by a charged particle detector 21. An output signal generated by the detection thereof is stored as an image signal, the stored image is compared in a calculation part 29 and a defect determination part 30, and a defect is determined. COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供:使用电子束的检查方法并且能够提高检查速度; 和检查装置。 解决方案:来自电子枪1的电子束36被物镜9会聚,并通过施加到样品13的延迟电压而减速; 移动时样品13被电子束扫描; 由样品13产生的二次电子33被延迟电压加速,形成为几乎平行的光束,该光束由布置在物镜9和样品13之间的E×B偏转器18偏转,以照射二次电子发生器19; 并且从二次电子发生器19产生第二二次电子20并由带电粒子检测器21检测。通过检测产生的输出信号作为图像信号存储,在计算部分29中比较存储的图像和缺陷 确定部分30,并且确定缺陷。 版权所有(C)2010,JPO&INPIT
    • 7. 发明专利
    • Inspection method and device using electron beam
    • 使用电子束的检查方法和装置
    • JP2009016360A
    • 2009-01-22
    • JP2008269292
    • 2008-10-20
    • Hitachi Ltd株式会社日立製作所
    • IWABUCHI HIROKOTODOKORO HIDEOMORI HIROYOSHISATO MITSUGIUSAMI YASUTSUGUICHIHASHI MIKIOFUKUHARA SATORUSHINADA HIROYUKIKANEKO YUTAKASUGIYAMA KATSUYATAKATO ATSUKOTOOYAMA HIROSHI
    • H01J37/28H01J37/147
    • PROBLEM TO BE SOLVED: To provide an inspection method and device using electron beam in which inspection can be made at a higher speed.
      SOLUTION: Electron beam generated by an electron beam source is focused on a test piece by an object lens, and the test piece is scanned by the electron beam, and the electron bean is deflected so that a charged particle can be generated from the test piece, and the test piece is moved continuously while scanning and a focusing distance of the object lens is rectified by measuring a height of the test piece while the test piece is moving, and the charged particle generated from the test piece is detected from between the object lens and the test piece by a charged particle detecting unit and is converted into an electric signal, and the electric signal is memorized as an image signal and an image comparison is conducted by using the memorized image signal and a test piece defect is detected.
      COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:提供一种使用能够以更高速度进行检查的电子束的检查方法和装置。 解决方案:由电子束源产生的电子束通过物镜聚焦在测试片上,并通过电子束扫描测试片,电子束被偏转,从而可以从 测试片和试片在扫描时连续移动,并且通过在测试件移动时测量测试件的高度来校正物镜的聚焦距离,并且从测试片产生的带电粒子从 通过带电粒子检测单元在物镜和测试片之间转换为电信号,并将电信号存储为图像信号,并通过使用存储的图像信号进行图像比较,并且测试片缺陷为 检测到。 版权所有(C)2009,JPO&INPIT
    • 8. 发明专利
    • Inspection device using electron beam
    • 使用电子束的检查装置
    • JP2004349264A
    • 2004-12-09
    • JP2004218049
    • 2004-07-27
    • Hitachi Ltd株式会社日立製作所
    • IWABUCHI HIROKOTODOKORO HIDEOMORI HIROYOSHISATO MITSUGIUSAMI YASUTSUGUICHIHASHI MIKIOFUKUHARA SATORUSHINADA HIROYUKIKANEKO YUTAKATAKATO ATSUKOTOOYAMA HIROSHISUGIYAMA KATSUYA
    • H01L21/66H01J37/20H01J37/28
    • PROBLEM TO BE SOLVED: To provide an inspection method and an inspection device using an electron beam achieving a higher resolution, higher speed and reliability, and a reduction in size. SOLUTION: A voltage is applied to a sample via a sample stage. An electron beam is converged on the sample, and the sample is scanned. The sample stage is continuously moved during the scanning, and charged particles generated from the sample are detected to thereby detect a defect of the sample, wherein a distance between the sample stage and a shield frame is determined on the basis of a limit of discharge occurring between the sample stage and the shield frame. There is provided a coil of at least six poles for correcting the shape of the electron beam. The electron beam is deflected for blanking during movement of the sample, with the crossover of the electron beam taken as a fulcrum of blanking. The magnitude of the voltage applied to the sample is determined according to the kind of the sample. COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供一种使用电子束实现更高分辨率,更高速度和可靠性以及尺寸减小的检查方法和检查装置。 解决方案:通过样品台向样品施加电压。 电子束会聚在样品上,扫描样品。 在扫描期间连续地移动样品台,并且检测从样品产生的带电粒子,从而检测样品的缺陷,其中基于放电极限确定样品台与屏蔽框架之间的距离 在样品台和屏蔽框架之间。 提供了用于校正电子束形状的至少六极的线圈。 电子束在样品移动期间被偏转以进行消隐,电子束的交叉作为消隐的支点。 根据样品的种类确定施加到样品的电压的大小。 版权所有(C)2005,JPO&NCIPI
    • 9. 发明专利
    • Inspection method and inspection device using electron beam
    • 使用电子束的检查方法和检查装置
    • JP2010257994A
    • 2010-11-11
    • JP2010179920
    • 2010-08-11
    • Hitachi Ltd株式会社日立製作所
    • IWABUCHI HIROKOTODOKORO HIDEOMORI HIROYOSHISATO MITSUGIUSAMI YASUTSUGUICHIHASHI MIKIOFUKUHARA SATORUSHINADA HIROYUKIKANEKO YUTAKASUGIYAMA KATSUYATAKATO ATSUKOTOOYAMA HIROSHI
    • H01J37/28H01J37/244H01L21/66
    • PROBLEM TO BE SOLVED: To provide an inspection method and device, capable of performing the inspection at a higher speed, using an electron beam.
      SOLUTION: An electron beam 36 from an electron gun 1 is converged by an objective lens 9 and decelerated by a retarding voltage impressed to a sample 13; the sample 13 is scanned by the electron beam, while being moved; secondary electrons 33 generated from the sample 13 are accelerated by the retarding voltage to make a nearly parallel beam which is deflected by an E×B deflector 18, arranged between the objective lens 9 and the sample 13 and has a secondary electron generating body 19 irradiated; and second secondary electrons 20 are generated from the secondary electron generating body 19, and second detected by a charged particle detector 21. The output signal detected is stored as an image signal, and the image stored is compared in an operation section 29 and a defect determining section 30 to thereby determine defects.
      COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:提供能够使用电子束以更高速度进行检查的检查方法和装置。 解决方案:来自电子枪1的电子束36被物镜9会聚并通过施加到样品13的延迟电压而减速; 样品13被电子束扫描同时被移动; 从样品13产生的二次电子33被延迟电压加速,以形成由配置在物镜9和样品13之间的E×B偏转器18偏转的近似平行的光,并且具有照射的二次电子发生体19 ; 并且从二次电子发生体19产生第二二次电子20,并且由带电粒子检测器21检测出第二二次电子20.检测出的输出信号作为图像信号存储,并且在操作部29中比较存储的图像和缺陷 确定部30,从而确定缺陷。 版权所有(C)2011,JPO&INPIT
    • 10. 发明专利
    • Electron source and electron beam irradiation device equipped with the same
    • 电子源和电子束照射装置与其配套
    • JP2006156418A
    • 2006-06-15
    • JP2006058835
    • 2006-03-06
    • Hitachi Ltd株式会社日立製作所
    • FUKUHARA SATORU
    • H01J37/06
    • H01J2237/06316
    • PROBLEM TO BE SOLVED: To provide an optimum structure of an SE electron source for an electron gun changing probe current by a control voltage, used for an electron beam application device such as an electron microscope and an electron beam drawing device.
      SOLUTION: As a structure of an SE electron source adopting a cone angle of 15°or less, and the radius of curvature of 0.5μm or less at the tip of a chip, it is sufficient for the electron gun using the SE electron source to set only one draw-out voltage since a variable range of the obtained probe current with respect to the change of a control voltage becomes large. Moreover, since the value of the draw-out voltage becomes small, the breakage of the chip caused by discharge is prevented, and the stability of the electron gun is enhanced.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:提供用于电子枪的SE电子源的最佳结构,其通过用于电子束施加装置如电子显微镜和电子束引出装置的控制电压来改变探针电流。 解决方案:作为采用锥形角度为15°以下的SE电子源的结构,芯片前端的曲率半径为0.5μm以下,使用SE的电子枪就足够了 电子源仅设置一个拉出电压,因为所获得的探针电流相对于控制电压的变化的可变范围变大。 此外,由于引出电压的值变小,所以防止由放电引起的芯片的断线,提高了电子枪的稳定性。 版权所有(C)2006,JPO&NCIPI