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    • 3. 发明专利
    • Semiconductor device
    • 半导体器件
    • JPS59103381A
    • 1984-06-14
    • JP21084983
    • 1983-11-11
    • Hitachi Ltd
    • ANDOU HARUHISAOOBA SHINYAKURE TOKUOTAKEMOTO KAYAOAOKI MASAKAZUNAKAI MASAAKIIZAWA RIYUUICHIKUBO SEIJI
    • H01L29/78
    • H01L29/78
    • PURPOSE:To contrive improvement in characteristics of the titled semiconductor device by a method wherein an insulating film is provided between at least one of the source and drain located on an IGFET and a substrate. CONSTITUTION:Insulating films 201 and 202 such as SiO2 and the like are interposed between a P type Si substrate and an N type source and drain layer. According to this constitution, the capacitance between the source-drain and the substrate is lowered, and the leak current generating between them is also reduced. Besides, the punch-through withstand voltage of the device is increased, the parasitic bipolar transistor effect which is a short-channel effect can also be suppressed, and no deterioration is generated on the other characteristics.
    • 目的:通过在位于IGFET和基板上的源极和漏极中的至少一个之间提供绝缘膜的方法来改进标题半导体器件的特性的改进。 构成:在P型Si衬底和N型源漏层之间插入诸如SiO 2等的绝缘膜201和202。 根据该结构,源极 - 漏极和衬底之间的电容降低,并且它们之间产生的漏电流也降低。 此外,器件的穿通耐受电压增加,也可以抑制作为短沟道效应的寄生双极晶体管效应,并且不会在其他特性上产生劣化。