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    • 5. 发明专利
    • Fine structure transfer device
    • 精细结构传输设备
    • JP2006062208A
    • 2006-03-09
    • JP2004247686
    • 2004-08-27
    • Hitachi Industries Co Ltd株式会社 日立インダストリイズ
    • KONDO YUMITOTAKAHASHI KAZUOOGINO MASAHIKOMIYAUCHI AKIHIROANDO TAKUJIKUWABARA KOSUKE
    • B29C59/02B29C59/00B29L7/00B81C99/00H01L21/027
    • PROBLEM TO BE SOLVED: To provide a fine structure transfer device which can transfer the fine structure exactly at a desired position of a substrate by mounting the substrate and a stamper exactly on a stage.
      SOLUTION: In the fine structure transfer device, the substrate 11 and the stamper 10 are mounted on the flat substrate installation surface Sa of the stage 13 to face each other, and the substrate 11 is die-pressed with the stamper 10 to form a desired uneven pattern on the substrate. A provisional installation surface Sb for the substrate 10 and the stamper 11 which are arranged at positions higher than the substrate installation surface Sa of the stage 13 is provided. A provisional placement members 25-27 are set, which move the provisional installation surface Sb gradually to the same plane position as the substrate installation surface Sa of the stage 13 when the substrate 11 and the stamper 10 are mounted on the provisional installation surface Sb.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:提供一种精细结构转移装置,其可以通过将基板和压模精确地安装在台架上将精细结构精确地转移到基板的期望位置。 解决方案:在精细结构转印装置中,将基板11和压模10安装在台13的平坦基板安装表面Sa上以彼此面对,并且将基板11与压模10压模到 在基板上形成期望的不均匀图案。 提供了布置在比台13的基板安装面Sa高的位置的基板10和压模11的临时安装面Sb。 设置临时放置构件25-27,当基板11和压模10安装在临时安装表面Sb上时,使临时安装表面Sb逐渐移动到与载物台13的基板安装表面Sa相同的平面位置。 版权所有(C)2006,JPO&NCIPI