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1. 发明专利

JP2014091782A Prepreg preservation method, laminate, and laminate packaging material 有权
标题翻译： PREPREG保存方法，层压板和层压包装材料
公开(公告)号：JP2014091782A
公开(公告)日：2014-05-19
申请号：JP2012243064
申请日：2012-11-02
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： MORITA KOJI , SAKAI KAZUNAGA , TAKAHARA NAOKI
IPC分类号： C08J5/24 , B32B5/28 , B65D81/24 , B65D81/26
摘要： PROBLEM TO BE SOLVED: To provide a prepreg preservation method, a laminate, and a laminate packaging material, capable of holding desmear resistance.SOLUTION: This invention provides [1] a prepreg preservation method for preserving a laminate of at least one sheet-like drying agent and at least one prepreg made by impregnating glass cloth with a resin composition, [2] the laminate, and [3] a laminate packaging material containing the laminate.
摘要翻译：要解决的问题：提供一种能够保持耐去霉性的预浸料保鲜方法，层压体和层压包装材料。本发明提供[1]一种预浸料保存方法，其用于保存至少一片片状的层压体干燥剂和至少一种通过用树脂组合物浸渍玻璃布制成的预浸料，[2]层压板，和[3]含有层压板的层压包装材料。

2. 发明专利

JP2014012760A Prepreg using organic fiber base material and manufacturing method of the same, and laminated plate, metal foil-clad laminated plate, and wiring board using the prepreg 审中-公开
标题翻译： PREPREG使用有机纤维基材料及其制造方法，以及层压板，金属箔层压板和使用PREPREG的接线板
公开(公告)号：JP2014012760A
公开(公告)日：2014-01-23
申请号：JP2012150386
申请日：2012-07-04
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： MORITA KOJI , IZUMI HIROYUKI , ISHIKURA KUMIKO , OZE MASAHISA , SAKAI KAZUNAGA , TAKAHARA NAOKI
IPC分类号： C08J5/24 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a prepreg expressing low thermal expansion and high adhesiveness and a manufacturing method of the same, and a laminated plate, a metal foil-clad laminated plate, and a wiring board using the prepreg.SOLUTION: A thermosetting resin is obtained by reacting, in an organic solvent, (a) a siloxane resin having hydroxyl groups at its terminals represented by following general formula (I) and (b) a compound having at least two or more cyanate groups in one molecule, and contains 10-70 pts.mass of the siloxane resin (a) and 30-90 pts.mass of the compound (b) based on the sum total 100 pts.mass of the siloxane resin (a) and the compound (b). A prepreg is obtained by immersing in an organic fiber base material the thermosetting resin having a reaction rate of the compound (b) of 40-70 mol% and a thermosetting resin composition containing silica and a compound having at least two or more epoxy groups in one molecule.
摘要翻译：要解决的问题：提供一种表现出低热膨胀和高粘合性的预浸料及其制造方法，以及层压板，覆盖金属箔的叠层板和使用该预浸料的布线板。溶解性：热固性树脂是通过使有机溶剂中的（a）在其末端具有羟基的硅氧烷树脂在下述通式（I）表示的末端与（b）在一分子中具有至少两个以上的氰酸酯基的化合物反应而得到的，基于总共100个聚硅氧烷树脂（a）和化合物（b）的总和，硅氧烷树脂（a）的10-70重量份和化合物（b）的30-90重量份。通过将具有40-70摩尔％的化合物（b）的反应速率的热固性树脂和含有二氧化硅的热固性树脂组合物和具有至少两个或更多个环氧基的化合物浸渍在有机纤维基材中，一分子

3. 发明专利

JP2014012761A Prepreg using organic fiber base material and manufacturing method of the same, and laminated plate, metal foil-clad laminated plate, and wiring board using the prepreg 审中-公开
标题翻译： PREPREG使用有机纤维基材料及其制造方法，以及层压板，金属箔层压板和使用PREPREG的接线板
公开(公告)号：JP2014012761A
公开(公告)日：2014-01-23
申请号：JP2012150387
申请日：2012-07-04
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： NOMOTO SHUJI , IZUMI HIROYUKI , ISHIKURA KUMIKO , SAKAI KAZUNAGA , MORITA KOJI , TAKAHARA NAOKI
IPC分类号： C08J5/24 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a prepreg expressing low thermal expansion and high adhesiveness and a manufacturing method of the same, and a laminated plate, a metal foil-clad laminated plate, and a wiring board using the prepreg.SOLUTION: A prepreg is obtained by immersing, in an organic fiber base material, a thermosetting resin obtained by reacting, in an organic solvent, (a) a siloxane resin having hydroxyl groups at its terminals represented by following general formula (I) and (b) a compound having at least two or more cyanate groups in one molecule and a thermosetting resin composition containing a compound having at least two or more epoxy groups in one molecule.
摘要翻译：要解决的问题：提供一种表现出低热膨胀和高粘合性的预浸料及其制造方法，以及层压板，覆盖金属箔的层压板和使用该预浸料的布线板。解决方案：预浸料是通过将有机溶剂中的（a）具有羟基的硅氧烷树脂在其末端由下述通式（I）表示的末端与（b）所示的化合物反应得到的热固性树脂，一个分子中的至少两个以上的氰酸酯基和含有一个分子中具有至少两个以上环氧基的化合物的热固性树脂组合物。

4. 发明专利

JP2013080930A Resin composition, prepreg, laminate sheet, and wiring board 有权
标题翻译：树脂组合物，PREPREG，层压板和接线板
公开(公告)号：JP2013080930A
公开(公告)日：2013-05-02
申请号：JP2012233864
申请日：2012-10-23
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： MORITA KOJI , TAKANEZAWA SHIN , SAKAI KAZUNAGA , KONDO YUSUKE
IPC分类号： H05K1/03 , B32B27/00 , B32B27/12 , C08G59/22 , C08G59/40 , C08J5/24
CPC分类号： H05K1/0326 , C08G59/26 , C08J5/24 , H05K2201/068 , Y10T442/20
摘要： PROBLEM TO BE SOLVED: To provide a resin composition, prepreg, laminate sheet and wiring board, capable of achieving low thermal expansion at a low cost.SOLUTION: The resin composition, used for manufacture of a laminate sheet, includes insulating resin having an aromatic ring. The molecular mass between crosslinking points of insulating resin, obtained from a shear modulus equal to or higher than Tg of the insulating resin having the aromatic ring, is 300-1,000 in a stage after manufacture of laminate sheet.
摘要翻译：要解决的问题：提供能够以低成本实现低热膨胀的树脂组合物，预浸料，层压片和布线板。解决方案：用于制造层合片的树脂组合物包括具有芳环的绝缘树脂。绝缘树脂的交联点之间的分子质量，由具有芳环的绝缘树脂的Tg以上的剪切模量得到，在层压片的制造阶段之后的分子质量为300〜1000。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2014012762A Prepreg using organic fiber base material and manufacturing method of the same, and laminated plate, metal foil-clad laminated plate, and wiring board using the prepreg 审中-公开
标题翻译： PREPREG使用有机纤维基材料及其制造方法，以及层压板，金属箔层压板和使用PREPREG的接线板
公开(公告)号：JP2014012762A
公开(公告)日：2014-01-23
申请号：JP2012150388
申请日：2012-07-04
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： IKEDA YUKI , IZUMI HIROYUKI , ISHIKURA KUMIKO , SAKAI KAZUNAGA , MORITA KOJI , TAKAHARA NAOKI
IPC分类号： C08J5/24 , B32B5/28 , C08G73/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a prepreg expressing low thermal expansion and a manufacturing method of the same, and a laminated plate, a metal foil-clad laminated plate, and a wiring board using the prepreg.SOLUTION: A thermosetting resin is obtained by reacting, in an organic solvent, (a) a siloxane resin having hydroxyl groups at its terminals represented by following general formula (I) and (b) a compound having at least two or more cyanate groups in one molecule, and contains 10-70 pts.mass of the siloxane resin (a) and 30-90 pts.mass of the compound (b) based on the sum total 100 pts.mass of the siloxane resin (a) and the compound (b). A prepreg is obtained by immersing, in an organic fiber base material, the thermosetting resin having a reaction rate of the compound (b) of 40-70 mol% and a thermosetting resin composition containing silica. In general formula (I), each Ris independently an alkylene group having 1-5 carbon atoms or an alkyleneoxy group; each Aris independently a single bond, an arylene group, or an alkylene group having 1-5 carbon atoms; and m is an integer of 5-100.
摘要翻译：要解决的问题：提供一种表现出低热膨胀的预浸料及其制造方法，以及层压板，覆盖金属箔的叠层板和使用该预浸料的布线板。溶解性：热固性树脂通过在有机溶剂中，（a）在其末端具有羟基的硅氧烷树脂在下列通式（I）表示的末端和（b）在一分子中具有至少两个以上氰酸酯基的化合物，并含有10-70 硅氧烷树脂（a）的pts.mass和化合物（b）的30-90质量份，基于硅氧烷树脂（a）和化合物（b）的总共100质量份。通过在有机纤维基材中浸渍具有40-70摩尔％的化合物（b）的反应速率的热固性树脂和含有二氧化硅的热固性树脂组合物来获得预浸料。在通式（I）中，各R独立地为具有1-5个碳原子的亚烷基或亚烷基氧基; 每个Aris独立地是单键，亚芳基或具有1-5个碳原子的亚烷基; m为5〜100的整数。

6. 发明专利

JP2013080931A Resin composition, prepreg, laminate sheet, and wiring board 有权
标题翻译：树脂组合物，PREPREG，层压板和接线板
公开(公告)号：JP2013080931A
公开(公告)日：2013-05-02
申请号：JP2012233865
申请日：2012-10-23
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： MORITA KOJI , TAKANEZAWA SHIN , SAKAI KAZUNAGA , KONDO YUSUKE
IPC分类号： H05K1/03 , B32B27/00 , B32B27/12 , C08J5/24 , C08K3/00 , C08L101/12 , H05K3/46
CPC分类号： H05K1/0326 , C08G59/26 , C08J5/24 , H05K2201/068 , Y10T442/20
摘要： PROBLEM TO BE SOLVED: To provide a resin composition, prepreg, laminate sheet, and wiring board, capable of achieving low thermal expansion at a low cost.SOLUTION: The resin composition used for manufacture of a laminate sheet includes insulating resin having an aromatic ring. A molecular weight between crosslinking points of the insulating resin, obtained from a shear modulus equal to or higher than Tg of the insulating resin having the aromatic ring, is 300-1,000 in a stage after manufacture of the laminate sheet.
摘要翻译：要解决的问题：提供能够以低成本实现低热膨胀的树脂组合物，预浸料，层压片和布线板。解决方案：用于制造层压片的树脂组合物包括具有芳环的绝缘树脂。在层叠片材的制造阶段之后，由具有芳环的绝缘树脂的Tg以上的剪切模量得到的绝缘树脂的交联点之间的分子量为300〜1000。版权所有（C）2013，JPO＆INPIT

7. 发明专利

JP2014012759A Prepreg using organic fiber base material and manufacturing method of the same, and laminated plate, metal foil-clad laminated plate, and wiring board using the prepreg 审中-公开
标题翻译： PREPREG使用有机纤维基材料及其制造方法，以及层压板，金属箔层压板和使用PREPREG的接线板
公开(公告)号：JP2014012759A
公开(公告)日：2014-01-23
申请号：JP2012150385
申请日：2012-07-04
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： TAKAHARA NAOKI , OZE MASAHISA , SAKAI KAZUNAGA , MORITA KOJI , IZUMI HIROYUKI , ISHIKURA KUMIKO
IPC分类号： C08J5/24 , B32B5/28 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a prepreg expressing low thermal expansion and a manufacturing method of the same, and a laminated plate, a metal foil-clad laminated plate, and a wiring board using the prepreg.SOLUTION: A thermosetting resin is obtained by reacting, in an organic solvent, (a) a siloxane resin having hydroxyl groups at its terminals represented by following general formula (I) and (b) a compound having at least two or more cyanate groups in one molecule, and contains 10-70 pts.mass of the siloxane resin (a) and 30-90 pts.mass of the compound (b) based on the sum total 100 pts.mass of the siloxane resin (a) and the compound (b). A prepreg is obtained by immersing the thermosetting resin having a reaction rate of the compound (b) of 40-70 mol% in an organic fiber base material. In general formula (I), each Ris independently an alkylene group having 1-5 carbon atoms or an alkyleneoxy group; each Aris independently a single bond, an arylene group, or an alkylene group having 1-5 carbon atoms; and m is an integer of 5-100.
摘要翻译：要解决的问题：提供一种表现出低热膨胀的预浸料及其制造方法，以及层压板，覆盖金属箔的叠层板和使用该预浸料的布线板。溶解性：热固性树脂通过在有机溶剂中，（a）在其末端具有羟基的硅氧烷树脂在下列通式（I）表示的末端和（b）在一分子中具有至少两个以上氰酸酯基的化合物，并含有10-70 硅氧烷树脂（a）的pts.mass和化合物（b）的30-90质量份，基于硅氧烷树脂（a）和化合物（b）的总共100质量份。通过将具有40-70摩尔％的化合物（b）的反应速率的热固性树脂浸渍在有机纤维基材中来获得预浸料。在通式（I）中，各R独立地为具有1-5个碳原子的亚烷基或亚烷基氧基; 每个Aris独立地是单键，亚芳基或具有1-5个碳原子的亚烷基; m为5〜100的整数。

8. 发明专利

JP2013036041A Varnish, prepreg, film with resin, metal foil-clad laminate, and printed wiring board 有权
标题翻译： VARNISH，PREPREG，带树脂的薄膜，金属箔层压板和印刷线路板
公开(公告)号：JP2013036041A
公开(公告)日：2013-02-21
申请号：JP2012200926
申请日：2012-09-12
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： MORITA KOJI , MURAI AKIRA , TAKANEZAWA SHIN , INOUE YASUO , SAKAI KAZUNAGA
IPC分类号： C08G59/24 , B32B15/04 , C08G59/50 , H05K1/03
CPC分类号： C09D163/00 , B32B5/022 , B32B5/024 , B32B15/14 , B32B2255/02 , B32B2255/26 , B32B2260/021 , B32B2260/046 , B32B2262/0269 , B32B2262/101 , B32B2307/306 , B32B2307/3065 , B32B2307/308 , B32B2379/00 , B32B2457/08 , C08G59/245 , C08G59/5086 , C08J5/24 , C08J2363/00 , H01L23/49894 , H01L2224/48227 , H01L2924/15311 , H01L2924/3511 , H05K1/0346 , H05K1/0366 , H05K2201/0355 , H05K2201/068 , Y10T428/31678 , Y10T442/2861 , Y10T442/2951
摘要： PROBLEM TO BE SOLVED: To provide varnishes having high storage stability at normal temperature and excellent workability when in use, and a prepreg, a film with resin, a metal foil-clad laminate, and a printed wiring board obtained by using the same.SOLUTION: The varnish is obtained by reacting at least a portion of functional groups of a resin having the functional groups which react with an amino group and including a polycyclic structure, with an amino group of a compound having the amino group in a solvent. The varnish is obtained by reacting at least a portion of functional groups of a resin having the functional groups which react with a phenolic hydroxyl group and including a polycyclic structure, with a phenolic hydroxyl group of a compound having the phenolic hydroxyl group in a solvent. The prepreg, the film with resin, the metal foil-clad laminate, and the printed wiring board are obtained by using any of these varnishes.
摘要翻译：要解决的问题：提供在常温下具有高储存稳定性的清漆和使用时的优异的加工性，以及预浸料，具有树脂的膜，覆盖金属箔的层压板和通过使用相同。溶液：通过将具有与氨基反应的官能团的树脂的官能团的至少一部分与包含多环结构的氨基的氨基的氨基的至少一部分反应获得，溶剂。通过将具有与酚羟基反应的官能团的树脂的官能团的至少一部分与包含多环结构的酚羟基的酚羟基反应到溶剂中而获得。通过使用这些清漆来获得预浸料，具有树脂的膜，覆盖金属箔的层压板和印刷线路板。版权所有（C）2013，JPO＆INPIT

9. 发明专利

JP2002194102A LAMINATED PLATE FOR MAKING PRINTED WIRING BOARD AND METHOD FOR MAKING LAMINATED PLATE 失效
公开(公告)号：JP2002194102A
公开(公告)日：2002-07-10
申请号：JP2000390801
申请日：2000-12-22
申请人： HITACHI CHEMICAL CO LTD
发明人： NARABE YOSHIYUKI , SAKAI KAZUNAGA , SATO YOSHINORI
IPC分类号： C08J5/04 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a phenolic resin laminated plate used for both-side printed wiring board free from breakage of silver through holes. SOLUTION: A method for making a laminated plate comprising preparing a vanish containing, as main components, a solid portion of a resin and a solvent, and forming an insulating layer by using this varnish is characterized in that 80 to 100 parts by weight of the solvent based on the whole part of the solvent is a solvent having a boiling point of 100 deg.C or lower.

10. 发明专利

JP2000319344A PRODUCTION OF DRYING OIL-MODIFIED PHENOLIC RESIN AND PHENOLIC RESIN LAMINATE 失效
公开(公告)号：JP2000319344A
公开(公告)日：2000-11-21
申请号：JP13418299
申请日：1999-05-14
申请人： HITACHI CHEMICAL CO LTD
发明人： YANO MASABUMI , SAKAI KAZUNAGA
IPC分类号： H05K1/03 , B32B15/08 , C08G8/04 , C08G8/32
摘要： PROBLEM TO BE SOLVED: To provide a phenolic resin laminate excellent in punching processability. SOLUTION: This phenolic resin laminate is obtained by producing a drying oil-modified phenolic resin through performing the following processes in the following order and by impregnating a vanish comprising the tung oil-modified phenolic resin as an essential ingredient on a substrate material, followed by drying them to form a prepreg and by heating defined sheets of prepreg in a superposed and pressurized state: reacting phenols with a modified resin; cooling the temperature of a reaction liquid down to

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