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1. 发明专利

JP2014091782A Prepreg preservation method, laminate, and laminate packaging material 有权
标题翻译： PREPREG保存方法，层压板和层压包装材料
公开(公告)号：JP2014091782A
公开(公告)日：2014-05-19
申请号：JP2012243064
申请日：2012-11-02
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： MORITA KOJI , SAKAI KAZUNAGA , TAKAHARA NAOKI
IPC分类号： C08J5/24 , B32B5/28 , B65D81/24 , B65D81/26
摘要： PROBLEM TO BE SOLVED: To provide a prepreg preservation method, a laminate, and a laminate packaging material, capable of holding desmear resistance.SOLUTION: This invention provides [1] a prepreg preservation method for preserving a laminate of at least one sheet-like drying agent and at least one prepreg made by impregnating glass cloth with a resin composition, [2] the laminate, and [3] a laminate packaging material containing the laminate.
摘要翻译：要解决的问题：提供一种能够保持耐去霉性的预浸料保鲜方法，层压体和层压包装材料。本发明提供[1]一种预浸料保存方法，其用于保存至少一片片状的层压体干燥剂和至少一种通过用树脂组合物浸渍玻璃布制成的预浸料，[2]层压板，和[3]含有层压板的层压包装材料。

2. 发明专利

JP2014012760A Prepreg using organic fiber base material and manufacturing method of the same, and laminated plate, metal foil-clad laminated plate, and wiring board using the prepreg 审中-公开
标题翻译： PREPREG使用有机纤维基材料及其制造方法，以及层压板，金属箔层压板和使用PREPREG的接线板
公开(公告)号：JP2014012760A
公开(公告)日：2014-01-23
申请号：JP2012150386
申请日：2012-07-04
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： MORITA KOJI , IZUMI HIROYUKI , ISHIKURA KUMIKO , OZE MASAHISA , SAKAI KAZUNAGA , TAKAHARA NAOKI
IPC分类号： C08J5/24 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a prepreg expressing low thermal expansion and high adhesiveness and a manufacturing method of the same, and a laminated plate, a metal foil-clad laminated plate, and a wiring board using the prepreg.SOLUTION: A thermosetting resin is obtained by reacting, in an organic solvent, (a) a siloxane resin having hydroxyl groups at its terminals represented by following general formula (I) and (b) a compound having at least two or more cyanate groups in one molecule, and contains 10-70 pts.mass of the siloxane resin (a) and 30-90 pts.mass of the compound (b) based on the sum total 100 pts.mass of the siloxane resin (a) and the compound (b). A prepreg is obtained by immersing in an organic fiber base material the thermosetting resin having a reaction rate of the compound (b) of 40-70 mol% and a thermosetting resin composition containing silica and a compound having at least two or more epoxy groups in one molecule.
摘要翻译：要解决的问题：提供一种表现出低热膨胀和高粘合性的预浸料及其制造方法，以及层压板，覆盖金属箔的叠层板和使用该预浸料的布线板。溶解性：热固性树脂是通过使有机溶剂中的（a）在其末端具有羟基的硅氧烷树脂在下述通式（I）表示的末端与（b）在一分子中具有至少两个以上的氰酸酯基的化合物反应而得到的，基于总共100个聚硅氧烷树脂（a）和化合物（b）的总和，硅氧烷树脂（a）的10-70重量份和化合物（b）的30-90重量份。通过将具有40-70摩尔％的化合物（b）的反应速率的热固性树脂和含有二氧化硅的热固性树脂组合物和具有至少两个或更多个环氧基的化合物浸渍在有机纤维基材中，一分子

3. 发明专利

JP2002194102A LAMINATED PLATE FOR MAKING PRINTED WIRING BOARD AND METHOD FOR MAKING LAMINATED PLATE 失效
公开(公告)号：JP2002194102A
公开(公告)日：2002-07-10
申请号：JP2000390801
申请日：2000-12-22
申请人： HITACHI CHEMICAL CO LTD
发明人： NARABE YOSHIYUKI , SAKAI KAZUNAGA , SATO YOSHINORI
IPC分类号： C08J5/04 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a phenolic resin laminated plate used for both-side printed wiring board free from breakage of silver through holes. SOLUTION: A method for making a laminated plate comprising preparing a vanish containing, as main components, a solid portion of a resin and a solvent, and forming an insulating layer by using this varnish is characterized in that 80 to 100 parts by weight of the solvent based on the whole part of the solvent is a solvent having a boiling point of 100 deg.C or lower.

4. 发明专利

JP2000319344A PRODUCTION OF DRYING OIL-MODIFIED PHENOLIC RESIN AND PHENOLIC RESIN LAMINATE 失效
公开(公告)号：JP2000319344A
公开(公告)日：2000-11-21
申请号：JP13418299
申请日：1999-05-14
申请人： HITACHI CHEMICAL CO LTD
发明人： YANO MASABUMI , SAKAI KAZUNAGA
IPC分类号： H05K1/03 , B32B15/08 , C08G8/04 , C08G8/32
摘要： PROBLEM TO BE SOLVED: To provide a phenolic resin laminate excellent in punching processability. SOLUTION: This phenolic resin laminate is obtained by producing a drying oil-modified phenolic resin through performing the following processes in the following order and by impregnating a vanish comprising the tung oil-modified phenolic resin as an essential ingredient on a substrate material, followed by drying them to form a prepreg and by heating defined sheets of prepreg in a superposed and pressurized state: reacting phenols with a modified resin; cooling the temperature of a reaction liquid down to

5. 发明专利

JPH08230106A MANUFACTURE OF COPPER FOIL-CLAD LAMINATE 失效
公开(公告)号：JPH08230106A
公开(公告)日：1996-09-10
申请号：JP3952695
申请日：1995-02-28
申请人： HITACHI CHEMICAL CO LTD
发明人： ISHIHARA HIDEKI , SAKAI KAZUNAGA , AKINAKA NOBORU
IPC分类号： B32B15/08 , H05K1/03
摘要： PURPOSE: To obtain highly reliable through-hole connection by superposing and heating and pressing a copper foil on a laminate, a paper base material impregnated with a resin, semi-hardened by heating and covered by a prepreg whose volatile matter is set at a specific value. CONSTITUTION: After impregnating a paper base material with a thermosetting resin varnish and adjusting the amount of varnish adhered thereto, the resin is semi-hardened by heating. At this time, the prepreg is made to retain the volatile content of 0.2 to 2.0wt.%. If the volatile content of the prepreg is below 0.5wt.%, the moldability of the laminate drops, and if the volatile content is higher 2.0wt.%, air gaps cannot be prevented from occurring when it is baked with a silver or copper paste. To keep the volatile content of the prepreg at 0.5 to 2.0wt.%, drying temperature is raised after impregnation of the resin varnish. Prepregs thus obtained are superposed in a number appropriate to the thickness of a laminate to be manufactured, a copper foil is laid on the outside of the prepregs and heated and pressed to obtain a copper-clad laminate.

6. 发明专利

JPH07309922A PHENOL RESIN COMPOSITION FOR LAMINATE AND PHENOL RESIN LAMINATE PRODUCED USING THE SAME 失效
公开(公告)号：JPH07309922A
公开(公告)日：1995-11-28
申请号：JP10035794
申请日：1994-05-16
申请人： HITACHI CHEMICAL CO LTD
发明人： SAKAI KAZUNAGA , IKEDA KENICHI , YANO MASABUMI
IPC分类号： C08J5/24 , B32B27/42 , C08G8/00 , C08G8/10 , C08G8/32
摘要： PURPOSE:To obtain a phenol resin laminate excellent in resistances to moisture phenol with m, p-cresol in a specified molar ratio and reacting the mixture with formaldehyde in the presence of an alkali catalyst. CONSTITUTION:A phenol resin obtd. by reacting a mixture comprising phenol and in a molar ratio of (9:1)-(5:5) with formaldehyde in the presence of an alkali catalyst is used as the matrix resin of a laminate. The resin is a mixture of backbones comprising phenol units only, backbones comprising phenol units and cresol units, and backbones comprising cresol units only. Pref. the resin is made flexible by modifying with a drying oil. Examples of the drying oil used are tung oil, dehydrated castor oil, linseed oil, and oiticica oil. The resulting phenol resin compsn. for laminate is made into a varnish, impregnated into a paper substrate, and dried to give a prepreg, and several pieces of the prepreg are stacked and heated under pressure to give a laminate.

7. 发明专利

JPH07309921A PRODUCTION OF PHENOL RESIN 失效
公开(公告)号：JPH07309921A
公开(公告)日：1995-11-28
申请号：JP10035694
申请日：1994-05-16
申请人： HITACHI CHEMICAL CO LTD
发明人： SAKAI KAZUNAGA , IKEDA KENICHI
IPC分类号： C08G8/08 , C08G8/00 , C08G8/28
摘要： PURPOSE:To reduce the content of unreacted low-molecular weight component, eliminate the odor emitted by a laminate, and obtain a phneol resin improved in moisture resistance. CONSTITUTION:After a phenol is reacted with formaldehyde using a tert. amine as the catalyst, urea is added to the reaction mixture and then the reaction is further continued. The total amt. of the catalysts based on 1 mol of the phenol is 0.10-0.70 mol; pref. the amt. of the tert. amine is 0.05-0.20mol and that of urea is 0.05-0.50mol. The molar ratio of the amine to urea is pref. (4:1)-(1:10).

8. 发明专利

JP2014012761A Prepreg using organic fiber base material and manufacturing method of the same, and laminated plate, metal foil-clad laminated plate, and wiring board using the prepreg 审中-公开
标题翻译： PREPREG使用有机纤维基材料及其制造方法，以及层压板，金属箔层压板和使用PREPREG的接线板
公开(公告)号：JP2014012761A
公开(公告)日：2014-01-23
申请号：JP2012150387
申请日：2012-07-04
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： NOMOTO SHUJI , IZUMI HIROYUKI , ISHIKURA KUMIKO , SAKAI KAZUNAGA , MORITA KOJI , TAKAHARA NAOKI
IPC分类号： C08J5/24 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a prepreg expressing low thermal expansion and high adhesiveness and a manufacturing method of the same, and a laminated plate, a metal foil-clad laminated plate, and a wiring board using the prepreg.SOLUTION: A prepreg is obtained by immersing, in an organic fiber base material, a thermosetting resin obtained by reacting, in an organic solvent, (a) a siloxane resin having hydroxyl groups at its terminals represented by following general formula (I) and (b) a compound having at least two or more cyanate groups in one molecule and a thermosetting resin composition containing a compound having at least two or more epoxy groups in one molecule.
摘要翻译：要解决的问题：提供一种表现出低热膨胀和高粘合性的预浸料及其制造方法，以及层压板，覆盖金属箔的层压板和使用该预浸料的布线板。解决方案：预浸料是通过将有机溶剂中的（a）具有羟基的硅氧烷树脂在其末端由下述通式（I）表示的末端与（b）所示的化合物反应得到的热固性树脂，一个分子中的至少两个以上的氰酸酯基和含有一个分子中具有至少两个以上环氧基的化合物的热固性树脂组合物。

9. 发明专利

JP2013080930A Resin composition, prepreg, laminate sheet, and wiring board 有权
标题翻译：树脂组合物，PREPREG，层压板和接线板
公开(公告)号：JP2013080930A
公开(公告)日：2013-05-02
申请号：JP2012233864
申请日：2012-10-23
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： MORITA KOJI , TAKANEZAWA SHIN , SAKAI KAZUNAGA , KONDO YUSUKE
IPC分类号： H05K1/03 , B32B27/00 , B32B27/12 , C08G59/22 , C08G59/40 , C08J5/24
CPC分类号： H05K1/0326 , C08G59/26 , C08J5/24 , H05K2201/068 , Y10T442/20
摘要： PROBLEM TO BE SOLVED: To provide a resin composition, prepreg, laminate sheet and wiring board, capable of achieving low thermal expansion at a low cost.SOLUTION: The resin composition, used for manufacture of a laminate sheet, includes insulating resin having an aromatic ring. The molecular mass between crosslinking points of insulating resin, obtained from a shear modulus equal to or higher than Tg of the insulating resin having the aromatic ring, is 300-1,000 in a stage after manufacture of laminate sheet.

10. 发明专利

JP2002347173A MANUFACTURING METHOD FOR COPPER-CLAD LAMINATED SHEET OF PAPER-BASED PHENOLIC RESIN 失效
公开(公告)号：JP2002347173A
公开(公告)日：2002-12-04
申请号：JP2001157661
申请日：2001-05-25
申请人： HITACHI CHEMICAL CO LTD
发明人： NARABE YOSHIYUKI , SAKAI KAZUNAGA , SATO YOSHINORI
IPC分类号： C08J5/24 , B29C43/18 , B29C43/20 , B29L31/34 , B32B15/08 , B32B15/20 , B32B27/42 , B32B37/10 , H05K1/03 , B32B31/20
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method for a copper-clad laminated sheet of both-sided paper-based phenolic resin which is low in warp. SOLUTION: In the manufacturing method for the copper-clad laminated sheet of the paper-based phenolic resin wherein a paper-based material is impregnated with phenolic resin varnish and dried to produce prepreg, then both sides of a plurality of prepreg sheets so obtained are superposed by copper foil and formed under heat and pressure, the paper-based material to be used is such one where the ratio of a vertical elastic modulus to a lateral elastic modulus is 1.3 to 1.9, and a square root of a product of the vertical elastic modulus and the lateral elastic modulus is 3.2 to 3.8 kN/mm .

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