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1. 发明专利

JP2013010861A Resin composition for laminate, prepreg, and laminate 有权
标题翻译：用于层压板，PREPREG和层压板的树脂组合物
公开(公告)号：JP2013010861A
公开(公告)日：2013-01-17
申请号：JP2011144357
申请日：2011-06-29
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： TAKAHASHI YOSHIHIRO , KAMIGATA YASUO , AOSHIMA MASAHIRO , MURAI AKIRA
IPC分类号： C08L101/00 , B32B5/28 , C08J5/24 , C08K3/24 , C08K3/36 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a resin composition for laminate, which is excellent especially in drilling workability, low thermal expansion, heat resistance, and electric insulation, and is suitably used for semiconductor packages and the like; and to provide a prepreg, and the laminate.SOLUTION: The resin composition for laminate comprises a thermosetting resin, a silica, and aqueous zinc molybdate (ZnMoO(OH)) in which the atomic ratio of zinc to molybdenum is 3:2. The silica accounts for 40 to 60 vol.% of the whole resin composition, whereas the aqueous zinc molybdate (ZnMoO(OH)) accounts for 0.5 to 10 vol.% of the whole resin composition.
摘要翻译：要解决的问题：提供一种特别是在钻孔加工性，低热膨胀性，耐热性和电绝缘性方面优异的层叠体用树脂组合物，适用于半导体封装等; 并提供预浸料和层压材料。解决方案：层压体用树脂组合物包含热固性树脂，二氧化硅和钼酸锌水溶液（Zn 3 Mo 2 其中锌与钼的原子比为3:2的O 8 （OH） 2 ）。二氧化硅占整个树脂组合物的40至60体积％，而钼酸锌水溶液（Zn 3 Mo 2 占整个树脂组合物的0.5〜10体积％的O 8 （OH） 2 ）。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2013010860A Resin composition for printed wiring board, prepreg, laminate, and printed wiring board 有权
标题翻译：印刷线路板，PREPREG，层压板和印刷线路板的树脂组合物
公开(公告)号：JP2013010860A
公开(公告)日：2013-01-17
申请号：JP2011144350
申请日：2011-06-29
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： KAMIGATA YASUO , TAKAHASHI YOSHIHIRO , AOSHIMA MASAHIRO
IPC分类号： C08L101/00 , B32B15/08 , C08J5/24 , C08K3/22 , C08K3/24 , C08K3/36 , H05K1/03 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a resin composition for a printed wiring board capable of producing a laminate having a low coefficient of thermal expansion and excellent drilling processability, and to provide a prepreg, a laminate and a printed wiring board using the resin composition.SOLUTION: This resin composition for the printed wiring board includes: a resin component; hydrous zinc molybdate (ZnMoO(OH)), wherein the atomic ratio of zinc to molybdenum is 2:1; and a metal oxide. The prepreg, the laminate and the printed wiring board obtained using the resin composition are also provided.
摘要翻译：解决的问题：提供一种能够制造具有低热膨胀系数和优异的钻孔加工性的层压体的印刷线路板用树脂组合物，并且提供一种预浸料，层压板和印刷线路板，其使用树脂组合物。该解决方案：该印刷线路板用树脂组合物包括：树脂组分; 水合钼酸锌（Zn 2 MoO 4 （OH） 2 ），其中锌与钼的原子比为2:1; 和金属氧化物。还提供了使用树脂组合物获得的预浸料，层压体和印刷线路板。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2013010666A Zinc molybdate fine particle-containing slurry composition 有权
标题翻译： ZINC MOLYBDATE细粒含糖浆组合物
公开(公告)号：JP2013010666A
公开(公告)日：2013-01-17
申请号：JP2011144347
申请日：2011-06-29
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： KAMIGATA YASUO , TAKAHASHI YOSHIHIRO , AOSHIMA MASAHIRO
IPC分类号： C01G39/00 , C08J3/21 , C08K9/04 , C08L101/00 , C09K21/02
摘要： PROBLEM TO BE SOLVED: To provide a zinc molybdate fine particle-containing slurry composition capable of suppressing precipitation or aggregation of a zinc molybdate compound which is generated in a short time, even when being added directly to a resin composition varnish used for fabrication of an electronic apparatus.SOLUTION: The zinc molybdate particle-containing slurry composition is formed by dispersing surface-treated ZnMoO(OH)particles into an organic solvent, and the average particle diameter of ZnMoO(OH)particles is preferably ≤2 μm.
摘要翻译：要解决的问题：为了提供能够抑制在短时间内产生的钼酸锌化合物的析出或聚集的含钼酸锌微粒的浆料组合物，即使直接添加到用于制造电子设备。解决方案：含钼酸锌颗粒的浆料组合物通过将表面处理的Zn（SBB）= 4 /（SB）） 2 颗粒到有机溶剂中，并且平均粒径Zn 2 MoO 4 （OH） 2 颗粒优选≤2μm。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2012240312A Prepreg, laminated board using the same and printed wiring board 审中-公开
标题翻译： PREPREG，使用它的层压板和印刷线路板
公开(公告)号：JP2012240312A
公开(公告)日：2012-12-10
申请号：JP2011112810
申请日：2011-05-19
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： AOSHIMA MASAHIRO , KAMIGATA YASUO , TAKAHASHI YOSHIHIRO
IPC分类号： B29B11/16 , B32B15/08 , B32B15/092
摘要： PROBLEM TO BE SOLVED: To provide a prepreg maintaining excellent workability and insulation performance and having excellent thermal conductivity, a laminated board using the prepreg and a printed wiring board.SOLUTION: The prepreg is configured by impregnating or coating a glass fiber base material obtained by processing a (C) silane compound having a phenylamino group with a resin composition including (A) thermosetting resin and (B) aluminum oxide. The laminated board is laminated and formed by using the prepreg, and the printed wiring board is formed by wiring the laminated board.
摘要翻译：要解决的问题：提供一种保持优异的加工性和绝缘性能并且具有优异导热性的预浸料，使用预浸料的层压板和印刷线路板。解决方案：通过用（A）热固性树脂和（B）氧化铝的树脂组合物浸渍或涂布通过加工（C）具有苯基氨基的硅烷化合物获得的玻璃纤维基材，来配置预浸料。通过使用预浸料层压并形成层压板，并且通过布线层压板形成印刷线路板。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2013010665A Heat-resistant aluminum hydroxide particle, method for producing the same, resin composition, prepreg, and laminated plate 有权
标题翻译：耐热铝氢氧化物颗粒，其生产方法，树脂组合物，PREPREG和层压板
公开(公告)号：JP2013010665A
公开(公告)日：2013-01-17
申请号：JP2011144342
申请日：2011-06-29
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： KAMIGATA YASUO , TAKAHASHI YOSHIHIRO , MIYATAKE MASATO
IPC分类号： C01F7/44 , B32B15/08 , C08J5/24 , C08K3/22 , C08L101/00
摘要： PROBLEM TO BE SOLVED: To provide heat-resistant aluminum hydroxide particles having both a high dehydration starting temperature and a sufficient dehydration amount which are difficult to achieve by the conventional aluminum hydroxide, a method for producing the heat-resistant aluminum hydroxide particles, and a resin composition, a prepreg and a laminated plate containing the heat-resistant aluminum hydroxide particles.SOLUTION: The heat-resistant aluminum hydroxide particles are obtained by heat-treating aluminum hydroxide particles at 200-270°C in a fluorine-containing gas atmosphere to substitute part of the hydroxy groups of the aluminum hydroxide particles into fluorine. Alternatively, the heat-resistant aluminum hydroxide particles are obtained by treating aluminum hydroxide particles with a fluorine ion-containing solution to substitute part of the hydroxy groups of the aluminum hydroxide particles into fluorine, and then heat-treating the resulting particles at 200-270°C. There are also provided the method for producing the heat-resistant aluminum hydroxide particles, and the resin composition containing the heat-resistant aluminum hydroxide particles, the prepreg and the laminated plate.
摘要翻译：要解决的问题：为了提供具有高脱水开始温度和足够脱水量的耐热氢氧化铝颗粒，其难以通过常规氢氧化铝实现，制备耐热氢氧化铝颗粒的方法，以及含有耐热氢氧化铝粒子的树脂组合物，预浸料坯和层压板。解决方案：耐热氢氧化铝颗粒通过在含氟气体气氛中在200-270℃下热处理氢氧化铝颗粒而将氢氧化铝颗粒的一部分羟基替代为氟而获得。或者，耐热氢氧化铝颗粒通过用含氟离子的溶液处理氢氧化铝颗粒以将氢氧化铝颗粒的一部分羟基取代为氟而获得，然后在200-270℃下热处理所得颗粒 C。还提供了生产耐热氢氧化铝颗粒的方法和含有耐热氢氧化铝颗粒，预浸料和层压板的树脂组合物。版权所有（C）2013，JPO＆INPIT

6. 发明专利

JP2009235401A Resin composition for prepreg, prepreg, laminate, and printed-wiring board 有权
标题翻译： PREPREG，PREPREG，层压板和印刷线路板的树脂组合物
公开(公告)号：JP2009235401A
公开(公告)日：2009-10-15
申请号：JP2009051022
申请日：2009-03-04
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MIYATAKE MASATO , KAMIGATA YASUO , TAKAHASHI YOSHIHIRO , FUJIMOTO DAISUKE , AKASHI TAKEAKI , ARATA MICHITOSHI
IPC分类号： C08J5/24 , B32B15/08 , C08K9/00 , C08L63/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a resin composition for a prepreg having an excellent processability in producing a printed-wiring board, capable of imparting a good high modulus and a low coefficient of thermal expansion on the produced printed-wiring board, and to provide a prepreg, a laminate and a printed-wiring board using the resin composition for the prepreg. SOLUTION: Provided is the resin composition for the prepreg comprising inorganic fillers compounded to a resin component, wherein at least one kind of the inorganic fillers consists of porous silica particles whole or part of which are covered with an inorganic compound or an organic compound. Provided is the prepreg consists of a substrate and a resin composition which is impregnated in the substrate and dried, wherein the resin composition is the resin composition for the prepreg. Provided is the laminate which comprises the prepreg as the material for the laminate and obtained by molding under heating and pressure. Provided is the printed-wiring board which comprises the laminate and a circuit formed on at least a part of the laminate. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决问题：为了提供一种能够在制造的印刷电路板上赋予良好的高模量和低的热膨胀系数的在制造印刷电路板方面具有优异加工性能的预浸料树脂组合物，并提供使用该预浸料坯用树脂组合物的预浸料坯，层压板和印刷布线板。解决方案：提供了包含与树脂组分混合的无机填料的预浸料坯的树脂组合物，其中至少一种无机填料由全部或部分被无机化合物或有机物覆盖的多孔二氧化硅颗粒组成复合。提供的是，预浸料由基材和浸渍在基材中而干燥的树脂组合物组成，其中树脂组合物是预浸料的树脂组合物。提供了包含预浸料作为层压材料并通过在加热和加压下成型获得的层压材料。提供了包括层压体的印刷电路板和形成在层压体的至少一部分上的电路。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2011084430A Highly heat resistant aluminum hydroxide particle, preparation method therefor, resin composition containing the same and printed circuit board using the resin composition 有权
标题翻译：高耐热铝氢氧化物颗粒，其制备方法，含有其的树脂组合物和使用树脂组合物的印刷电路板
公开(公告)号：JP2011084430A
公开(公告)日：2011-04-28
申请号：JP2009238287
申请日：2009-10-15
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KAMIGATA YASUO , TAKAHASHI YOSHIHIRO , MIYATAKE MASATO , UCHIMURA RYOICHI
IPC分类号： C01F7/02 , B32B15/08 , B32B27/18 , C01F7/44 , C08K3/22 , C08L101/00
摘要： PROBLEM TO BE SOLVED: To provide a preparation method for a highly heat resistant aluminum hydroxide particle having heat resistance and flame retardancy suitable to be used for a substrate for a printed circuit board and the like which has characteristics adaptable to lead free soldering. SOLUTION: In the highly heat resistance aluminum hydroxide particle, at least gibbsite type aluminum and boehmite type aluminum hydroxide are present in one aluminum hydroxide particle. The specific surface area by the BET method is 2.0-50.0 m 2 /g, while the amount of dehydration is 31.5-34.0 mass% and the temperature of starting heat decomposition is higher than 260°C. The method is for the preparation of the particle. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有耐热性和阻燃性的耐热氢氧化铝颗粒的制备方法，其适用于具有适合于无铅焊接的特性的印刷电路板等的基板。解决方案：在高耐热氢氧化铝颗粒中，在一种氢氧化铝颗粒中存在至少三水铝矿型铝和勃姆石型氢氧化铝。通过BET法的比表面积为2.0〜50.0m 2 / SP / g，脱水量为31.5〜34.0质量％，起始热分解温度高于260℃。该方法用于制备颗粒。版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2008133353A Thermosetting resin composition, and prepreg and laminate using the resin composition 审中-公开
标题翻译：热固性树脂组合物和使用树脂组合物的预浸和层压
公开(公告)号：JP2008133353A
公开(公告)日：2008-06-12
申请号：JP2006320022
申请日：2006-11-28
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKAHASHI YOSHIHIRO , TSUCHIKAWA SHINJI
IPC分类号： C08G59/40 , B32B27/34 , B32B27/38 , C08J5/24 , C08K3/38 , C08K5/3412 , C08K5/3492 , C08L37/00 , C08L63/00
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition having excellent dielectric characteristics, flame retardancy, adhesiveness and heat resistance, and suitable for a printed circuit board, and to provide a prepreg and a laminate using the resin composition.
SOLUTION: The thermosetting resin composition contains (1) a curing agent having an acidic substituent and an unsaturated maleimide group, (2) a 6-substituted guanamine resin represented by general formula (II), (3) a copolymer resin containing a maleic anhydride monomer unit, (4) an epoxy resin having at least two epoxy groups in one molecule, and (5) boron nitride. The prepreg and the laminate are obtained by using the resin composition.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决问题：提供具有优异的介电特性，阻燃性，粘合性和耐热性并且适用于印刷电路板的热固性树脂组合物，并提供使用该树脂组合物的预浸料和层压材料。热固性树脂组合物含有（1）具有酸性取代基的固化剂和不饱和马来酰亚胺基团，（2）由通式（II）表示的6-取代胍胺树脂，（3）含有马来酸酐单体单元，（4）在一个分子中具有至少两个环氧基的环氧树脂和（5）氮化硼。通过使用树脂组合物获得预浸料和层压体。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2003321533A Epoxy resin molding material for sealing and electronic part apparatus 审中-公开
标题翻译：环氧树脂模塑材料用于密封和电子部件装置
公开(公告)号：JP2003321533A
公开(公告)日：2003-11-14
申请号：JP2002113667
申请日：2002-04-16
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： IKEZAWA RYOICHI , AKIMOTO TAKAYUKI , TAKAHASHI YOSHIHIRO , KATAYOSE MITSUO
IPC分类号： C08G59/62 , H01L23/29 , H01L23/31
CPC分类号： H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin material for sealing not containing a halogen and antimony, having good flame retardance without lowering reliability of moldability, reflow resistance, moisture resistance and high-temperature leaving characteristics, etc., and an electronic part apparatus equipped with an element sealed thereby. SOLUTION: The epoxy resin molding material comprises (A) an epoxy resin, (B) a curing agent and (C) a complex metal hydroxide as essential components and has ≥80 mm circular plate flow. The electronic part apparatus is equipped with the element sealed by the epoxy resin molding material for sealing. COPYRIGHT: (C)2004,JPO

10. 发明专利

JP2003321532A Epoxy resin molding material for sealing and electronic part apparatus 有权
标题翻译：环氧树脂模塑材料用于密封和电子部件装置
公开(公告)号：JP2003321532A
公开(公告)日：2003-11-14
申请号：JP2002113651
申请日：2002-04-16
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： IKEZAWA RYOICHI , AKIMOTO TAKAYUKI , TAKAHASHI YOSHIHIRO , KATAYOSE MITSUO
IPC分类号： C08G59/62 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin material for sealing not containing a halogen and antimony, having good flame retardance without lowering reliability of moldability, reflow resistance, moisture resistance and high-temperature leaving characteristics, etc., and an electronic part apparatus equipped with an element sealed thereby.
SOLUTION: The epoxy resin molding material for sealing comprises (A) an epoxy resin, (B) a curing agent and (C) a complex metal hydroxide as essential components and has ≤200 kPa shearing mold release force within 10 shots. The electronic part apparatus is equipped with the element sealed by the epoxy resin molding material for sealing.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种不含卤素和锑的密封用环氧树脂材料，具有良好的阻燃性，而不降低成型性，耐回流性，耐湿性和高温离去特性等的可靠性，以及配备有由其密封的元件的电子部件装置。解决方案：用于密封的环氧树脂成型材料包括（A）环氧树脂，（B）固化剂和（C）作为必需组分的复合金属氢氧化物，并且在10次射击内具有≤200kPa的剪切脱模力。电子部件装置配备有用于密封的环氧树脂成型材料密封的元件。版权所有（C）2004，JPO

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