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1. 发明专利

JP2003321533A Epoxy resin molding material for sealing and electronic part apparatus 审中-公开
标题翻译：环氧树脂模塑材料用于密封和电子部件装置
公开(公告)号：JP2003321533A
公开(公告)日：2003-11-14
申请号：JP2002113667
申请日：2002-04-16
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： IKEZAWA RYOICHI , AKIMOTO TAKAYUKI , TAKAHASHI YOSHIHIRO , KATAYOSE MITSUO
IPC分类号： C08G59/62 , H01L23/29 , H01L23/31
CPC分类号： H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin material for sealing not containing a halogen and antimony, having good flame retardance without lowering reliability of moldability, reflow resistance, moisture resistance and high-temperature leaving characteristics, etc., and an electronic part apparatus equipped with an element sealed thereby. SOLUTION: The epoxy resin molding material comprises (A) an epoxy resin, (B) a curing agent and (C) a complex metal hydroxide as essential components and has ≥80 mm circular plate flow. The electronic part apparatus is equipped with the element sealed by the epoxy resin molding material for sealing. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种不含卤素和锑的密封性的环氧树脂材料，具有良好的阻燃性，而不降低成型性，耐回流性，耐湿性和高温离去特性等的可靠性，以及配备有由其密封的元件的电子部件装置。环氧树脂成型材料包括（A）环氧树脂，（B）固化剂和（C）作为必需成分的复合金属氢氧化物，并具有≥80mm的圆板流动。电子部件装置配备有用于密封的环氧树脂成型材料密封的元件。版权所有（C）2004，JPO

2. 发明专利

JP2003321532A Epoxy resin molding material for sealing and electronic part apparatus 有权
标题翻译：环氧树脂模塑材料用于密封和电子部件装置
公开(公告)号：JP2003321532A
公开(公告)日：2003-11-14
申请号：JP2002113651
申请日：2002-04-16
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： IKEZAWA RYOICHI , AKIMOTO TAKAYUKI , TAKAHASHI YOSHIHIRO , KATAYOSE MITSUO
IPC分类号： C08G59/62 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin material for sealing not containing a halogen and antimony, having good flame retardance without lowering reliability of moldability, reflow resistance, moisture resistance and high-temperature leaving characteristics, etc., and an electronic part apparatus equipped with an element sealed thereby.
SOLUTION: The epoxy resin molding material for sealing comprises (A) an epoxy resin, (B) a curing agent and (C) a complex metal hydroxide as essential components and has ≤200 kPa shearing mold release force within 10 shots. The electronic part apparatus is equipped with the element sealed by the epoxy resin molding material for sealing.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种不含卤素和锑的密封用环氧树脂材料，具有良好的阻燃性，而不降低成型性，耐回流性，耐湿性和高温离去特性等的可靠性，以及配备有由其密封的元件的电子部件装置。解决方案：用于密封的环氧树脂成型材料包括（A）环氧树脂，（B）固化剂和（C）作为必需组分的复合金属氢氧化物，并且在10次射击内具有≤200kPa的剪切脱模力。电子部件装置配备有用于密封的环氧树脂成型材料密封的元件。版权所有（C）2004，JPO

3. 发明专利

JP2006104416A Epoxy resin molding material for sealing and electronic part device 审中-公开
标题翻译：环氧树脂模塑材料用于密封和电子部件装置
公开(公告)号：JP2006104416A
公开(公告)日：2006-04-20
申请号：JP2004296583
申请日：2004-10-08
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： WATANABE HISANORI , AKIMOTO TAKAYUKI , TAMATE HIRONORI
IPC分类号： C08L63/00 , C08L23/00 , C08L101/02 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing, having excellent continuous moldability including package appearance; and to provide an electronic part device having an element sealed with the epoxy resin molding material for sealing.
SOLUTION: The epoxy resin molding material for sealing contains (A) an epoxy resin, (B) a curing agent, (C) an oxidation-type polyolefin, and (D) a substance including a compound having structures selected from two or more kinds of an α-olefin, a maleic anhydride derivative, a polyalkylene oxide derivative and a styrene derivative. The electronic part device is sealed with the molding material.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于密封的环氧树脂成型材料，具有优异的连续成形性，包括包装外观; 并且提供具有用环氧树脂模制材料密封的元件用于密封的电子部件装置。解决方案：用于密封的环氧树脂模制材料包含（A）环氧树脂，（B）固化剂，（C）氧化型聚烯烃，和（D）包含具有选自以下结构的化合物的物质或更多种α-烯烃，马来酸酐衍生物，聚环氧烷衍生物和苯乙烯衍生物。电子部件装置用模制材料密封。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2005272811A Epoxy resin molding material for encapsulation and electronic component apparatus 审中-公开
标题翻译：环氧树脂模塑材料用于封装和电子元件装置
公开(公告)号：JP2005272811A
公开(公告)日：2005-10-06
申请号：JP2004358544
申请日：2004-12-10
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： WATANABE HISANORI , TAMATE HIRONORI , AKIMOTO TAKAYUKI
IPC分类号： C08L63/00 , C08L23/02 , C08L23/30 , C08L35/00 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for encapsulation which gives a good metal die mold-release characteristic and a good package appearance to a package especially of a thin electronic component, and to provide an electronic component having a device encapsulated with the same. SOLUTION: This epoxy resin molding material for encapsulation contains, as its essential components, (A) an epoxy resin, (B) a hardener and (C) a mixture obtained by mixing preparatorily an epoxy resin (C1) whose ICI viscosity at 150°C is not more than 0.2 Pa s, an oxidation polyolefin (C2) and (C3) at least one copolymer of an α-olefin and at least one of maleic anhydride and a maleic anhydride derivative. Not less than 80 vol% of the oxidation polyolefin (C2) of the component (C) is not more than 50 μm in particle size. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于封装的环氧树脂模制材料，其特别是薄电子部件的封装具有良好的金属模具脱模特性和良好的封装外观，并且提供具有器件封装相同。解决方案：用于封装的环氧树脂成型材料包含（A）环氧树脂，（B）硬化剂和（C）通过将制备的环氧树脂（C1）与ICI粘度在150℃下不超过0.2Pa·s，氧化聚烯烃（C2）和（C3）至少一种α-烯烃与马来酸酐和马来酸酐衍生物中的至少一种的共聚物。（C）成分的氧化聚烯烃（C2）的80体积％以上的粒径为50μm以下。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2005255790A Epoxy resin molding material for sealing and electronic part apparatus 审中-公开
标题翻译：环氧树脂模塑材料用于密封和电子部件装置
公开(公告)号：JP2005255790A
公开(公告)日：2005-09-22
申请号：JP2004067551
申请日：2004-03-10
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： WATANABE HISANORI , TENDOU KAZUYOSHI , AKIMOTO TAKAYUKI
IPC分类号： C08L63/00 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing which has good thermal shock resistance and package warpage properties of a one-side sealed package and is excellent in moldability such as flowability and package external appearances and in reliability such as reflow resistance, and an electronic part apparatus equipped with an element sealed with the same.
SOLUTION: The epoxy resin molding material for sealing comprises as essential ingredients (A) an epoxy resin, (B) a curing agent and (C) a compound having both a polyalkylene oxide derivative structure and a styrene derivative structure in one molecule. The electronic part apparatus is sealed with the same.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种密封性好的环氧树脂成型材料，其具有良好的耐热冲击性和单面密封包装的包装翘曲性，并且具有优异的成型性，例如流动性和包装外观以及可靠性作为回流电阻，以及配备有用其密封的元件的电子部件装置。解决方案：用于密封的环氧树脂成型材料包括作为必要成分（A）环氧树脂，（B）固化剂和（C）在一个分子中具有聚环氧烷衍生物结构和苯乙烯衍生物结构的化合物。电子部件装置用其密封。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2004115583A Epoxy resin molding material for sealing and electronic part device 审中-公开
标题翻译：环氧树脂模塑材料用于密封和电子部件装置
公开(公告)号：JP2004115583A
公开(公告)日：2004-04-15
申请号：JP2002277475
申请日：2002-09-24
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： AKIMOTO TAKAYUKI , IKEZAWA RYOICHI , KATAYOSE MITSUO
IPC分类号： C08G59/32 , C08G59/62 , H01L23/29 , H01L23/31
CPC分类号： H01L2924/3511
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin molding material which is used for sealing, does not contain a halogen and antimony, does not deteriorate the reliability of moldability, reflow resistance, moisture resistance, high temperature left characteristics, and the like, scarcely warps, and has good flame retardancy, and to provide an electronic part device having an element sealed with the epoxy resin molding material. SOLUTION: This epoxy resin molding material used for sealing is characterized by containing (A) a triazine ring-having epoxy resin, (B) a curing agent, and (C) an organic compound having at least one of phosphorus-oxygen bond and phosphorus-sulfur bond, as essential components. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了提供用于密封，不含卤素和锑的环氧树脂成型材料，不会劣化成型性，耐回流性，耐湿性，高温左特性的可靠性，以及具有良好的阻燃性，并且提供具有用环氧树脂成型材料密封的元件的电子部件装置。用于密封的环氧树脂成型材料的特征在于含有（A）具有三嗪环的环氧树脂，（B）固化剂，和（C）具有至少一种磷 - 氧的有机化合物键和磷 - 硫键作为必需组分。版权所有（C）2004，JPO

7. 发明专利

JP2003327667A Epoxy resin molding material for sealing and semiconductor device 审中-公开
标题翻译：用于密封和半导体器件的环氧树脂模塑材料
公开(公告)号：JP2003327667A
公开(公告)日：2003-11-19
申请号：JP2002113690
申请日：2002-04-16
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： IKEZAWA RYOICHI , AKIMOTO TAKAYUKI , TAKAHASHI YOSHIHIRO , KATAYOSE MITSUO
IPC分类号： C08G59/62 , H01L23/29 , H01L23/31
CPC分类号： H01L24/97 , H01L2224/05554 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49175 , H01L2224/73265 , H01L2924/1301 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To obtain an epoxy resin molding material which has flame retardance in spite of the nonhalogen type and, simultaneously, of the nonantimony type, excels in flowability and reliability, and is used in sealing a thin semiconductor device having many pins, a long wire, and a narrow pad pitch or a chip arranged on a mounting substrate, and a semiconductor device using the same. SOLUTION: The epoxy resin molding material for sealing comprises (A) an epoxy resin, (B) a curing agent, and furthermore (C) a composite metal hydroxide, and is used in the semiconductor device having at least one constitution of (a) to (f) such that (a) at least one of sealing media on the upper surface of a semiconductor chip and the underside of the semiconductor chip has a thickness of ≤0.7 mm; (b) the number of lead pins is ≥80 pins; (c) the wire length is ≥2 mm; (d) the pad pitch on the semiconductor chip is ≥90 μm; and (e) the semiconductor chip is arranged on the mounting substrate, and the package thickness is ≤2 mm; and (f) the area of the semiconductor chip is ≥25 mm 2 . COPYRIGHT: (C)2004,JPO
摘要翻译：解决的问题：为了获得具有阻燃性的环氧树脂成型材料，尽管是非卤素型的，并且同时具有优异的流动性和可靠性，并且用于密封具有许多引脚，长导线，以及布置在安装基板上的窄焊盘间距或芯片，以及使用该引脚的半导体器件。解决方案：用于密封的环氧树脂模制材料包括（A）环氧树脂，（B）固化剂，以及（C）复合金属氢氧化物，并且用于具有至少一种（a）至（f），使得（a）半导体芯片的上表面上的密封介质和半导体芯片的下侧中的至少一个具有≤0.7mm的厚度; （b）引脚数≥80引脚; （c）电线长度≥2mm; （d）半导体芯片上的焊盘间距≥90μm; （e）半导体芯片布置在安装基板上，封装厚度≤2mm; 和（f）半导体芯片的面积为≥25mm 2 。版权所有（C）2004，JPO

8. 发明专利

JP2008115382A Epoxy resin composition for sealing, and electronic parts device 有权
标题翻译：用于密封的环氧树脂组合物和电子部件装置
公开(公告)号：JP2008115382A
公开(公告)日：2008-05-22
申请号：JP2007265710
申请日：2007-10-11
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： ENDO YOSHINORI , AKAGI SEIICHI , IKEZAWA RYOICHI , SAITO HIROYUKI , AKIMOTO TAKAYUKI , OSHITA TAKESHI
IPC分类号： C08G59/62 , C08G59/24 , H01L23/29 , H01L23/31
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an epoxy composition for sealing that can reduce a warpage deformation amount even when it is used for a batch molding-type one-side sealing package, can reduce an amount of warpage change after reflow process, and can reduce an amount of change during the course of the reflow process. SOLUTION: The epoxy composition for sealing comprises (A) an epoxy resin, (B) a curing agent having a phenolic hydroxy group, and (C) a silicone compound having an epoxy group, wherein, an equivalent ratio (hydroxy group/epoxy group) of the epoxy group of the epoxy resin (A) and the phenolic hydroxy group of the curing agent (B) is 1.05-1.2, and an epoxy equivalent of the silicone compound (C) is 600-1,400. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供即使在用于分批成型型单面密封包装时也可以减少翘曲变形量的用于密封的环氧组合物，可以减少回流处理之后的翘曲变化量，并且可以减少在回流过程中的变化量。解决方案：用于密封的环氧组合物包括（A）环氧树脂，（B）具有酚羟基的固化剂和（C）具有环氧基的硅氧烷化合物，其中当量比（羟基环氧树脂（A）的环氧基和固化剂（B）的酚性羟基的环氧基的摩尔数/环氧基为1.05〜1.2，硅氧烷化合物（C）的环氧当量为600〜1.400。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2005232266A Epoxy resin molding material for sealing and electronic part device 审中-公开
标题翻译：环氧树脂模塑材料用于密封和电子部件装置
公开(公告)号：JP2005232266A
公开(公告)日：2005-09-02
申请号：JP2004041365
申请日：2004-02-18
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： WATANABE HISANORI , AKIMOTO TAKAYUKI , TAMATE HIRONORI , JINBO AKIRA , MIZUKAMI YOSHIHIRO , HAYASHI TOSHIHIRO
IPC分类号： C08L63/00 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing which imparts good package appearances particularly to a thin package, and an electronic part device equipped with an element sealed with the same. SOLUTION: The epoxy resin molding material for sealing comprises, as essential ingredients, (A) an epoxy resin, (B) a curing agent, (C) at least one of an oxidized polymer or an oxidized copolymer of at least one of ethylene and propylene having a weight-average molecular weight of at least 1,000 but less than 4,000, and (D) a compound obtained by esterifying a copolymer of a 5-30C α-olefin and maleic anhydride with a 5-25C monohydric alcohol. The electronic part device is equipped with the element sealed with the epoxy resin molding material for sealing. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于密封的环氧树脂模制材料，其特别是薄的封装具有良好的封装外观，以及配有密封该元件的元件的电子部件装置。解决方案：用于密封的环氧树脂模制材料包括（A）环氧树脂，（B）固化剂，（C）至少一种氧化聚合物或至少一种氧化聚合物的氧化共聚物作为必要成分的重均分子量为1,000〜4,000的乙烯和丙烯，（D）将5-30℃的α-烯烃与马来酸酐的共聚物与5〜25℃的一元醇酯化而成的化合物。电子部件装置装有用环氧树脂成型材料密封的元件。版权所有（C）2005，JPO＆NCIPI

10. 发明专利

JP2011246522A Compression-molding epoxy resin composition and electronic part device 审中-公开
标题翻译：压缩成型环氧树脂组合物和电子部件装置
公开(公告)号：JP2011246522A
公开(公告)日：2011-12-08
申请号：JP2010118327
申请日：2010-05-24
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： YAMAZAKI MASAO , KOSAKA MASAHIKO , AKIMOTO TAKAYUKI
IPC分类号： C08L63/00 , B29C43/18 , B29L31/34 , C08G59/18 , C08K3/00 , C08L61/22 , H01L23/29 , H01L23/31
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a compression-molding epoxy resin composition which can suppress a black spot failure generated at an epoxy-resin sealed molding of a semiconductor device, and an electric part device.SOLUTION: In the epoxy resin composition containing (A) the epoxy resin, (B) a hardener and (C) an inorganic filler, (C) the inorganic filler contains (C1) an inorganic filler of not larger than 3 μm in average particle diameter, and the loss on heating when (C1) the inorganic filler of not larger than 3 μm in average particle diameter is heated for one hour at 200°C is not smaller than 0.07 mass% and not larger than 0.2 mass%.
摘要翻译：解决的问题：提供一种能够抑制在半导体装置的环氧树脂密封成型时产生的黑点破坏的压缩成型环氧树脂组合物和电气部件装置。解决方案：在包含（A）环氧树脂，（B）固化剂和（C）无机填料）的环氧树脂组合物中，（C）无机填料含有（C1）不大于3μm的无机填料在平均粒径为3μm以下的无机填料（C1）在200℃下加热1小时时，加热失重为0.07质量％以上0.2质量％以下，。版权所有（C）2012，JPO＆INPIT

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