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1. 发明专利

JP2008111188A Copper foil for printed circuit board 审中-公开
标题翻译：印刷电路板用铜箔
公开(公告)号：JP2008111188A
公开(公告)日：2008-05-15
申请号：JP2007247627
申请日：2007-09-25
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKANO MARE , FUKUDA TOMIO , ARATA MICHITOSHI , TOMIOKA KENICHI
IPC分类号： C23C22/00 , H01B5/02 , H05K1/09 , H05K3/38
CPC分类号： C23C2222/20
摘要： PROBLEM TO BE SOLVED: To provide copper oil exhibiting excellent adhesion with a resin upon a fine circuit fabrication stage, multilayer forming or the like.
SOLUTION: The copper foil is obtained by treating the surface having an Rz of 3.7 μm in copper foil with a beforehand three-dimensionally crosslinked silicone oligomer. The copper foil is preferably treated with a silane coupling agent as well.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供在精细电路制造阶段，多层形成等方面与树脂具有优异粘附性的铜油。解决方案：铜箔通过用预先三维交联的硅氧烷低聚物处理铜箔中的Rz为3.7μm的表面而获得。铜箔也优选用硅烷偶联剂处理。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2007023272A Liquid epoxy resin composition for sealing and electronic part device and wafer level chip size package 有权
标题翻译：用于密封和电子部件装置的液体环氧树脂组合物和水平芯片尺寸包装
公开(公告)号：JP2007023272A
公开(公告)日：2007-02-01
申请号：JP2006166444
申请日：2006-06-15
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KUWANO ATSUSHI , MATSUI MEGUMI , ARATA MICHITOSHI
IPC分类号： C08G59/20 , C08K3/00 , C08L63/00 , C08L83/04 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide a liquid epoxy resin composition wherein printability is excellent, a number of voids is small, a camber is small, and strength, anti-reflowing, anti-temperature cycle and reliability of anti-moisture are excellent, and also to provide an electronic part device and a wafer level chip size package, which are provided with elements sealed by the composition.
SOLUTION: The liquid epoxy resin composition for sealing comprises (A) a liquid bisphenol type epoxy resin, (B) silicone rubber fine particles, (C) a silicone-modified epoxy resin, (D) an aromatic amine curing agent, (E) a coupling agent, (F) an inorganic filler and (G) an organic solvent, wherein the (B) silicone rubber fine particles are produced by a hydrosilyl reaction between an organo hydrogen polysiloxane containing a SiH group and an organo polysiloxane containing an alkenyl group in the liquid epoxy resin.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种液体环氧树脂组合物，其中可印刷性优异，多个空隙小，外观小，抗潮湿的强度，抗回流，抗温循环和可靠性是并且还提供一种电子部件装置和晶片级芯片尺寸封装，其具有由该组合物密封的元件。解决方案：用于密封的液体环氧树脂组合物包括（A）液体双酚型环氧树脂，（B）硅橡胶细颗粒，（C）硅氧烷改性环氧树脂，（D）芳族胺固化剂，（E）偶联剂，（F）无机填料和（G）有机溶剂，其中（B）硅橡胶细颗粒通过含SiH基的有机氢聚硅氧烷和含有有机聚硅氧烷的含氢聚硅氧烷液态环氧树脂中的烯基。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JPH11279375A Resin composition for printed wiring board and printed wiring board using the same 失效
标题翻译：印刷线路板和印刷线路板的树脂组合物
公开(公告)号：JPH11279375A
公开(公告)日：1999-10-12
申请号：JP8114498
申请日：1998-03-27
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TOMIOKA KENICHI , TAKANO MARE , FUKUDA TOMIO , ARATA MICHITOSHI , MIYATAKE MASATO
IPC分类号： H05K1/03 , C08G59/40 , C08L63/00 , C08L79/00
摘要： PROBLEM TO BE SOLVED: To provide a resin composition for printed wiring board which shows a high glass transition temperature and an excellent dielectric property, restrains generation of a metal migration and has high reliability of electric insulation without sacrificing heat resistance, adhesion, fire resistance or the like, and a printed wiring board using the same.
SOLUTION: A resin composition for printed wiring board contains (A) 100 pts.wt. of a cyanate compound having not less than 2 isocyanate groups in a molecule, (B) 50-250 pts.wt. of an epoxy compound, (C) 0.1-5 pts.wt. of a hardening accelerator and (D) 0.1-20 pts.wt. of an antioxidant. The printed wiring board is obtained by impregnating the resin composition as a varnish in a substrate, drying thereof to obtain a pre-preg, laminating metal foil on one side or both sides of at least one pre-preg and forming thereof under heat and pressure.
COPYRIGHT: (C)1999,JPO
摘要翻译：要解决的问题：为了提供显示高玻璃化转变温度和优异的介电性能的印刷线路板用树脂组合物，抑制金属迁移的产生，并且在不牺牲耐热性，粘附性，耐火性或耐热性的情况下具有高的电绝缘可靠性以及使用其的印刷布线板。解决方案：印刷电路板用树脂组合物含有（A）100重量份的分子中具有不少于2个异氰酸酯基团的氰酸酯化合物，（B）50-250重量份的环氧化合物，（C）0.1-5重量份的硬化促进剂和（D）0.1-20重量份的抗氧化剂。印刷线路板是通过将树脂组合物作为清漆浸渍在基材中而进行干燥而获得的，以在热和压力的至少一种预浸渍和成型的一侧或两面上进行预浸，层叠金属箔。

4. 发明专利

JPH11279372A Epoxy resin composition for printed circuit board, and printed circuit board prepared therefrom 失效
标题翻译：印刷电路板环氧树脂组合物及其制备的印刷电路板
公开(公告)号：JPH11279372A
公开(公告)日：1999-10-12
申请号：JP8114598
申请日：1998-03-27
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： ARATA MICHITOSHI , TAKANO MARE , FUKUDA TOMIO , TOMIOKA KENICHI
IPC分类号： H05K1/03 , C08L61/12 , C08L63/00
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin compsn. which has a low moisture absorption and excellent resistances to heat and thermal discoloration and is excellent in adhesion to a copper foil and to provide a printed circuit board prepd. therefrom.
SOLUTION: This compsn. contains, as essential ingredients, (a) an epoxy resin, (b) a bisphenol A-formaldehyde condensate, (c) a cure accelerator, and (d) a triazine-ring-contg. or isocyanurate-ring-contg. compd. or a compd. having a nitrogen content of 60 wt.% or lower (excluding urea deriv.) The compsn. is made into a varnish, impregnated into a substrate, and dried to give a prepreg. A metal foil is laminated to at least one side of at least one prepreg obtd. as above, and the laminate is thermally press formed to give a printed circuit board.
COPYRIGHT: (C)1999,JPO
摘要翻译：要解决的问题：提供环氧树脂。其具有低的吸湿性和优异的耐热和热变色性，并且对铜箔的粘合性优异，并且提供了印刷电路板。由此。解决方案：这个compsn。作为必要成分含有（a）环氧树脂，（b）双酚A-甲醛缩合物，（c）固化促进剂，和（d）三嗪环。或异氰脲酸酯环。卤素化合物。或一个compd 氮含量为60重量％以下（不含尿素衍生物）。制成清漆，浸渍在基材中，干燥，得到预浸料。将金属箔层压到至少一个预浸料坯的至少一侧。如上所述，并且层压体被热压成型以得到印刷电路板。

5. 发明专利

JP2006147202A Insulator ink, printed circuit board and multilayer printed circuit board 有权
标题翻译：绝缘油墨，印刷电路板和多层印刷电路板
公开(公告)号：JP2006147202A
公开(公告)日：2006-06-08
申请号：JP2004332348
申请日：2004-11-16
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KAMISHIRO YASUSHI , ARATA MICHITOSHI , MARUYAMA NAOKI , YAMAMOTO KAZUNORI
IPC分类号： H01B3/30 , C09D11/00 , C09D11/38 , H01B3/40 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide insulator ink capable of forming an insulation layer having an excellent pattern shape even when the insulation layer is formed by a printing method such as an ink-jet printing method or an offset printing method, and to provide a multilayer printed circuit board having the insulation layer formed by use thereof.
SOLUTION: This insulator ink contains: an insulation composition; a solvent of a vapor pressure 3 Pa at 25°C; and a solvent of a vapor pressure ≥1.34×10
3 Pa at 25°C.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：即使当通过诸如喷墨打印方法或胶版印刷方法的印刷方法形成绝缘层时，提供能够形成具有优异图案形状的绝缘层的绝缘体墨，并且提供具有通过其使用形成的绝缘层的多层印刷电路板。
解决方案：该绝缘油墨包含：绝缘组合物; 在25℃下蒸气压<1.34×10 3的溶剂; 和在25℃下蒸气压≥1.34×10 3 Pa的溶剂。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2005347571A Printed wiring board, substrate therefor and method for manufacturing the same 有权
标题翻译：印刷电路板，其基板及其制造方法
公开(公告)号：JP2005347571A
公开(公告)日：2005-12-15
申请号：JP2004166245
申请日：2004-06-03
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： ARATA MICHITOSHI , YAMAMOTO KAZUNORI
IPC分类号： H05K3/38 , H05K3/12
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board in which disconnection of conductor wiring formed from a conductive ink or release from a substrate is sufficiently reduced even when using a printing method such as ink jet printing or offset printing, a method of manufacturing the same, and a substrate to be used for such a printed wiring board. SOLUTION: A method of manufacturing a printed wiring board with conductor wiring formed on a substrate includes a substrate preparation step of preparing a substrate containing a resin composition, in which adhesiveness appears for conductor wiring after the lapse of a predetermined temperature history; a conductive film pattern formation step of forming a conductive film pattern by applying a conductive ink onto a surface of the substrate; and a conductor wiring formation step of imparting adhesiveness to the substrate and transferring the conductive film pattern into conductor wiring, by heating and cooling the substrate and the conductive film pattern based on the predetermined temperature history. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种印刷线路板，其中即使使用诸如喷墨印刷或胶版印刷的印刷方法，其中由导电油墨形成的导体布线的断开或从基板的释放也被充分降低，以及用于这种印刷线路板的基板。＆lt; P＆gt;解决方案：一种制造在基板上形成有导体布线的印刷线路板的方法包括：制备含有树脂组合物的基板的基板准备步骤，其中在经过预定温度历史之后，导体布线出现粘附性; 导电膜图案形成步骤，通过将导电油墨施加到所述基板的表面上来形成导电膜图案; 以及导体布线形成步骤，通过基于预定的温度历史加热和冷却基板和导电膜图案，赋予基板粘合性并将导电膜图案转印到导体布线中。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2005248147A Thermosetting resin composition, and prepreg, metal-laminated lamination plate and printed wire board using the same 审中-公开
标题翻译：热固性树脂组合物和PREPREG，金属层压板和使用其的印刷线路板
公开(公告)号：JP2005248147A
公开(公告)日：2005-09-15
申请号：JP2004207060
申请日：2004-07-14
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TOMIOKA KENICHI , SHIMIZU HIROSHI , MURAI YASUHIRO , OHASHI KENICHI , AITSU SHUJI , ARATA MICHITOSHI , TSUCHIKAWA SHINJI
IPC分类号： C08J5/24 , B32B15/08 , C08G59/48 , C08G73/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a printed wire board material which is excellent in dielectric characteristics, heat resistance, moisture resistance, electric corrosion resistance, adhesiveness, mechanical properties, and chemical resistance, and exhibits an excellent flame retardancy without using a halogen flame retardant.
SOLUTION: The subject thermosetting resin composition contains (A) a copolymerization resin exemplified by the formula having a specified repeating unit, (B) a cyanate compound having two or more cyanato groups in the molecule, and (C) at least one kind of phosphoric flame retardant selected from the group consisting of phosphazene compounds and disubstituted phosphinic acid metal salts.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供介电特性，耐热性，耐湿性，电腐蚀性，粘合性，机械性能和耐化学性优异的印刷线路板材料，并且显示出优异的阻燃性，而不使用卤素阻燃剂。本发明的热固性树脂组合物含有（A）具有规定重复单元的式所示的共聚树脂，（B）分子中具有两个以上氰基的氰酸酯化合物，（C）至少一个一种选自磷腈化合物和二取代次膦酸金属盐的磷酸阻燃剂。版权所有（C）2005，JPO＆NCIPI

8. 发明专利

JP2004307761A Thermosetting resin composition, and prepreg, metal-clad laminate and printed wiring board all using the same 审中-公开
公开(公告)号：JP2004307761A
公开(公告)日：2004-11-04
申请号：JP2003106854
申请日：2003-04-10
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TOMIOKA KENICHI , TSUCHIKAWA SHINJI , ARATA MICHITOSHI , SUEYOSHI TAKAYUKI
IPC分类号： C08J5/24 , C08F212/06 , C08F222/06 , C08G59/32 , C08G59/42 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To obtain a thermosetting resin composition that improves the heat resistance thereof without deterioration of dielectric characteristics, and to provide prepregs, laminates and printed wiring boards by using the same.
SOLUTION: The thermosetting resin composition comprises a copolymerized resin (component A) containing a monomer unit (a) and another monomer unit (b) and a thermosetting resin (component B) wherein the component B contains a biphenylaralkyl type epoxy rein (component B1).
COPYRIGHT: (C)2005,JPO&NCIPI

9. 发明专利

JP2011006683A Thermosetting resin composition and prepreg, metal-clad laminate, printed wiring board using the same 审中-公开
标题翻译：热固性树脂组合物和PREPREG，金属层压板，印刷线路板
公开(公告)号：JP2011006683A
公开(公告)日：2011-01-13
申请号：JP2010142846
申请日：2010-06-23
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TOMIOKA KENICHI , SHIMIZU HIROSHI , MURAI YASUHIRO , OHASHI KENICHI , AITSU SHUJI , ARATA MICHITOSHI , TSUCHIKAWA SHINJI
IPC分类号： C08L35/06 , B32B15/08 , B32B15/088 , C08G59/42 , C08G73/06 , C08J5/24 , C08K5/315 , C08K5/5399 , C08L63/04 , H05K1/03
CPC分类号： C08L63/00 , C08G59/4261 , C08L35/06
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board material and a printed wiring board excellent in dielectric characteristics, heat resistance, moisture resistance, electrolytic corrosion resistance, adhesiveness, mechanical characteristics, and chemical resistance, and further exhibiting excellent flame retardancy without using a halogen-based flame retardant.SOLUTION: The thermosetting resin composition includes: (A) a copolymer resin including a repeating unit (a) represented by general formula (I) and a maleic anhydride unit (b) which may have a specific substituent; (B) a cyanate compound having two or more cyanato groups in one molecule; and (C) at least one phosphorus-based flame retardant selected from the group consisting of a phosphazene compound and a metal salt of a di-substituted phosphinic acid, wherein Ris a hydrogen atom, a halogen atom, or a 1-5C hydrocarbon group; Ris (when x is 2 or more, each independently) a halogen atom, a 1-5C aliphatic hydrocarbon group, an aromatic hydrocarbon group, or a hydroxyl group; and x is an integer of 0-3.
摘要翻译：要解决的问题：提供介电特性，耐热性，耐湿性，电解腐蚀性，粘合性，机械特性和耐化学性优异的印刷线路板材料和印刷线路板，并且进一步显示出优异的阻燃性，而不使用卤素系阻燃剂。热固性树脂组合物包括：（A）包含通式（I）表示的重复单元（a）和可具有特定取代基的马来酸酐单元（b）的共聚物树脂; （B）在一个分子中具有两个或更多个氰基的氰酸酯化合物; 和（C）至少一种选自磷腈化合物和二取代次膦酸的金属盐的磷系阻燃剂，其中R为氢原子，卤素原子或1-5C烃基 ; Ris（X为2以上时，分别独立地表示）卤素原子，1-5C脂肪族烃基，芳香族烃基或羟基; x为0-3的整数。

10. 发明专利

JP2009197242A Thermosetting resin composition, prepreg using it, and laminate 有权
标题翻译：热固树脂组合物，使用它和层压制品
公开(公告)号：JP2009197242A
公开(公告)日：2009-09-03
申请号：JP2009111298
申请日：2009-04-30
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUCHIKAWA SHINJI , ARATA MICHITOSHI , TOMIOKA KENICHI , KOBAYASHI KAZUHITO
IPC分类号： C08L25/02 , C08J5/24 , C08K5/3477 , C08K5/5313 , C08L33/14 , C08L35/06 , C08L63/00 , C08L71/12 , C08L79/00 , H05K1/03
CPC分类号： H05K1/0373 , C08J5/24 , C08K5/5313 , H05K2203/121 , Y10S428/901 , Y10T428/31511 , Y10T428/31522 , Y10T428/31855 , C08L25/18
摘要： PROBLEM TO BE SOLVED: To provide a composition and a prepreg and the like superior in every phase like dielectric properties in spite of use of a non-halogen flame retardant. SOLUTION: The thermosetting resin composition contains (1) a metal salt of a disubstituted phosphinic acid and (2) a specific copolymer such as a resin having a dielectric constant of 2.9 or less at 1 GHz frequency or above. The prepreg and a laminate using the above thermosetting resin composition are also provided. COPYRIGHT: (C)2009,JPO&INPIT

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