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1. 发明专利

JPS58222532A Semiconductor device and manufacture thereof 失效
标题翻译：半导体器件及其制造
公开(公告)号：JPS58222532A
公开(公告)日：1983-12-24
申请号：JP10375882
申请日：1982-06-18
申请人： Hitachi Chem Co Ltd , Hitachi Ltd , Hitachi Tobu Semiconductor Ltd
发明人： ABE TOORU , TAKAGI TAKESHI , IIDA SATOSHI , KAWAI SHIGETAKA , HARADA YUKIYOSHI , SAIKI ATSUSHI , OOSHIMA TOYOJI , ISHIMARU TOSHIAKI
IPC分类号： H01L23/52 , H01L21/60
CPC分类号： H01L24/97 , H01L24/82 , H01L2224/24 , H01L2224/24227 , H01L2224/97 , H01L2924/01078 , H01L2924/014 , H01L2924/15311 , H01L2224/82 , H01L2924/00012
摘要： PURPOSE:To obtain the semiconductor device, which can easily execute a large number of mountings simultaneously and manufacturing cost thereof is low, by forming an electrode (an external terminal) through a semiconductor pellet on the surface of a base body and the partially removed section of an insulator layer coated on an insulator. CONSTITUTION:The insulator 2 and the semiconductor pellet 5 are formed onto the base body 1, and the insulator layer 7 is formed. Evaporating wiring 9 is evaporated, the solder electrodes 10 (10E is one for an emitter, 10B one for a base and 10C one for a collector) are formed through solder dipping, solder plating or solder evaporation, and the semiconductor device 11 is completed. All of a large number of the semiconductor devices 11 can be connected simultaneously to external leads 12E, 12B, 12C through solder dissolution by an oven flow of the solder electrodes 10E, 10B, 10C previously extracted on the semiconductor device 11.
摘要翻译：目的：通过在基体的表面上形成通过半导体颗粒的电极（外部端子），能够容易地同时执行大量安装并且制造成本低的半导体器件，并且部分去除部分涂覆在绝缘体上的绝缘体层。构成：将绝缘体2和半导体芯片5形成在基体1上，形成绝缘体层7。蒸发布线9被蒸发，焊料电极10（10E是发射极的一个，用于基底的10B，用于集电体的10E），通过焊料浸渍，焊料电镀或焊料蒸发形成，并且半导体器件11完成。通过预先在半导体器件11上提取的焊料电极10E，10B，10C的烘箱流，可以将大量的半导体器件11同时连接到外部引线12E，12B，12C。

2. 发明专利

JPS5761014A Photopolymer composition and photosensitive element 失效
标题翻译：光聚合物组合物和光敏元素
公开(公告)号：JPS5761014A
公开(公告)日：1982-04-13
申请号：JP13793080
申请日：1980-10-01
申请人： Hitachi Chem Co Ltd
发明人： ISHIMARU TOSHIAKI , TSUKADA KATSUSHIGE , HAYASHI NOBUYUKI , KOIBUCHI SHIGERU , ISOBE ASAO
IPC分类号： G03F7/004 , C08F2/00 , C08F2/50 , C08F290/00 , C08F299/00 , C08F299/06 , G03F7/035 , H05K3/28
摘要： PURPOSE: To improve the heat resistance and thermal shock resistance of titled composition obtained by mixing a specified urethane di(meth)acrylate, a linear highmolecular compound and a photosensitizer (system).
CONSTITUTION: The photopolymer composition comprises 20W75pts.wt. urethane di(meth)acrylate compound obtained by reacting isophorone disocyanate, a dihydric alcohol and mono(meth)acrylate of a dihydric alcohol, 20W75pts.wt. linear vinyl copolymer glass transition point about 40W150°C, and a sensitizer or sensitizer system capable of generating free radicals by actinic ray. This composition has utility in printed circuit boards, metal precision machining, etc., and can form protective films having excellent properties.
COPYRIGHT: (C)1982,JPO&Japio
摘要翻译：目的：提高通过混合指定的氨基甲酸酯二（甲基）丙烯酸酯，线性高分子化合物和光敏剂（体系）获得的标题组合物的耐热性和耐热冲击性。构成：光聚合物组合物包含20-75pts.wt。二异羟肟酸二异氰酸酯，二元醇和二羟基一（甲基）丙烯酸酯反应得到的氨基甲酸酯二（甲基）丙烯酸酯化合物，为20-75pts.wt。线性乙烯基共聚物玻璃化转变点约40-150℃，以及能够通过光化射线产生自由基的敏化剂或敏化剂体系。该组合物可用于印刷电路板，金属精密加工等，并可形成具有优异性能的保护膜。

3. 发明专利

JPS5755914A Photopolymer composition and photosensitive element 失效
标题翻译：光聚合物组合物和光敏元素
公开(公告)号：JPS5755914A
公开(公告)日：1982-04-03
申请号：JP13132280
申请日：1980-09-19
申请人： Hitachi Chem Co Ltd
发明人： ISHIMARU TOSHIAKI , TSUKADA KATSUSHIGE , HAYASHI NOBUYUKI , KOIBUCHI SHIGERU , ISOBE ASAO
IPC分类号： C08F2/00 , C08F2/48 , C08F2/50 , C08F290/00 , C08F299/00 , C08F299/02 , C08G18/00 , C08G18/67 , G03F7/004
摘要： PURPOSE: A photopolymer composition excellent in heat resistance and resistance to cold and heat shock and usable to form solder masks, comprising a urethane di- (meth)acrylate compound, a linear high-molecular compound and a photosensitizer capable of generating free radicals by actinic light.
CONSTITUTION: A photopolymer composition comprising 20W75pts.wt. urethane di(meth)acrylate compound obtained by reacting trimethylhexamethylene diisocyanate, a dihydric alcohol, e.g., 1,4-butanediol and a mono(meth)acrylate of a dihydric alcohol, e.g., hydroxyethyl(meth)acrylate, 20W75pts.wt. linear high-molecular compound, glass transition point about 40W150°C, and a sensitizer which generates free radicals by actinic light, e.g., 2-ethyl-anthraquinone and/or a sensitizer system e.g., a combination of 2,4,5-triarylimidazole dimer and 2-mercaptobenzoquinazole.
COPYRIGHT: (C)1982,JPO&Japio
摘要翻译：目的：耐热性和耐热冲击性优异且可用于形成焊料掩模的光聚合物组合物，其包含氨基甲酸酯二（甲基）丙烯酸酯化合物，线性高分子化合物和能够通过光化产生自由基的光敏剂光。构成：包含20-75pts.wt。通过三甲基六亚甲基二异氰酸酯，二元醇例如1,4-丁二醇和二元醇的单（甲基）丙烯酸酯如（甲基）丙烯酸羟乙酯，20-75pts.wt。线性高分子化合物，玻璃化转变点约40-150℃，以及通过光化光产生自由基的敏化剂，例如2-乙基 - 蒽醌和/或敏化剂体系，例如2,4， 5-三芳基咪唑二聚体和2-巯基苯并喹唑。

4. 发明专利

JPS59192244A Photosensitive resin composition and photosensitive element 失效
标题翻译：感光树脂组合物和感光元素
公开(公告)号：JPS59192244A
公开(公告)日：1984-10-31
申请号：JP6751483
申请日：1983-04-15
申请人： Hitachi Chem Co Ltd
发明人： ISHIMARU TOSHIAKI , TSUKADA KATSUSHIGE , HAYASHI NOBUYUKI , SUGASAWA NOBORU
IPC分类号： G03C1/00 , G03F7/004 , H01L21/027
CPC分类号： G03F7/004
摘要： PURPOSE:To improve the transparency and resolution by adding a specified amount of halogen atoms to a system consisting of Sb2O3, a photopolymerizable compound having two or more terminal ethylene groups, a thermoplastic org. polymer and a sensitizer. CONSTITUTION:This photosensitive resin composition consists of 0.1-15pts.wt. Sb2O3 (a) of
摘要翻译：目的：通过向由Sb 2 O 3，具有两个或更多个末端亚乙基的光聚合化合物，热塑性组合物组成的体系中加入指定量的卤素原子来提高透明度和分辨率。聚合物和敏化剂。构成：该感光性树脂组合物为0.1〜15pts.wt。平均粒径≤0.1μm的Sb2O3（a），20-80pts.wt。具有两个或多个末端亚乙基的光聚合化合物（b），20-80pts.wt。热塑性组织聚合物（c），0.5-10pts.wt。可光聚合敏化剂（d）和卤素原子（e）通过共价键与组分（b）和/或组分（c）键合。卤素原子的量为组分（a），（b），（c），（d）的总量的3-30重量％。将组合物形成为支撑膜上的层以制造感光膜。由于该组合物含有作为阻燃剂的Sb 2 O 3，其作为<0.1重量％的超细颗粒形式的阻燃剂，优选<0.05μm的平均粒径以及卤素化合物，因此提供不燃性，并且可以提高透明度和分辨率。

5. 发明专利

JPS59149917A Flame-retarding photopolymer composition 失效
标题翻译：阻燃光聚合物组合物
公开(公告)号：JPS59149917A
公开(公告)日：1984-08-28
申请号：JP2442483
申请日：1983-02-16
申请人： Hitachi Chem Co Ltd
发明人： TSUKADA KATSUSHIGE , ISHIMARU TOSHIAKI , SUGASAWA NOBORU , HAYASHI NOBUYUKI
IPC分类号： C08F299/00 , C08F290/00 , C08G18/00 , C08G18/67 , H05K3/28
CPC分类号： H05K3/287
摘要： PURPOSE: A flame-retarding photopolymer composition excellent in soldering-heat resistance and thermal shock resistance, containing a phosphorus-containing urethane di(meth)acrylate, a linear polymer compound, a sensitizer or sensitizer system, and a halogen atom-containing component.
CONSTITUTION: A resin composition containing (A) 20W75pts.wt. phosphorus-containing urethane di(meth)acrylate compound obtained by reacting (i) a diisocyanate compound selected from the group consisting of trimethylhexamethylene diisocyanate, isophorone diisocyanate, and lysine diisocyanate, with (ii) a phosphorus-containing dihydric alcohol of the formula and (iii) a dihydric alcohol (meth)acrylate monoester, (B) 0W30pts.wt. photopolymerizable unsaturated compound other than component A, (C) a linear polymer compound having a glass transition point of about 40W150°C, and (D) a sensitizer or/and sensitizer system which generate free radicals upon irradiation with actinic light, wherein at least one of components (A), (B), and (C) contains covalently bonded halogen atoms. Formula I wherein R and R
1 are each lower alkyl or lower haloalkyl, R
2 and R
3 are each lower alkylene, R
4 is lower alkylene, and R and R
1 , or R
2 and R
3 may be the same or different.
COPYRIGHT: (C)1984,JPO&Japio
摘要翻译：目的：含有含磷氨基甲酸酯二（甲基）丙烯酸酯，线性高分子化合物，敏化剂或敏化剂体系和含卤原子的成分的耐焊接性和耐热冲击性优异的阻燃性光聚合物组合物。构成：含有（A）20-75pts.wt。通过使（i）选自三甲基六亚甲基二异氰酸酯，异佛尔酮二异氰酸酯和赖氨酸二异氰酸酯的二异氰酸酯化合物与（ii）下式的含磷二元醇和（ iii）二元醇（甲基）丙烯酸酯单酯，（B）0-30pts.wt。除了组分A以外的光聚合性不饱和化合物，（C）玻璃化转变温度为约40〜150℃的线型高分子化合物，（D）在光化反应下产生自由基的增感剂或/ 其中组分（A），（B）和（C）中的至少一种含有共价键合的卤素原子。式I其中R和R 1各自为低级烷基或低级卤代烷基，R 2和R 3各自为低级亚烷基，R 4为低级亚烷基，R 1和R 2为R 1， 2>和R 3可以相同或不同。

6. 发明专利

JPS5948752A Photosensitive resin composition 失效
标题翻译：感光树脂组合物
公开(公告)号：JPS5948752A
公开(公告)日：1984-03-21
申请号：JP15918282
申请日：1982-09-13
申请人： Hitachi Chem Co Ltd
发明人： ISHIMARU TOSHIAKI , TSUKADA KATSUSHIGE , HAYASHI NOBUYUKI , SUGASAWA NOBORU
IPC分类号： G03C1/00 , C08F2/00 , C08F2/50 , G03F7/085 , H05K3/28
CPC分类号： G03F7/085 , H05K3/287
摘要： PURPOSE:To obtain the titled compsn. superior in adhesive properties usable for a soldering mask, etc. for manufacturing a printed circuit plate, by incorporating a nitrogen-contg. cyclic compd., a photopolymerizable unsatd. bond-contg. phosphoric compd., a specified photopolymerizable compd., a thermoplastic org. polymer, and a photopolymn. initiator. CONSTITUTION:A photosensitive resin compsn. improved in adhesive properties by incorporating (A) 0.001-5pts.wt. of at least one compd. selected from a group of imidazole, thiazole, tetrazole, triazole and their derivs., (B) 0.001-5pts.wt. photopolymerizable unsatd. bond-contg. phosphoric compd., (C) 20-80pts.wt. photopolymerizable compd. having a terminal ethylene group, (D) 20-80pts.wt. thermoplastic org. polymer, and (E) 0.5-10pts.wt. sensitizer and/or sensitizing material for initiating polymn. of the unsatd. compds. (B) and (C) by irradiation of active rays.
摘要翻译：目的：获得标题化合物。优异的粘合性能可用于焊接掩模等用于制造印刷电路板，通过掺入氮气阻挡层。环状化合物，可光聚合不饱和物。债券contg。磷酸化合物，指定的可光聚合化合物，热塑性组合物。聚合物和光聚合物。引发剂。构成：感光树脂组成。通过掺入（A）0.001-5pts.wt。至少有一个compd 选自一组咪唑，噻唑，四唑，三唑及其衍生物，（B）0.001-5pts.wt。光聚合不饱和度债券contg。磷酸化合物，（C）20-80pts.wt。光聚合化合物具有末端亚乙基，（D）20-80pts.wt。热塑性组织聚合物和（E）0.5-10pts.wt。敏化剂和/或敏化材料用于引发聚合物。的不满 compds。（B）和（C）。

7. 发明专利

JPS5764734A Photosensitive resin composition and photosensitive element 失效
标题翻译：感光树脂组合物和感光元素
公开(公告)号：JPS5764734A
公开(公告)日：1982-04-20
申请号：JP14168280
申请日：1980-10-08
申请人： Hitachi Chem Co Ltd
发明人： ISHIMARU TOSHIAKI , TSUKADA KATSUSHIGE , HAYASHI NOBUYUKI
IPC分类号： C08F299/00 , B23K35/22 , C08F2/50 , C08F290/00 , C08F299/06 , C08G18/67 , C23F1/00 , G03F7/027 , G03F7/038 , H05K3/28
CPC分类号： G03F7/027 , B23K35/224 , C08F299/065 , C08G18/672 , H05K3/287 , H05K2203/0783 , Y10S430/162
摘要： PURPOSE: To obtain an element superior in resistance to cooling and heating shock, and heat resistance, by forming a photosensitive resin composition layer consisting of a urethane di(meth)acrylate compound, a polymer, and a sensitizer on a support film.
CONSTITUTION: A photosensitive resin composition is obtained by mixing (A) 20W 75pts.wt. urethane di(meth)acrylate compound obtained by reacting trimethylhexamethylenediisothianate with divalent alcohol mono(meth)acrylate; (B) 20W75pts.wt. linear polymer having 40W150°C glass transition point, such as methylmethacrylate- methacrylic acid copolymer; and (C) 0.5W10pts.wt. sensitizer, such as 2-ethyl-anthraquinone. This composition is dissolved into an organic solvent, this solution 10 is coated on a support film 16 fed from a roller 5, dried with a 80W100°C dryer 11 to form a composition layer, a cover film 17 fed from a roller 12 is applied to the composition layer, and wound around a roller 15.
COPYRIGHT: (C)1982,JPO&Japio
摘要翻译：目的：通过在支撑膜上形成由氨基甲酸酯二（甲基）丙烯酸酯化合物，聚合物和增感剂组成的感光性树脂组合物层，可以获得耐冷却和加热冲击性和耐热性优异的元素。构成：通过混合（A）20-75pts.wt。通过三甲基六亚甲基二硫代二异氰酸酯与二元醇单（甲基）丙烯酸酯反应得到的氨基甲酸酯二（甲基）丙烯酸酯化合物; （B）20-75pts.wt。具有40-150℃玻璃化转变点的线性聚合物，例如甲基丙烯酸甲酯 - 甲基丙烯酸共聚物; 和（C）0.5-10pts.wt。敏化剂，如2-乙基 - 蒽醌。将该组合物溶解到有机溶剂中，将该溶液10涂布在从辊5供给的支撑膜16上，用80-100℃干燥器11干燥以形成组合物层，从辊子进给的覆盖膜17 12施加到组合物层，并卷绕在辊15上。

8. 发明专利

JPS59116652A Photosensitive resin composition 失效
标题翻译：感光树脂组合物
公开(公告)号：JPS59116652A
公开(公告)日：1984-07-05
申请号：JP23408982
申请日：1982-12-23
申请人： Hitachi Chem Co Ltd
发明人： SUGASAWA NOBORU , ISHIMARU TOSHIAKI , TSUKADA KATSUSHIGE , HAYASHI NOBUYUKI
IPC分类号： G03C1/72 , G03F7/004 , G03F7/038
CPC分类号： G03F7/038 , G03C1/72
摘要： PURPOSE:To improve the film forming property when a protective surface film for a printed wiring board is formed, by adding a reaction product of a specified diol with a specified isocyanate and a specified acrylic or methacrylic monoester, a specified linear polymer, and a specified sensitizer. CONSTITUTION:A diol such as 1,4-butanediol is reacted with 1.2-1.6 isocyanate equiv. of an isocyanate such as isoboron diisocyanate basing on 1.0 OH equiv. of said diol and 0.2-0.3 OH equiv. of the (meth)acrylic ester of a diol basing on 1.0 OH equiv. of said diol to prepare a reaction product. A photosensitive resin composition is composed essentially of 100pts.wt. said reaction product, 5- 400pts.wt. linear polymer such as polymethyl (meth)acrylate with 40-80 deg.C glass transition temp., and a sensitizer which generates free radicals when irradiated with active light. The photosensitive resin composition is easily coated on a substrate or the like, has a favorable film forming property, and gives a protective surface film with superior bendability, heat resistance and solvent resistance by development.
摘要翻译：目的：为了提高形成印刷线路板用保护性表面膜的成膜性，通过将规定的二醇与特定的异氰酸酯和特定的丙烯酸或甲基丙烯酸酯单酯，规定的线型聚合物和规定的敏化剂。构成：二醇如1,4-丁二醇与异氰酸酯等于1.2-1.6反应。的异氰酸酯，例如基于1.0当量的异丁二烯基二异氰酸酯。的所述二醇和0.2-0.3OH当量。的基于1.0OH当量的二醇的（甲基）丙烯酸酯。的所述二醇以制备反应产物。光敏树脂组合物基本上由100pts.wt。所述反应产物为5-400pts.wt。线性聚合物如聚甲基（甲基）丙烯酸甲酯与40-80℃玻璃化转变温度，以及当用活性光照射时产生自由基的敏化剂。感光性树脂组合物容易地涂布在基材等上，具有良好的成膜性，并且通过显影得到具有优异的弯曲性，耐热性和耐溶剂性的保护性表面膜。

9. 发明专利

JPS5946642A Photosensitive resin composition 失效
标题翻译：感光树脂组合物
公开(公告)号：JPS5946642A
公开(公告)日：1984-03-16
申请号：JP15718082
申请日：1982-09-09
申请人： Hitachi Chem Co Ltd
发明人： ISHIMARU TOSHIAKI , TSUKADA KATSUSHIGE , HAYASHI NOBUYUKI , SUGASAWA NOBORU
IPC分类号： G03C1/00 , C08F2/00 , C08F2/48 , G03F7/004 , G03F7/085 , H05K3/28
CPC分类号： G03F7/085 , H05K3/287
摘要： PURPOSE:To form a protective film having a superior adhesive strength to the surface of a substrate by adding at least 1 kind of compound selected from a group consisting of monoazaindole and derivs. thereof as an essential component. CONSTITUTION:This composition consists of 0.001-5pts.wt. of at least 1 kind of compound selected from a group consisting of monoazaindole and derivs. thereof, 0.221-5pts.wt. phosphoric acid compound having photopolymerizable unsatd. bond, 20-80pts.wt. photopolymerizable compound having at least one terminal ethylene group, 20-80pts.wt. thermoplastic org. polymer, and 0.5-10pts.wt. sensitizer and/or sensitizer system which initiates the polymn. of the unsatd. compounds when irradiated with active light.
摘要翻译：目的：通过添加至少1种选自单吖嗪和衍生物的化合物形成对基材表面具有优异粘合强度的保护膜。作为必需成分。构成：该组成由0.001-5pts.wt。的至少1种选自单唑衍生物和衍生物的化合物。其为0.221-5pts.wt。具有光聚合性不饱和的磷酸化合物。债券，20-80pts.wt。具有至少一个末端亚乙基的光聚合化合物，20-80pts.wt。热塑性组织聚合物和0.5-10pts.wt。敏化剂和/或敏化剂系统，其启动聚合。的不满用活性光照射时的化合物。

10. 发明专利

JPS59142546A Photosensitive element 失效
标题翻译：感光元素
公开(公告)号：JPS59142546A
公开(公告)日：1984-08-15
申请号：JP1572783
申请日：1983-02-02
申请人： Hitachi Chem Co Ltd
发明人： MONMA NOBORU , MINAMI YOSHITAKA , FUJITA EIJI , MASAOKA KAZUTAKA , ISHIMARU TOSHIAKI
IPC分类号： G03F7/11 , G03C1/91 , G03F7/09 , H05K3/00 , G03C1/80
CPC分类号： G03C1/91 , H05K3/0073
摘要： PURPOSE:To obtain improved patternability capable of forming a solder mask or the like high in density even on a resin face by forming on a base film a layer contg. a compd. absorbing light of >=400nm wavelength. CONSTITUTION:In a photosensitive element comprising a photosensitive layer, a base film, and when needed, a protective film, the base film is coated with a layer contg. a compd. having high absorptivity in >=400nm wavelengths and low absorptivity in
摘要翻译：目的：为了获得能够形成高密度的焊料掩模等的改进的图案化，甚至在树脂表面上通过在基膜上形成层，一个compd 吸收> 400nm波长的光。构成：在包含感光层，底膜的感光元件中，根据需要，在保护膜上涂布基膜，一个compd 具有> = 400nm波长的高吸收率和<= 400nm波长的低吸收率，例如二茂铁，对二甲基氨基硬脂基噻唑，2,4,6-三苯基吡喃鎓盐或2,6-双（对二甲基氨基苯甲酸）环己酮。作为基膜，使用聚酯膜，作为覆膜使用PE，PP膜等。

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