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1. 发明专利

JP2011021205A Insulating resin composition for printed wiring board and application thereof 审中-公开
标题翻译：印刷线路板绝缘树脂组合物及其应用
公开(公告)号：JP2011021205A
公开(公告)日：2011-02-03
申请号：JP2010237879
申请日：2010-10-22
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： FUJITA HIROAKI , KUMAKURA YOSHITOSHI , HIROZAWA KIYOSHI , EDA TETSUO , KANEKO YOICHI
IPC分类号： C08L63/00 , C08G59/62 , C08J5/18 , C08K5/13 , C08L29/14 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a halogen-free insulating resin sheet excellent in copper foil peeling strength and chemical resistance. SOLUTION: An insulating resin composition is an epoxy resin composition containing a polyphenolic antioxidant. The epoxy resin composition is a resin composition including an epoxy resin, phenolic hardener, compound having a dihydrobenzoxazine ring, polyvinyl butyral resin and inorganic filler. A method of manufacturing a printed wiring board using the epoxy resin composition is described. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供优异的铜箔剥离强度和耐化学性的无卤绝缘树脂片。解决方案：绝缘树脂组合物是含有多酚抗氧化剂的环氧树脂组合物。环氧树脂组合物是包含环氧树脂，酚类固化剂，具有二氢苯并恶嗪环的化合物，聚乙烯醇缩丁醛树脂和无机填料的树脂组合物。对使用该环氧树脂组合物的印刷电路板的制造方法进行说明。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2002368429A Resin film as well as metal foil with resin using the same and multilayer printed circuit board 审中-公开
标题翻译：作为金属箔的树脂膜与使用其的树脂和多层印刷电路板
公开(公告)号：JP2002368429A
公开(公告)日：2002-12-20
申请号：JP2001170682
申请日：2001-06-06
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KANEKO YOICHI , TOSAKA YUJI
IPC分类号： H05K1/03 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a multilayer printed circuit board or a resin film for a metal foil with a resin which solves occurrence of low handleability and a carbonized flow and a difficulty of assuring a uniform hole shape of a via hole, and to provide the metal foil with the resin and the multilayer printed circuit board using the same. SOLUTION: An insulating resin film is used to manufacture the build-up multilayer printed circuit board or the metal foil with the resin. The resin film contains long fiber of glass fiber contained in a nonwoven fabric-like state in the resin film.
摘要翻译：要解决的问题：提供一种多层印刷电路板或用于具有树脂的金属箔的树脂膜，其解决了低处理性和碳化流动的发生以及难以确保通孔的均匀孔形状，并且提供具有树脂的金属箔和使用其的多层印刷电路板。解决方案：使用绝缘树脂膜制造积层多层印刷电路板或具有树脂的金属箔。树脂膜在树脂膜中含有无纺布状状的长纤维状玻璃纤维。

3. 发明专利

JPH11279766A Electroless plating method, production of printed circuit board and production of multilayered printed circuit board 失效
标题翻译：印刷电路板的生产方法和多层印刷电路板的制造
公开(公告)号：JPH11279766A
公开(公告)日：1999-10-12
申请号：JP8763198
申请日：1998-03-31
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： IRINO TETSURO , TOSAKA YUJI , FUKAI HIROYUKI , KANEKO YOICHI
IPC分类号： H05K3/18 , C23C18/16 , C23C18/28 , H05K3/38 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To lessen plating blisters in production of a multilayered printed circuit board by a full additive build-up method. SOLUTION: An insulating layer is formed on the printed circuit board formed with a first conductor circuit and via holes are formed in this insulating layer. The surface of the insulating layer and the inside walls of the via holes are subjected to a sensitization treatment by a Pd complex and heat treatment in this order and thereafter, electroless plating is deposited to form a second conductor circuit and the connection of the first conductor circuit and the second conductor circuit.
摘要翻译：要解决的问题：通过全添加剂累积方法减少多层印刷电路板的制造中的电镀水泡。解决方案：在形成有第一导体电路的印刷电路板上形成绝缘层，并且在该绝缘层中形成通孔。绝缘层的表面和通孔的内壁通过Pd络合物进行敏化处理，然后依次进行热处理，然后沉积化学镀以形成第二导体电路，并且连接第一导体电路和第二导体电路。

4. 发明专利

JP2004259937A Method for manufacturing multilayer printed wiring board, and the board obtained from the method 审中-公开
公开(公告)号：JP2004259937A
公开(公告)日：2004-09-16
申请号：JP2003049081
申请日：2003-02-26
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KANEKO YOICHI , YAMASHITA TOMOAKI
IPC分类号： C23F1/00 , H05K3/38 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer printed wiring board whose handling during manufacture is easy and which is superior in adhesiveness and solder heat resistance of inner layer copper and a pre-preg without coat deformation in lamination and bonding and without causing rust; and to provide the multilayer printed wiring board using the method. SOLUTION: In the manufacturing method of the multilayer printed wiring board, a surface processing is performed on an inner layer circuit on an insulating substrate where a circuit is formed and the pre-preg is overlapped with it so as to laminate and bond them. The surface processing includes a process for bringing a metal foil face of the inner layer circuit into contact with acid processing liquid including noble metal ions and copper ions. The multilayer printed wiring board is manufactured by using the manufacturing method of the multilayer printed wiring board. COPYRIGHT: (C)2004,JPO&NCIPI

5. 发明专利

JP2003012894A Epoxy resin composition, and insulation resin sheet and printed wiring board using the same 审中-公开
标题翻译：环氧树脂组合物和绝缘树脂片和印刷线路板
公开(公告)号：JP2003012894A
公开(公告)日：2003-01-15
申请号：JP2001202481
申请日：2001-07-03
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： FUJITA HIROAKI , KUMAKURA YOSHITOSHI , KANEKO YOICHI
IPC分类号： C08J5/24 , B32B15/08 , B32B15/092 , B32B17/04 , C08G59/62 , C08K3/22 , C08K5/13 , C08K5/357 , C08L63/00 , H01L23/14 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a non-halogen system epoxy resin composition capable of affording large flame-retardant effect (UL-standard: V-0), an insulation resin sheet using the same and a printed wiring board with excellent solder heat resistance.
SOLUTION: This epoxy resin composition comprises (a) a non-halogenated epoxy resin having at least two epoxy groups in a molecule, (b) a phenolic curing agent, (c) a compound having dihydrobenzoxazine ring, (d) a flexibility imparting agent, (e) a polyphenolic antioxidant and (f) a high purity aluminum hydroxide with 0.2 wt.% or less Na
2 O content. The insulation resin sheet and the printed wiring board using the composition are provided.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了提供能够提供大的阻燃效果的非卤素体系环氧树脂组合物（UL-标准：V-0），使用其的绝缘树脂片和具有优异的耐焊锡性的印刷线路板。解决方案：该环氧树脂组合物包含（a）分子中具有至少两个环氧基的非卤代环氧树脂，（b）酚类固化剂，（c）具有二氢苯并恶嗪环的化合物，（d）柔性赋予剂，（e）多酚抗氧化剂和（f）具有0.2重量％或更少的Na 2 O含量的高纯度氢氧化铝。提供绝缘树脂片和使用该组合物的印刷线路板。

6. 发明专利

JPS6141775A Surface treatment of copper 失效
标题翻译：铜表面处理
公开(公告)号：JPS6141775A
公开(公告)日：1986-02-28
申请号：JP16253684
申请日：1984-08-01
申请人： Hitachi Chem Co Ltd
发明人： KANEKO YOICHI , NAKASO AKISHI , OKAMURA TOSHIRO
IPC分类号： C23C18/40 , H05K3/38 , H05K3/46 , H05K3/18
CPC分类号： C23C18/40 , H05K3/384
摘要： PURPOSE:To improve the adhesive property of copper to a resin layer such as prepreg by surface treatment by treating the copper with an aqueous soln. contg. copper ions, a complexing agent, a reducing agent, hydroxyl ions and Zr or Bi. CONSTITUTION:A copper lined laminated plate worked into a circuit is immersed in an aqueous soln. contg. copper ions from copper sulfate or the like, a complexing agent such as EDTA, a reducing agent, hydroxyl ions from NaOH or the like, and one or more kinds of components selected among Zr, Bi and compounds thereof. A heterocyclic compound contg. nitrogen such as 1,10- phenanthroline may be added to the aqueous soln. The immersed plate is taken out and after-treated with hydrochloric acid, an aqueous soln. of ammonium persulfate or the like. By this surface treatment the adhesive property of the copper surface to a resin layer such as prepreg, an etching resist or a plating resist is improved.
摘要翻译：目的：通过用水溶液处理铜，通过表面处理来提高铜对树脂层如预浸料的粘合性能。对比铜离子，络合剂，还原剂，羟基离子和Zr或Bi。构成：将铜衬层压板浸入电路中浸入水溶液中。对比来自硫酸铜等的铜离子，EDTA等络合剂，还原剂，NaOH等的羟基离子，以及选自Zr，Bi及其化合物的一种或多种成分。杂环化合物可以向水溶液中加入氮，例如1,10-菲咯啉。将浸渍板取出并用盐酸，水溶液进行后处理。的过硫酸铵等。通过该表面处理，提高了铜表面与树脂层如预浸料，抗蚀剂或电镀抗蚀剂的粘合性。

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