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1. 发明专利

JP2008001952A Electrically conductive base material for plating, method for producing the same, method for producing conductor layer pattern-fitted base material, conductor layer pattern-fitted base material and electromagnetic wave shielding member using the same 审中-公开
标题翻译：电导电导电材料，其制造方法，制造导体层型材基材，导体层图案基材和使用该电介质层的电磁波屏蔽部件的方法
公开(公告)号：JP2008001952A
公开(公告)日：2008-01-10
申请号：JP2006173721
申请日：2006-06-23
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TOSAKA MINORU , UEHARA TOSHISHIGE , SUZUKI KYOSUKE , OKAMURA TOSHIRO
IPC分类号： C25D1/10 , C23F1/02 , C25D1/08 , C25D5/02 , C25D7/00 , G09F9/00 , H05K9/00
摘要： PROBLEM TO BE SOLVED: To provide an electrically conductive base material for plating for producing a conductor layer pattern-fitted base material useful for an electromagnetic wave shielding member subjected to patterning so as to have electrical conductivity and light transmissivity using a transferring process with high productivity. SOLUTION: The electrically conductive base material for plating has a projecting part pattern and recessed parts with the shape of geometric figure drawn thereby. An insulation layer is formed on the surface of each recessed part at a position lower than the position lower by 0.5 to 3 μm from the upper end of each projecting part, the width of the exposed part of each projecting part in the electrically conductive base material is 1 to 40 μm, and the height of each projecting part after the application of the insulation layer to each recessed part is ≥10 μm. It is preferable that, as the exposed part of each projecting part progresses to the tip direction, the width is not widen, and, as the whole, the width is reduced at the upper part compared with the lower part. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于电镀的导电基材，用于制造用于经过图案化的电磁波屏蔽构件的导体层图案配合的基材，以便使用转印方法具有导电性和透光性生产力高。解决方案：用于电镀的导电基材具有突出部分图案，并且由此形成具有几何图形形状的凹陷部分。在每个凹部的表面上，在距离每个突出部的上端低0.5〜3μm的位置，在导电性基材中的突出部的露出部的宽度为1〜40μm，在向各凹部施加绝缘层后的各突出部的高度为≥10μm。优选地，随着每个突出部分的暴露部分朝向尖端方向前进，宽度不变宽，并且总体而言，与下部相比，上部的宽度减小。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2009158842A Manufacturing method for surface-blackening copper metal, manufacturing method for base material with conductor-layer pattern, base material with conductor-layer pattern and electromagnetic-wave shielding member using base material 审中-公开
标题翻译：表面覆盖铜金属的制造方法，具有导体层模式的基材的制造方法，带导体层模式的基体材料和使用基底材料的电磁波屏蔽构件
公开(公告)号：JP2009158842A
公开(公告)日：2009-07-16
申请号：JP2007337881
申请日：2007-12-27
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KIKUHARA YOSHIHITO , NAOYUKI SUSUMU , UEHARA TOSHISHIGE , TOSAKA MINORU , SUZUKI KYOSUKE , NEGISHI MASAMI , OKAMURA TOSHIRO
IPC分类号： H05K9/00 , G09F9/00
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method for a surface-blackening copper metal being capable of manufacturing a base material with a conductor-layer pattern with an excellent productivity by using a transfer method and facilitating a manufacture, the manufacturing method for the base material with the conductor-layer pattern, the base material with the conductor-layer pattern and an electromagnetic-wave shielding member using the base material. SOLUTION: A process in which copper metallic layers are formed by depositing copper metals to recessed sections 4 formed in broad widths towards the opening direction to insulating layers 3 formed to the surface of the conductive base material 2 under a first current density and the copper metal is deposited on a copper surface in a black or a brown under a second current density larger than the first current density is conducted in one copper-sulfate plating bath. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种能够通过使用转印方法制造具有优异生产率的导体层图案的基材的表面黑化铜金属的制造方法并且便于制造，制造方法对于具有导体层图案的基材，具有导体层图案的基材和使用该基材的电磁波屏蔽构件。解决方案：一种方法，其中通过将铜金属沉积到形成在宽度方向上的宽度方向的开口方向上的铜金属层形成到在第一电流密度下形成到导电基底材料2的表面的绝缘层3，在一个硫酸铜电镀浴中进行铜金属以大于第一电流密度的第二电流密度沉积在黑色或棕色的铜表面上。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2009158679A Conductive substrate for plating, manufacturing method thereof, method of manufacturing conductive pattern or substrate with conductive pattern using the same, substrate with conductive layer pattern, and light transparent electromagnetic wave shielding member 审中-公开
标题翻译：用于其制造的导电基板，其制造方法，使用其导电图案制造导电图案或基板的方法，具有导电层图案的基板和光透明电磁波屏蔽构件
公开(公告)号：JP2009158679A
公开(公告)日：2009-07-16
申请号：JP2007334084
申请日：2007-12-26
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： SUZUKI KYOSUKE , UEHARA TOSHISHIGE , TOSAKA MINORU , NAOYUKI SUSUMU , NEGISHI MASAMI , KIKUHARA YOSHIHITO , OKAMURA TOSHIRO
IPC分类号： H05K9/00 , B32B7/02 , B32B9/00 , C23C14/06 , C23C14/08 , C23C14/10 , C23C14/24 , C23C16/27 , C23C16/40 , C23C16/42 , G09F9/00
摘要： PROBLEM TO BE SOLVED: To provide a conductive substrate for plating which smoothly peels off or transfer plating formed on a conductive substrate for plating and manufactures a conductive layer pattern with an excellent characteristic. SOLUTION: An insulation layer is formed on the surface of the conductive substrate, and it is entirely or partly formed of more than two layers and a concave is formed to form wide plating in the insulation layer toward the direction of an opening. In such the conductive substrate for plating, its first layer is preferably made of diamond-like carbon (DLC) or an inorganic material. Since the insulation layer is entirely or partly formed of more than two layers, defects in the insulation layer such as a pin hole or the like are compensated, producing no unnecessary plating. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种平滑地剥离或转移形成在用于电镀的导电基板上的电镀的电镀导电基板，并且制造具有优异特性的导电层图案。解决方案：在导电基板的表面上形成绝缘层，并且其全部或部分地由多于两层形成，并且形成凹部以在绝缘层中朝向开口方向形成宽电镀。在这种用于电镀的导电基底中，其第一层优选由类金刚石碳（DLC）或无机材料制成。由于绝缘层全部或部分地由两层以上形成，所以绝缘层（例如针孔等）的缺陷被补偿，不产生不必要的电镀。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2008025025A Method of manufacturing copper metal having blackened surface, method of manufacturing base material with conductive layer pattern, base material with conductive layer pattern and light transmissive electromagnetic wave shielding member using the same 审中-公开
标题翻译：制造具有黑色表面的铜金属的方法，使用导电层图案制造基材的方法，具有导电层图案的基材和使用其的光传输电磁波屏蔽元件
公开(公告)号：JP2008025025A
公开(公告)日：2008-02-07
申请号：JP2007162511
申请日：2007-06-20
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KIKUHARA TOKUJIN , YOSHIDA NOBUYUKI , UEHARA TOSHISHIGE , NAOYUKI SUSUMU , TOSAKA MINORU , SUZUKI KYOSUKE , IWASAKI YASUHIRO , OKAMURA TOSHIRO
IPC分类号： C25D1/04 , B32B15/08 , C25D1/00 , C25D1/08 , C25D3/38 , G09F9/00 , H05K9/00
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a copper metal layer having a blackened surface. SOLUTION: In the method of manufacturing the copper metal having the blackened surface by depositing copper metal on a conductive base material for plating by plating to blacken the surface, a copper metal layer forming step for depositing copper metal in layer at a first current density and a blackening step for depositing copper metal to have the blackened surface on the surface of the copper metal layer at a second current density larger than the first current density are carried out in one copper pyrophosphate plating bath. The conductive base material for plating can be a conductive base material having a pattern like plated part. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造具有黑化表面的铜金属层的方法。解决方案：在通过电镀将导电性基底材料沉积铜金属制成具有黑色表面的铜金属以使黑色变黑的方法中，在第一层中沉积铜金属的铜金属层形成步骤在一个铜焦磷酸盐电镀浴中进行电流密度和用于沉积铜金属以使铜金属层的表面上的黑化面大于第一电流密度的第二电流密度的黑化步骤。用于电镀的导电基材可以是具有类似镀层部分的图案的导电基材。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2008004886A Substrate having conductor layer pattern 审中-公开
标题翻译：带有导体层的图案
公开(公告)号：JP2008004886A
公开(公告)日：2008-01-10
申请号：JP2006175471
申请日：2006-06-26
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： UEHARA TOSHISHIGE , TOSAKA MINORU , SUZUKI KYOSUKE , OKAMURA TOSHIRO
IPC分类号： H05K9/00 , B32B7/02 , G09F9/00
摘要： PROBLEM TO BE SOLVED: To solve the problems of, on a conductor layer, the dependence of glare on a viewing angle and contrast in appearance, and the problem of insufficient adhesion between resin or the like and a cover film when the cover film is stacked on the conductor layer with the resin or the like, on a substrate having a conductor layer pattern obtained by a transfer method. SOLUTION: A substrate 52 having a conductor layer pattern with a geometric shape includes a conductor layer 50 partially or entirely shaped like a U-tube in a cross section orthogonal to the length of the conductor layer 50. It is preferable that the conductor layer pattern has a width of 5 to 30 μm, has the maximum height from the bottom end of the conductor layer 50 on both ends of the cross-sectional structure of the conductor layer or between the midpoint and both ends, and has the minimum height of ≥50% and COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了解决在导体层上的眩光对外观的视角和对比度的依赖性以及树脂等之间的粘合不充分以及覆盖膜的覆盖膜的问题在具有通过转印方法获得的导体层图案的基板上，用树脂等将导体层层叠在导体层上。解决方案：具有几何形状的导体层图案的基板52包括在垂直于导体层50的长度的横截面中部分地或整体地形成为U形管的导体层50。导体层图案的宽度为5〜30μm，在导体层的截面结构的两端的导体层50的底端或中点与两端之间具有最大高度，并且具有最小在导体层的凹部中的导体层的底端的最大高度的高度为≥50％且<99％。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JPS61106775A Electroless copper plating solution 失效
标题翻译：电镀铜溶液
公开(公告)号：JPS61106775A
公开(公告)日：1986-05-24
申请号：JP22848984
申请日：1984-10-30
申请人： Hitachi Chem Co Ltd
发明人： OKAMURA TOSHIRO , YOSHIMURA YUKIO , NAKASO AKISHI , SASE SHIGEO , IKEDA HIROMI
IPC分类号： C23C18/40
CPC分类号： C23C18/40
摘要： PURPOSE:To obtain an electroless copper plating soln. having the high rate of deposition for plating by adding cyclic phenol to the electroless copper plating soln. contg. copper ions, a copper ion complexing agent, a reducing agent, a pH adjusting agent and water. CONSTITUTION:About 50mg/l cyclic phenol synthesized by reacting p-alkylphenol such as p-cresol with formaldehyde is added to an electroless copper plating soln. consisting of about 0.004-0.2mol/l copper ions from a copper salt such as copper sulfate, about 0.004-1mol/l copper ion complexing agent such as EDTA, about 0.01-0.25mol/l reducing agent such as formaldehyde, a pH adjusting agent such as NaOH by an amount required to adjust the plating soln. to about 11.0-13.5pH, and water. The resulting plating soln. has the increased rate of deposition for plating.
摘要翻译：目的：获得化学镀铜溶液。通过向无电解铜电镀溶液中添加环状苯酚而具有高的电镀沉积速率。对比铜离子，铜离子络合剂，还原剂，pH调节剂和水。构成：将对苯甲酚与甲醛等对烷基酚反应合成的约50mg / l环状苯酚加入无电镀铜溶液中。由铜盐如硫酸铜约0.004-0.2mol / l铜离子，约0.004-1mol / l铜离子络合剂如EDTA，约0.01-0.25mol / l还原剂如甲醛，pH调节试剂如NaOH，调节电镀所需的量。至约11.0-13.5pH，和水。所得电镀溶液。电镀沉积速率增加。

7. 发明专利

JP2009021412A Method of manufacturing surface blackened copper metal, method of manufacturing base material with conductor layer pattern, base material with conductor pattern, and electromagnetic wave shielding member using the base material 审中-公开
标题翻译：制造表面黑色铜金属的方法，使用导体图案制造基体材料的方法，带导体图案的基底材料和使用基底材料的电磁波屏蔽构件
公开(公告)号：JP2009021412A
公开(公告)日：2009-01-29
申请号：JP2007183130
申请日：2007-07-12
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KIKUHARA YOSHIHITO , NAOYUKI SUSUMU , UEHARA TOSHISHIGE , TOSAKA MINORU , SUZUKI KYOSUKE , NEGISHI MASAMI , OKAMURA TOSHIRO
IPC分类号： H05K9/00 , B32B15/04 , C25D1/08 , C25D5/02 , C25D5/10 , C25D21/00 , C25D21/12
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a copper metal layer whose surface is blackened with good mass-productivity. SOLUTION: In the method of manufacturing a pattern copper metal layer whose surface is blackened using a conductive base material 1 for plating, the conductive base material 1 for plating has an insulating layer 3 formed on a surface of a conductive base material 2 and also has a pattern of a recessed portion 4 which is wide in an opening direction and for forming plating, formed in the insulating layer 3. Following steps are carried out in one copper pyrophosphate plating bath, a conductive layer forming step of forming the copper metal layer by depositing copper metal in the recessed portion 4 of the conductive base material 1 for plating with first current density, and a blackening processing step of depositing copper metal on a surface of the copper metal layer with second current density larger than the first current density so that the surface may become black. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造表面被黑化而具有良好批量生产率的铜金属层的方法。解决方案：在使用导电性基材1进行镀覆的表面变黑的图案铜金属层的制造方法中，镀敷用导电性基材1具有形成在导电性基材2的表面上的绝缘层3 并且还具有形成在绝缘层3中的开口方向宽并形成电镀的凹部4的图案。在一个焦磷酸铜电镀浴中进行以下步骤，形成步骤：形成铜通过在导电性基材1的凹部4中以第一电流密度进行镀敷而沉积铜金属的黑色金属层，以及在铜金属层的表面上沉积铜金属的黑化处理步骤，该第二电流密度大于第一电流密度使表面变黑。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JPS6137971A Electroless copper plating liquid 失效
标题翻译：电镀铜液
公开(公告)号：JPS6137971A
公开(公告)日：1986-02-22
申请号：JP15997484
申请日：1984-07-30
申请人： Hitachi Chem Co Ltd
发明人： NAKASO AKISHI , OKAMURA TOSHIRO , IKEDA HIROMI
IPC分类号： C23C18/40 , C23C18/48
CPC分类号： C23C18/40
摘要： PURPOSE:To obtain a electroless Cu plating liquid capable of controlling the plating precipitation rate in a suitable range, by incorporating Cu ion, its complexing agent, reducing agent, pH adjuster, water, organic polymer, alpha,alpha'-dipyridyl or phenanthroline or the like and catalyzer such as V to the liquid. CONSTITUTION:The electroless Cu plating liquid contains Cu ion, its complexing agent, reducing agent, pH adjuster, water, organic polymer, at least one of alpha,alpha'-dipyridyl and phenanthroline or the like and V or V compound, and is capable of forming wire conductor with highly extensible plated Cu, without plating precipitation on plating resist while controlling electroless Cu plating precipitation rate to about 1.0-3.0mum/hr range. As said compsn. components, CuSO4, etc. is used to Cu ion source, EDTA, etc. to complexing agent, formalin, etc. to reducing agent, NaOH, etc. to pH adjuster, polyalkylene glycol, etc. to organic polymer, 1.10-phenanthroline to phenanthroline or the like, oxide, etc. to V compound. Adding quantity of catalyzer such as V is suitable in about 0.05-200mg/l range.
摘要翻译：目的：获得能够通过引入Cu离子，其络合剂，还原剂，pH调节剂，水，有机聚合物，α，α'-联吡啶或菲咯啉等方式控制电镀沉淀速率在适当范围内的化学镀铜液，或类似物和催化剂如V至液体。构成：化学镀铜液含有Cu离子，其络合剂，还原剂，pH调节剂，水，有机聚合物，α，α'-联吡啶和菲咯啉等中的至少一种以及V或V化合物，并且能够形成具有高度可延展性的镀铜的导线，而不会在电镀抗蚀剂上沉积，同时控制无电镀铜沉淀速率至约1.0-3.0mum / hr范围。正如compsn所说。组分，CuSO4等用于铜离子源，EDTA等配合剂，福尔马林等对还原剂，NaOH等进行pH调节剂，聚亚烷基二醇等有机聚合物，1.10-菲咯啉菲咯啉等，氧化物等。催化剂如V的添加量适宜在约0.05-200mg / l范围内。

9. 发明专利

JP2009152285A Method for manufacturing metal pattern and base material having conductive layer pattern, and base material having conductive layer pattern and electromagnetic wave shielding member using the same 审中-公开
标题翻译：用于制造具有导电层图案的金属图案和基体材料的方法以及使用其的导电层图案和电磁波屏蔽构件的基底材料
公开(公告)号：JP2009152285A
公开(公告)日：2009-07-09
申请号：JP2007327152
申请日：2007-12-19
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KIKUHARA YOSHIHITO , NEGISHI MASAMI , NAOYUKI SUSUMU , OKAMURA TOSHIRO
IPC分类号： H05K9/00 , B32B7/02 , B32B15/04 , G09F9/00 , H01B5/14 , H01B13/00
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a metal pattern subjected to more homogeneous blackening treatment and a base material having a conductive layer pattern in the tone of color and shape having a sufficient degree of blackening for metal having a geometrical figure, and to provide the base material having a conductive layer pattern and an electromagnetic wave shielding member using the base material having a conductive layer pattern. SOLUTION: In the method for manufacturing the metal pattern 9 where a surface subjected to blackening treatment by depositing metal in a conductive metal pattern in a geometrical figure shape by pulse electrolysis is subjected to blackening treatment, a pulse electrolysis is performed under conditions for maintaining a cycle rate to be ≥2% or ≤90% and for holding each pulse conduction time to be ≥2 ms and ≤200 ms, when high conduction time is set to T 1 , low conduction time is set to T 2 , one cycle is defined to be the sum of T 1 and T 2 , and the cycle rate E in pulse electrolysis is set to E=100×(T 1 /(T 1 +T 2 )). COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造经受更均匀的黑化处理的金属图案的方法和具有导电层图案的基材，其颜色和形状的色调具有足够的黑化程度，具有几何形状的金属并且提供具有导电层图案的基材和使用具有导电层图案的基材的电磁波屏蔽构件。解决方案：在金属图案9的制造方法中，通过脉冲电解将几何图形中的金属沉积在金属表面进行黑化处理的表面进行黑化处理，脉冲电解在条件为了保持循环率为≥2％或≤90％，并且当高导通时间设定为T 1 时，保持每个脉冲导通时间为≥2ms和≤200ms，低导通时间被设定为T 2 ，一个周期被定义为T 1 和T 2 的和，并且脉冲中的循环速率E 电解设定为E = 100×（T 1 /（T 1 + T 2 ））。版权所有（C）2009，JPO＆INPIT

10. 发明专利

JP2008001936A Electrically conductive base material for plating, method for producing the same, method for producing conductor layer patter-fitted base material, conductor layer pattern-fitted base material and electromagnetic wave shielding member using the same 审中-公开
标题翻译：用于镀层的导电导电基材，其制造方法，用于制造导体层形成基质材料的方法，导体层图案填充基材和使用其的电磁波屏蔽构件
公开(公告)号：JP2008001936A
公开(公告)日：2008-01-10
申请号：JP2006171630
申请日：2006-06-21
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： SUZUKI KYOSUKE , TOSAKA MINORU , UEHARA TOSHISHIGE , OKAMURA TOSHIRO
IPC分类号： C25D1/10 , B32B9/00 , B32B15/04 , H05K9/00
摘要： PROBLEM TO BE SOLVED: To provide an electrically conductive base material for plating for producing a conductor layer pattern-fitted base material subjected to patterning so as to have electrical conductivity and light transmissivity using a transferring process with high productivity, and to provide a method for producing the conductor layer patter-fitted base material using the electrically conductive base material. SOLUTION: The electrically conductive base material 1 for plating has a projecting part pattern and recessed parts 2 with the shape of geometric figure drawn by the projecting part pattern. Two or more insulation layers 8 are formed on the surface of each recessed part at a position lower than the position lower by 0.5 to 5 μm from the upper end of each projecting part. The whole or a part of the insulation layers 8 is composed of two or more layers, the width of the exposed part of each projecting part is 1 to 40 μm, and the height of each projecting part after the application of the insulation layers 8 to each recessed part 2 is ≥10 μm. Metal is precipitated on the base material by plating, and this is transferred to a base material film. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于电镀的导电基材，用于制造经过图案化的导体层图案配合的基材，以便以高生产率的转印方法具有导电性和透光性，并且提供使用导电性基材制造导体层图案配合基材的方法。解决方案：用于电镀的导电基材1具有突出部分图案和具有由突出部分图案绘制的几何图形形状的凹部2。在每个凹部的表面上，比从各突出部的上端低0.5〜5μm的位置形成有两层以上的绝缘层8。绝缘层8的全部或一部分由两层或多层组成，每个突出部分的露出部分的宽度为1至40μm，并且在施加绝缘层8之后的每个突出部分的高度为每个凹陷部分2≥10μm。金属通过电镀沉淀在基材上，并将其转印到基材薄膜上。版权所有（C）2008，JPO＆INPIT

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