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1. 发明专利

JP2004196983A Method for producing adhesive sheet and printed-wiring board by using halogen-free insulation resin composition 审中-公开
公开(公告)号：JP2004196983A
公开(公告)日：2004-07-15
申请号：JP2002368099
申请日：2002-12-19
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： FUJITA HIROAKI , KUMAKURA YOSHITOSHI , TAKANEZAWA SHIN
IPC分类号： C08J5/24 , H05K3/18 , H05K3/38
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a multilayer printed wiring board, exhibiting good adhesive strength to plated copper by realizing high elongation property, while keeping surface roughness of an insulating layer after coarsening the surface to ≤3 μm so as to enable micro-wiring in circuit formation by a semi-additive method.
SOLUTION: The method for producing the printed wiring board comprises applying a resin composition consisting essentially of an epoxy resin having a biphenyl structure and a novolak structure, a particulate substance of acrylonitrile-butadiene copolymer, a phosphorus-containing phenol resin and a thermosetting agent and an inorganic filler to a glass nonwoven fabric, drying the coated nonwoven fabric and forming an insulation resin layer of the multilayer printed wiring board by using the resultant adhesive sheet.
COPYRIGHT: (C)2004,JPO&NCIPI

2. 发明专利

JP2007126498A Method for producing insulating resin adhesive sheet and method for producing printed wiring board using insulating resin adhesive sheet 审中-公开
标题翻译：生产绝缘树脂粘合片的方法和使用绝缘树脂粘合片生产印刷线路板的方法
公开(公告)号：JP2007126498A
公开(公告)日：2007-05-24
申请号：JP2005318253
申请日：2005-11-01
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： FUJITA HIROAKI , KUMAKURA YOSHITOSHI , FUKAI HIROYUKI , TAKANEZAWA SHIN , MORITA KOJI
IPC分类号： C09J7/02 , C09J11/04 , C09J11/06 , C09J121/00 , C09J163/00 , H01L23/32 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To obtain a substrate for an organic interposer, which is produced by mixing a resin composition containing an inorganic filler with a very small amount of a silica fiber having a low coefficient of thermal expansion and excellent dimensional stability, chemical resistance, wettability, etc., is expected to have improved connection reliability while satisfying various properties as an insulating substrate compatible with a semi-additive method.
SOLUTION: The method for producing an insulating resin adhesive sheet comprises coating a carrier film with an insulating resin composition composed of an epoxy resin, a rubber component, a phosphorus-based flame retardant, a thermosetting agent, an inorganic filler and a silica fiber as essential components and drying the film to a semicured state. The method for producing a printed wiring board comprises treating an insulating layer with an oxidizing roughening liquid and forming a circuit by an electroless plating or electrolytic plating as a method for piling a fixed number of the insulating resin adhesive sheets produced by the production method and curing the resin under heating and pressure to form a circuit on the insulating resin layer.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题为了获得通过将含有无机填料的树脂组合物与极少的热膨胀系数和极小尺寸稳定性的二氧化硅纤维混合而制备的有机中介层的基板，耐化学性，润湿性等有望提高连接可靠性，同时满足作为与半添加法相容的绝缘基板的各种性能。解决方案：绝缘树脂粘合片的制造方法包括用由环氧树脂，橡胶成分，磷系阻燃剂，热固性剂，无机填料和无机填料构成的绝缘树脂组合物涂布载体膜二氧化硅纤维作为必需组分，并将薄膜干燥至半熟化状态。制造印刷电路板的方法包括用氧化性粗糙液处理绝缘层，通过无电解电镀或电解电镀形成电路，作为用于堆叠固定数量的通过制造方法制造的绝缘树脂粘合片和固化的方法树脂在加热和加压下在绝缘树脂层上形成电路。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2005251895A Multilayer wiring board and its manufacturing method 审中-公开
标题翻译：多层接线板及其制造方法
公开(公告)号：JP2005251895A
公开(公告)日：2005-09-15
申请号：JP2004058659
申请日：2004-03-03
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： WATANABE TAKAKO , TAKANEZAWA SHIN , MORITA TAKASHI , FUJITA HIROAKI , ASAKAWA YUSUKE
IPC分类号： B32B7/02 , C08G59/40 , C09J7/02 , C09J163/00 , C09J201/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a multilayer wiring board in which a surface unevenness is small and which is suitable for fine wiring nature.
SOLUTION: The multilayer wiring board includes an insulating resin with a support having an insulating resin layer covered on a support and manufactured by laminating the insulating resin so as to be opposed to the wiring formed on the board or the wiring board. As the insulating resin layer, a thermosetting insulating resin composition which has a melting viscosity at 40°C of 8,000-50,000 Pas and a lowest melting viscosity of 10-400 Pas is used. The laminating step is performed at a temperature lower by 10°C than the temperature showing the lowest melting viscosity of the insulating resin layer. A method of manufacturing the same is provided.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：解决的问题：提供表面凹凸小且适合于精细布线性的多层布线基板。解决方案：多层布线板包括绝缘树脂，其具有覆盖在支撑体上的绝缘树脂层的支撑体，并且通过层压绝缘树脂以与形成在基板或布线板上的布线相对的方式制造。作为绝缘树脂层，使用在40℃下的熔融粘度为8,000〜50,000Pa·s，最低熔融粘度为10〜400Pa的热固性绝缘性树脂组合物。层压步骤在比绝缘树脂层的最低熔融粘度显示的温度低10℃的温度下进行。提供了制造该方法的方法。版权所有（C）2005，JPO＆NCIPI

4. 发明专利

JP2005175265A Adhesive sheet for multilayer wiring boards and method for manufacturing multilayer wiring board 审中-公开
标题翻译：用于多层布线板的粘合片及制造多层布线板的方法
公开(公告)号：JP2005175265A
公开(公告)日：2005-06-30
申请号：JP2003414805
申请日：2003-12-12
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： FUJITA HIROAKI , KUMAKURA YOSHITOSHI , TAKANEZAWA SHIN , FUKAI HIROYUKI
IPC分类号： B32B15/08 , C09J7/02 , C09J11/04 , C09J11/06 , C09J109/02 , C09J163/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a semiadditive-corresponding adhesive sheet having a high elasticity modulus, a low thermal expansion, a high contact adhesion with a plated copper, and a low dielectric dissipation factor, and to provide a method for manufacturing a multilayer wiring board using it. SOLUTION: The method for manufacturing the adhesive sheet for the multilayer wiring board comprises the steps of impregnating a nonwoven cloth comprising a liquid crystal polymer with a resin composition of matter having an essential component of an epoxy resin having a biphenyl and novolak structure, an acrylic nitryl butadiene rubber, and a thermosetting agent; and then hardening half after a drying process. The method further comprises the steps of superposing the predetermined number of adhesive sheets for the multilayer wiring boards, processing an insulating layer in an oxidation roughening solution as a method for forming a circuit on the insulating resin layer hardened by heating and pressurizing, and further forming a circuit by the copper plating. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供具有高弹性模量，低热膨胀，与镀铜的高接触粘合性和低介电损耗因数的半添加相应的粘合片，并提供制造方法使用它的多层布线板。解决方案：用于制造多层布线板用粘合片的方法包括以下步骤：将具有含有具有联苯和酚醛清漆结构的环氧树脂的必要成分的物质的树脂组合物浸渍在液晶聚合物中的无纺布丙烯酸丁酯橡胶和热固性剂; 然后在干燥过程后硬化一半。该方法还包括以下步骤：将用于多层布线板的预定数量的粘合片重叠，在氧化粗糙化溶液中加工绝缘层作为在通过加热和加压硬化的绝缘树脂层上形成电路的方法，并进一步形成电路由铜电镀。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2003012894A Epoxy resin composition, and insulation resin sheet and printed wiring board using the same 审中-公开
标题翻译：环氧树脂组合物和绝缘树脂片和印刷线路板
公开(公告)号：JP2003012894A
公开(公告)日：2003-01-15
申请号：JP2001202481
申请日：2001-07-03
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： FUJITA HIROAKI , KUMAKURA YOSHITOSHI , KANEKO YOICHI
IPC分类号： C08J5/24 , B32B15/08 , B32B15/092 , B32B17/04 , C08G59/62 , C08K3/22 , C08K5/13 , C08K5/357 , C08L63/00 , H01L23/14 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a non-halogen system epoxy resin composition capable of affording large flame-retardant effect (UL-standard: V-0), an insulation resin sheet using the same and a printed wiring board with excellent solder heat resistance.
SOLUTION: This epoxy resin composition comprises (a) a non-halogenated epoxy resin having at least two epoxy groups in a molecule, (b) a phenolic curing agent, (c) a compound having dihydrobenzoxazine ring, (d) a flexibility imparting agent, (e) a polyphenolic antioxidant and (f) a high purity aluminum hydroxide with 0.2 wt.% or less Na
2 O content. The insulation resin sheet and the printed wiring board using the composition are provided.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了提供能够提供大的阻燃效果的非卤素体系环氧树脂组合物（UL-标准：V-0），使用其的绝缘树脂片和具有优异的耐焊锡性的印刷线路板。解决方案：该环氧树脂组合物包含（a）分子中具有至少两个环氧基的非卤代环氧树脂，（b）酚类固化剂，（c）具有二氢苯并恶嗪环的化合物，（d）柔性赋予剂，（e）多酚抗氧化剂和（f）具有0.2重量％或更少的Na 2 O含量的高纯度氢氧化铝。提供绝缘树脂片和使用该组合物的印刷线路板。

6. 发明专利

JP2008166720A Manufacturing method for multilayer printed wiring board 审中-公开
标题翻译：多层印刷线路板的制造方法
公开(公告)号：JP2008166720A
公开(公告)日：2008-07-17
申请号：JP2007280282
申请日：2007-10-29
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： FUJITA HIROAKI , FUKAI HIROYUKI
IPC分类号： H05K3/46 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide a method of selectively applying electroless nickel and electroless gold plating on a fine pattern on a printed wiring board by efficiently removing inorganic filler material remaining on a front layer of an insulating layer after roughening, and controlling abnormal deposition outside of the pattern. SOLUTION: In a method of manufacturing a multilayer printed wiring board, electroless nickel plating and electroless gold plating are selectively applied on a copper pattern on a printed wiring board by: (a) a step of forming an insulating layer including inorganic filler material on an insulating substrate on which a first circuit layer is formed; (b) a step of forming a via hole on the insulating layer reaching the first circuit layer; (c) a step of roughening the front layer of the insulating layer by an oxidizing solution; (d) a step of immersing the front layer of the insulating layer in an alkaline solution of pH10 or more, the alkaline solution being alkali metal hydroxide or alkaline earth metal hydroxide dissolved in water, and removing remaining inorganic filler material; and (e) a step of applying electroless plating on the front layer of the insulating layer and an inner wall of the via hole, and forming interlayer connection by a second circuit layer and the via hole. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：提供一种通过有效地去除残留在绝缘层的前层上的无机填充材料在粗糙化之后，在印刷线路板上的精细图案上选择性地施加化学镀镍和无电镀金的方法，并且控制图案外的异常沉积。解决方案：在制造多层印刷线路板的方法中，通过以下步骤，在印刷线路板上的铜图案上选择性地施加化学镀镍和无电镀金：（a）形成包括无机填料的绝缘层的步骤在形成有第一电路层的绝缘基板上的材料; （b）在到达第一电路层的绝缘层上形成通孔的步骤; （c）通过氧化溶液使绝缘层的前层粗糙化的工序; （d）将绝缘层的前层浸渍在pH10以上的碱性溶液中，碱溶液为碱金属氢氧化物或碱土金属氢氧化物溶解于水中，除去剩余的无机填充材料的工序; 和（e）在绝缘层的前层和通孔的内壁上施加无电解电镀的步骤，并且通过第二电路层和通孔形成层间连接。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2011021205A Insulating resin composition for printed wiring board and application thereof 审中-公开
标题翻译：印刷线路板绝缘树脂组合物及其应用
公开(公告)号：JP2011021205A
公开(公告)日：2011-02-03
申请号：JP2010237879
申请日：2010-10-22
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： FUJITA HIROAKI , KUMAKURA YOSHITOSHI , HIROZAWA KIYOSHI , EDA TETSUO , KANEKO YOICHI
IPC分类号： C08L63/00 , C08G59/62 , C08J5/18 , C08K5/13 , C08L29/14 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a halogen-free insulating resin sheet excellent in copper foil peeling strength and chemical resistance. SOLUTION: An insulating resin composition is an epoxy resin composition containing a polyphenolic antioxidant. The epoxy resin composition is a resin composition including an epoxy resin, phenolic hardener, compound having a dihydrobenzoxazine ring, polyvinyl butyral resin and inorganic filler. A method of manufacturing a printed wiring board using the epoxy resin composition is described. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供优异的铜箔剥离强度和耐化学性的无卤绝缘树脂片。解决方案：绝缘树脂组合物是含有多酚抗氧化剂的环氧树脂组合物。环氧树脂组合物是包含环氧树脂，酚类固化剂，具有二氢苯并恶嗪环的化合物，聚乙烯醇缩丁醛树脂和无机填料的树脂组合物。对使用该环氧树脂组合物的印刷电路板的制造方法进行说明。版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2009272532A Insulating resin adhesion sheet and multilayer printed wiring board 有权
标题翻译：绝缘树脂粘合片和多层印刷接线板
公开(公告)号：JP2009272532A
公开(公告)日：2009-11-19
申请号：JP2008123398
申请日：2008-05-09
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： FUJITA HIROAKI , FUKAI HIROYUKI
IPC分类号： H05K1/03 , B32B15/092 , B32B27/38
摘要： PROBLEM TO BE SOLVED: To provide an insulating resin adhesion sheet for a multilayer printed wiring board which secure the high reliability of connection by low-thermal expansion and attains high workability by having flexibility, and to provide the multilayer printed wiring board using the insulating resin adhesion sheet.
SOLUTION: The present invention relates to the insulating resin adhesion sheet in which a half-cured film which is composed of a half-cured resin composition is formed on a carrier film, the resin composition contains an epoxy resin, a curing agent, an inorganic filler, a rubber constituent, and a silica fiber, the rubber constituent is a linear rubber constituent with weight-average molecular weight of 300,000 or larger, the average fiber length of the silica fiber is 3 to 10 μm, the average fiber diameter of the silica fiber is 0.1 to 1.0 μm, and the content of the silica fiber is 0.5 to 5.0 mass% of the resin composition. Moreover, the present invention relates to the multilayer printed wiring board using the Insulating resin adhesion sheet.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于多层印刷线路板的绝缘树脂粘合片，其通过低热膨胀确保连接的高可靠性并且通过具有柔性获得高的可加工性，并且提供使用绝缘树脂粘合片。解决方案：本发明涉及在载体膜上形成由半固化树脂组合物构成的半固化膜的绝缘树脂粘合片，该树脂组合物含有环氧树脂，固化剂无机填充剂，橡胶成分和二氧化硅纤维，橡胶成分是重均分子量为30万以上的线状橡胶成分，二氧化硅纤维的平均纤维长度为3〜10μm，平均纤维二氧化硅纤维的直径为0.1〜1.0μm，二氧化硅纤维的含量为树脂组合物的0.5〜5.0质量％。此外，本发明涉及使用绝缘树脂粘合片的多层印刷线路板。版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2007299875A Manufacturing method of multilayer printed wiring board 审中-公开
标题翻译：多层印刷线路板的制造方法
公开(公告)号：JP2007299875A
公开(公告)日：2007-11-15
申请号：JP2006125600
申请日：2006-04-28
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： FUJITA HIROAKI , FUKAI HIROYUKI , KUMAKURA YOSHITOSHI
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer printed wiring board which improves deterioration of adhesion of an insulating layer and plated copper and deterioration of heat resistance.
SOLUTION: The manufacturing method of the multilayer printed wiring board has in this order (a) a process for forming the insulating layer 2 on an insulating substrate where a first circuit layer 1 is formed; (b) a process for forming via holes 4 in the insulating layer 2; (c) a process for roughening a surface of the insulating layer by oxidizing solution; (d) a process for removing inorganic filler remaining on the surface of the insulating layer; and (e) a process for performing copper plating on the surface of the insulating layer and inner walls of the via holes, and forming a second circuit layer and interlayer connection by the via holes.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种改善绝缘层和镀铜的附着力劣化以及耐热性劣化的多层印刷线路板的制造方法。解决方案：多层印刷线路板的制造方法按照以下顺序（a）在形成有第一电路层1的绝缘基板上形成绝缘层2的工序; （b）在绝缘层2中形成通孔4的工序; （c）通过氧化溶液使绝缘层的表面粗糙化的方法; （d）除去绝缘层表面残留的无机填料的方法; 以及（e）在所述绝缘层的表面和所述通孔的内壁上进行镀铜的工序，形成第二电路层和通过所述通孔的层间连接。版权所有（C）2008，JPO＆INPIT

10. 发明专利

JP2006315391A Laminated plate and printed circuit board using the same 审中-公开
标题翻译：层压板和印刷电路板使用相同
公开(公告)号：JP2006315391A
公开(公告)日：2006-11-24
申请号：JP2005327915
申请日：2005-11-11
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： FUJITA HIROAKI , KUMAKURA YOSHITOSHI , FUKAI HIROYUKI
IPC分类号： B32B27/08 , B32B15/08 , H05K1/03 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a (multilayer) printed circuit board excellent in connection reliability hardly causing cracks such as corner cracks in through-holes and solder cracks after the heat cycle test, and to provide a (metal-clad) laminate for use in manufacturing the printed circuit board.
SOLUTION: The laminate comprises an insulating substrate having a flexural modulus at room temperature of ≥24.0 GPa and a thermal expansion coefficient at ≤150°C of ≤20 ppm/°C in the horizontal direction and ≤60 ppm/°C in the vertical direction, and insulating resin composition layers formed on both surfaces of the insulating substrate each having 10-200 μm thickness and ≤3.0 GPa elastic modulus and ≥8.0% tensile elongation at room temperature. The printed circuit board uses this laminate.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种连接可靠性优异的（多层）印刷电路板，其在热循环试验后几乎不引起通孔中的拐角裂纹和焊料裂纹等裂纹，并且提供（金属包层）用于制造印刷电路板的层压板。解决方案：层压板包括在室温下的挠曲模量≥24.0GPa和≤150℃的热膨胀系数在水平方向上≤20ppm/℃的绝热基材和≤60ppm/℃ 在绝缘基板的两面形成绝缘树脂组合物层，绝缘基板的厚度为10-200μm，室温下为≥3.0GPa的弹性模量和≥8.0％的拉伸伸长率。印刷电路板使用这种层压板。版权所有（C）2007，JPO＆INPIT

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