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1. 发明专利

JP2006018975A Transfer printing machine and transfer printing method 有权
标题翻译：转印机和转印打印方法
公开(公告)号：JP2006018975A
公开(公告)日：2006-01-19
申请号：JP2004198414
申请日：2004-07-05
申请人： Hitachi Cable Ltd , Hitachi Ltd , Kawamura Seisakusho:Kk , 日立電線株式会社 , 株式会社日立製作所 , 株式会社河村製作所
发明人： USAMI KINICHI , SASAKI HIDEKI , OGINO MASAHIKO , KITANO NOBUAKI
IPC分类号： G11B7/26
摘要： PROBLEM TO BE SOLVED: To provide a transfer printing machine and a transfer printing method, which are simple and entrains no air bubble.
SOLUTION: In the transfer printing machine in which a transfer printing plate the surface of which has fine grooves of recessions and protrusions is attached to/separated from a member to be printed so that the grooves of recessions and protrusions are transferred to the member to be printed, the transferring is performed by the touching in the state that the transfer printing member 21 is downwardly bent from its center when it is touched, and by changing the shape of the transfer printing plate so as to be separated from the member 22 to be printed more than the surroundings of the transfer printing member 21 when it is separated.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供简单且不含气泡的转印印刷机和转印印刷方法。解决方案：在转印印刷机中，其转印印版的表面具有细凹槽和突出的凹槽，其被附着到待印刷的部件上/从待印刷的部件上分离，使得凹陷和突起的凹槽转移到要打印的构件，在被接触时在转印部件21从其中心向下弯曲的状态下通过触摸进行转印，并且通过改变转印板的形状以与构件分离 22被分离时要被打印得比转印部件21的周围多。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2006018977A Mold for mounting transfer printing plate and transfer printing method 审中-公开
标题翻译：用于安装转印板和转印打印方法的模具
公开(公告)号：JP2006018977A
公开(公告)日：2006-01-19
申请号：JP2004198431
申请日：2004-07-05
申请人： Hitachi Cable Ltd , Hitachi Ltd , Kawamura Seisakusho:Kk , Onuki Kogyosho:Kk , 日立電線株式会社 , 株式会社大貫工業所 , 株式会社日立製作所 , 株式会社河村製作所
发明人： USAMI KINICHI , SASAKI HIDEKI , ONUKI HIROTO , ONUKI HIDETO , HAYASHIDA TSUTOMU , OGINO MASAHIKO , KITANO NOBUAKI
IPC分类号： G11B7/26
摘要： PROBLEM TO BE SOLVED: To provide a mold for mounting a transfer printing plate which is miniaturized and simple, has a short tact time as well as a high precision high positioning of the printing, and to provide a transfer printing method.
SOLUTION: In the mold for mounting the transfer printing plate for transferring the protruded and recessed shape of the transfer printing plate to a member to be printed, by pressing under vacuum the transfer printing plate 24 which has the recesses and protrusions against the member 25 to be printed, when an upper mold 16 and a lower mold 18 thereof are put together, a vacuum depressurization chamber 19 is formed in the upper mold 16 or the lower mold 18 for holding either the transfer printing plate 24 or the member 25 to be printed.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种小型化和简单的用于安装转印板的模具，具有短的打印时间以及高精度的高定位印刷，并提供转印印刷方法。解决方案：在用于安装用于将转印板的突出和凹入形状转印到待印刷的构件的转印板的模具中，通过在真空下压制，将具有凹陷和突起的转印印版24抵靠要打印的构件25，当其上模具16和下模具18放在一起时，在上模具16或下模具18中形成真空减压室19，用于保持转印板24或构件25 要打印。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2005150535A Electronic component 审中-公开
标题翻译：电子元件
公开(公告)号：JP2005150535A
公开(公告)日：2005-06-09
申请号：JP2003388222
申请日：2003-11-18
申请人： Hitachi Cable Ltd , Hitachi Ltd , 日立電線株式会社 , 株式会社日立製作所
发明人： OGINO MASAHIKO , SATO TOSHIYA , HOJO BOURO , MOTOWAKI NARIHISA , AMO SATORU
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide an electronic component without the missing or failure of plating wiring by surely forming a power feeding film for electric plating even when wiring patterns are densely arranged with the large number of layers. SOLUTION: This electronic component with the structure of lamination is configured of a substrate 1, wiring layers, insulating layers 9, 12, 15 and 18 and external connecting terminals, wherein the wiring layers and the insulating layers are alternately formed on the substrate 1, and only a portion of the insulating layer terminals 9, 12, 15 and 18 is formed with at least one inclined structure for electric plating power supply. The number of the wiring layers and the insulating layers is piled up, and even when the ends of the insulating layers are shaped so as to be steep, a power supply line can be secured. As a result, even when the number of lamination is increased, the wiring layers can be surely formed, and the electronic component without wiring missing can be provided. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：即使当布线图案以大量层压密布置时，通过确保形成用于电镀的供电膜来提供电子部件而不会出现电镀布线的缺失或故障。解决方案：具有层叠结构的电子部件由基板1，布线层，绝缘层9,12,15和18以及外部连接端子构成，其中布线层和绝缘层交替地形成在基板1，并且只有一部分绝缘层端子9,12,15和18形成有用于电镀电源的至少一个倾斜结构。堆叠布线层和绝缘层的数量，即使当绝缘层的端部成形为陡峭时，也可以确保电源线。结果，即使当层叠数量增加时，可以可靠地形成布线层，并且可以提供没有布线的电子部件。版权所有（C）2005，JPO＆NCIPI

4. 发明专利

JP2006015709A Transfer printing plate retaining structure 有权
标题翻译：转印印版保留结构
公开(公告)号：JP2006015709A
公开(公告)日：2006-01-19
申请号：JP2004198430
申请日：2004-07-05
申请人： Hitachi Cable Ltd , Hitachi Ltd , Kawamura Seisakusho:Kk , Onuki Kogyosho:Kk , 日立電線株式会社 , 株式会社大貫工業所 , 株式会社日立製作所 , 株式会社河村製作所
发明人： ONUKI HIROTO , ONUKI HIDETO , HAYASHIDA TSUTOMU , USAMI KINICHI , SASAKI HIDEKI , OGINO MASAHIKO , KITANO NOBUAKI
IPC分类号： B29C33/30 , B29C59/02 , B29K83/00
摘要： PROBLEM TO BE SOLVED: To extend the life span of a die by keeping the die and the body to be printed parallel and inhibiting failure of the die.
SOLUTION: A transfer printing plate 1 which consists of materials such as quartz, silicon or a resin and in which rugged grooves are formed is retained by an outer frame member 7. The transfer printing surface 1 is made to be retained by the outer frame member 7 through a stress impact-absorbing material 9 in a transfer printing plate retaining structure 5 for pressing the transfer printing plate 1 to a body 3 to be printed 3 to print.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：通过将模具和主体保持平行并抑制模具的故障来延长模具的使用寿命。解决方案：由诸如石英，硅或树脂的材料组成并且其中形成有凹凸形状的转印印版1由外框构件7保持。转印印刷表面1被保持在外框构件7通过转印印版保持结构5中的应力冲击吸收材料9，用于将转印板1压印到待印刷的主体3上以进行印刷。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2006319377A Semiconductor device having ball grid array structure 有权
标题翻译：具有球栅阵列结构的半导体器件
公开(公告)号：JP2006319377A
公开(公告)日：2006-11-24
申请号：JP2006238517
申请日：2006-09-04
申请人： Hitachi Cable Ltd , Renesas Technology Corp , 日立電線株式会社 , 株式会社ルネサステクノロジ
发明人： NAGAI AKIRA , EGUCHI KUNIYUKI , OGINO MASAHIKO , SEGAWA MASANORI , ISHII TOSHIAKI , TSUYUNO ENJIYOU , KOKADO HIROYOSHI , HATTORI RIE , MORISHIMA SHIN , ANJO ICHIRO , TSUBOSAKI KUNIHIRO , MIYAZAKI CHUICHI , KITANO MAKOTO , ONDA MAMORU , OKABE NORIO
IPC分类号： H01L23/12
CPC分类号： H01L24/50 , H01L2924/14 , H01L2924/351 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device having superior connection reliability by possessing a buffering member that absorbs the difference in thermal expansion coefficients between a mounting substrate and the semiconductor chip, even when an organic material is used for the mounting substrate, in a semiconductor package structure.
SOLUTION: The semiconductor device uses a film material for the buffering member for relaxing the thermal stress caused by the expansion coefficient difference between the semiconductor chip and the mounting substrate. A wiring layer is connected to the pads of the semiconductor chip and to external terminals. An adhesive film has an elastic modulus, at a room temperature, of 4,000 MPa or smaller and an elastic modulus at a temperature range of 200-250°C of 1 MPa or larger, where the elastic modulus at the reflow temperature range (200-250°C) of the film material is 1 MPa or larger.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：即使当将有机材料用于安装基板时，通过具有吸收安装基板和半导体芯片之间的热膨胀系数的差异的缓冲部件来提供具有优异的连接可靠性的半导体器件，在半导体封装结构中。解决方案：半导体器件使用用于缓冲部件的膜材料来缓和由半导体芯片和安装基板之间的膨胀系数差引起的热应力。布线层连接到半导体芯片的焊盘和外部端子。粘合膜在室温下的弹性模量为4000MPa以下，在200〜250℃的温度范围内的弹性模量为1MPa以上，其中回流温度范围（200〜 250℃）为1MPa以上。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2011140225A Pattern forming method and mold 有权
标题翻译：图案形成方法和模型
公开(公告)号：JP2011140225A
公开(公告)日：2011-07-21
申请号：JP2011017380
申请日：2011-01-31
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： OGINO MASAHIKO , MIYAUCHI AKIHIRO , ANDO TAKUJI , HAGINOYA CHISEKI , KOMORIYA SUSUMU , HAYATA YASUNARI , KATAGIRI SOUICHI , OTA HIROYA , NAKAYAMA YOSHINORI
IPC分类号： B29C59/02 , G11B5/84 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To solve problems that in a nano-imprint method, accurate alignment between a substrate with an opening formed in the central part such as a disk substrate and a mold is difficult, and alignment accuracy is deteriorated by alignment mark damage caused by mechanical contact.
SOLUTION: In the mold with the pattern formed by a fine uneven shape, alignment marks for determining the relative positional relationship between the substrate and the mold are attached in the shape of a concentric circle to at least two spots. From the positional information or the shape on/of each mark, a broken mark is identified and excluded, and the alignment between the mold and the substrate coated with a resin film is carried out.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题为了解决在纳米压印方法中难以在诸如盘基板和模具的中心部分形成的开口的基板之间精确对准的问题，并且对准精度由于对准而劣化机械接触引起的标记损坏。解决方案：在具有由细微不均匀形状形成的图案的模具中，用于确定基板和模具之间的相对位置关系的对准标记以同心圆的形状附接至至少两个点。根据每个标记的位置信息或形状，识别和排除断痕，并且进行涂覆有树脂膜的模具和基板之间的对准。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2009187025A Functional substrate having fine columnar roprojection group, and manufacturing method thereof 有权
标题翻译：具有精细压延组的功能基板及其制造方法
公开(公告)号：JP2009187025A
公开(公告)日：2009-08-20
申请号：JP2009096876
申请日：2009-04-13
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： MIYAUCHI AKIHIRO , KUWABARA KOSUKE , OGINO MASAHIKO , YOSHIDA HIROSHI , ANDO TAKUJI
IPC分类号： G02B1/02 , A45B25/18 , B01L3/00 , B81B1/00 , G01N27/42 , G01N27/447 , G01N37/00 , G02B1/11 , G02B5/18 , G02B5/28 , G02B6/12 , G02B6/122 , G02B6/43
CPC分类号： G02B1/118 , A45B25/18 , B01L3/502746 , B01L3/502761 , B01L2200/10 , B01L2200/12 , B01L2300/0636 , B01L2300/0877 , B01L2300/166 , B01L2400/086 , B81B1/00 , B81B2203/0361 , B81B2207/056 , B82Y20/00 , C12M25/00 , C12M25/06 , G01N27/423 , G02B1/005 , G02B1/111 , G02B5/289 , G02B6/12004 , G02B6/1225 , G02B6/42 , G02B6/43 , G02B2006/12147 , G02B2006/12166
摘要： PROBLEM TO BE SOLVED: To provide a functional substrate having a fine columnar projection group formed with an organic polymer for controlling a position, a bottom area, and a height. SOLUTION: The functional substrate having a fine columnar projection group includes: a first base member made of the organic polymer: and the fine columnar projection group formed with the organic polymer and extended from the first base member, wherein the equivalent diameter of the fine columnar projection group is 10 nm to 500 μm and the height is 50 nm to 5000 μm, and the ratio (H/D) of the equivalent diameter (D) to the height (H) of the fine columnar projection group is 4 or more. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有由有机聚合物形成的微细柱状突起组的功能性基材，用于控制位置，底部区域和高度。解决方案：具有细柱状突起组的功能基材包括：由有机聚合物制成的第一基材和由第一基材延伸的有机聚合物形成的微细柱状突起组，其中，细柱状投影组为10nm〜500μm，高度为50nm〜5000μm，等效直径（D）与微细柱状投影组的高度（H）的比（H / D）为4 或者更多。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2007219033A Site-selectively modified microstructure body and manufacturing method thereof 有权
标题翻译：网站 - 选择性修改的微结构体及其制造方法
公开(公告)号：JP2007219033A
公开(公告)日：2007-08-30
申请号：JP2006037362
申请日：2006-02-15
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： MURAO KENJI , KUWABARA KOSUKE , OGINO MASAHIKO
IPC分类号： G02B1/02 , G02B1/04
CPC分类号： B81C1/0046 , B29C43/021 , B29C2043/025 , B81B2201/0214 , B81B2203/0361 , B81C2201/0153 , B82Y10/00 , B82Y15/00 , B82Y40/00 , G03F7/0002
摘要： PROBLEM TO BE SOLVED: To provide a method capable of selectively facilitating physical and chemical modification on specific sites only of recessed parts or protruded parts among structures having ruggedness manufactured by a nano-imprint technology. SOLUTION: An original board having a ruggedness is pressed against a polymer substrate composed of two layers having at least chemical compositions different from each other and, thereby, a second layer from the surface which is hidden by the uppermost surface layer heretofore is visualized as a cross-section of a pillar part. The site-specific chemical modification of a pillar can be performed by forming the second layer with a chemically desirable composition or by chemically modifying a cross-section of the second layer after formation of the pillar. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够选择性地促进仅在通过纳米压印技术制造的具有坚固性的结构中的凹部或突出部分的特定部位进行物理和化学改性的方法。解决方案：具有坚固性的原板被压在由至少具有彼此不同的化学组成的两层组成的聚合物基材上，从而从迄今为止被最上表面层隐藏的表面的第二层是可视化为柱部分的横截面。可以通过用化学上希望的组合物形成第二层或通过在柱形成之后化学改变第二层的横截面来进行柱的位点特异性化学修饰。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2007216493A Minute structure, mold for transferring minute structure, mold for replica, and its manufacturing method 有权
标题翻译：分钟结构，转移分钟结构模具，替代模具及其制造方法
公开(公告)号：JP2007216493A
公开(公告)日：2007-08-30
申请号：JP2006039205
申请日：2006-02-16
申请人： Hitachi Ltd , Ibaraki Univ , 国立大学法人茨城大学 , 株式会社日立製作所
发明人： OGINO MASAHIKO , OHASHI TAKEYA , YOSHIDA HIROSHI , ONO KATSUMICHI , KUBOTA TOSHIO , MORIKAWA ATSUSHI , NAGAYAMA DAIGO
IPC分类号： B29C59/02 , B29C39/02 , B82B1/00 , B82B3/00 , C08F38/00 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To duplicate a plurality of molds in each of which a minute structure is formed accurately in a nano-imprint method of a pattern transfer technique for forming a structure having a minute shape. SOLUTION: In the minute structure formed by pushing a mold with a minute uneven pattern formed on the surface to a transcribed body and a mold for transferring a minute structure for forming the minute uneven pattern on the surface of the transcribed body, the minute structure and the mold for transferring the minute structure duplicate the minute unevenness of the mold accurately by reacting a monomer or an oligomer having a terminal reactive functional group which is packed in the minute uneven shape of a master mold. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：复制在形成具有微小形状的结构的图案转印技术的纳米压印方法中准确地形成微细结构的多个模具。解决方案：在通过将形成在表面上的微小凹凸图案的模具推到转录体上的微小结构中，以及用于在转录体的表面上转印用于形成微小凹凸图案的微小结构的模具，通过使具有末端反应性官能团的单体或低聚物以主模具的微小不均匀形状填充的单体或低聚物反应，精确地传递微结构的模具与模具的微小凹凸精确地复制。版权所有（C）2007，JPO＆INPIT

10. 发明专利

JP2007190734A Pattern forming method and mold 有权
标题翻译：图案形成方法和模型
公开(公告)号：JP2007190734A
公开(公告)日：2007-08-02
申请号：JP2006009369
申请日：2006-01-18
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： OGINO MASAHIKO , MIYAUCHI AKIHIRO , ANDO TAKUJI , HAGINOYA CHISEKI , KOMORIYA SUSUMU , HAYATA YASUNARI , KATAGIRI SOUICHI , OTA HIROYA , NAKAYAMA YOSHINORI
IPC分类号： B29C59/02 , B29C33/38 , B29C33/42 , B29L17/00 , B81C99/00 , B82B3/00 , G11B5/84 , H01L21/027
CPC分类号： H01L21/76838 , B82Y10/00 , B82Y40/00 , G03F7/0002 , G03F9/7076 , G11B5/855 , H01L23/544 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To make the accurate alignment between a disk substrate with a hole formed in the central part of the substrate and a mold possible in forming the structure of a fine pattern using a nano-imprint technique. SOLUTION: In the mold with the pattern formed by a fine uneven shape, alignment marks for determining the relative positional relationship between the substrate and the mold are attached in the shape of a concentric circle to at least two spots. From the positional information or the shape on/of each mark, a broken mark is identified and excluded, and the alignment between the mold and the substrate coated with a resin film is carried out. COPYRIGHT: (C)2007,JPO&INPIT

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