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1. 发明专利

JP2013039603A Method of manufacturing molten solder-plated twisted wire 有权
标题翻译：制造电焊丝双绞线的方法
公开(公告)号：JP2013039603A
公开(公告)日：2013-02-28
申请号：JP2011178648
申请日：2011-08-17
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： WASHIMI TORU , AOYAMA MASAYOSHI , KURODA HIROMITSU , SAGAWA HIDEYUKI , FUJITO KEISUKE , MASUI SHINICHI
IPC分类号： B23K35/40 , B21F7/00 , B23K1/00 , B23K1/20 , B23K35/14 , B23K35/30 , B23K101/38 , B23K103/12 , C22C9/00 , C22F1/00 , C22F1/08 , C23C2/08 , C23C2/38
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a molten solder-plated twisted wire capable of performing immersion into a solder plating tank in a shorter time when manufacturing the soft copper twisted wire, and further increasing the speed of a plating line as compared with the case that oxygen-free copper (OFC) is used.SOLUTION: The method of manufacturing the molten solder-plated twisted wire includes: a wire drawing process A of applying a wire drawing process to a dilute copper alloy material containing copper containing inevitable impurities, oxygen of a quantity exceeding 2 mass ppm, and at least one kind of additive element out of Mg, Zr, Nb, Ca, V, N, Mn, Ti and Cr to manufacture a drawn wire 2a; a wire twisting process A of preparing a plurality of the drawn wires 2a to manufacture a twisted wire 9 by intertwisting them; and a molten solder plating process C of forming a plated layer on each surface of the drawn wires 2a by immersing the twisted wire 9 in a molten solder plating tank where each drawn wire 2a is transformed to a soft copper wire by the quantity of heat of the molten solder plating process C.
摘要翻译：要解决的问题：提供一种在制造软铜绞线时能够在更短的时间内进行浸渍到焊料镀槽中的熔融焊料电镀绞线的制造方法，并且进一步提高电镀速度与使用无氧铜（OFC）的情况相比。解决方案：制造熔融焊料电镀绞合线的方法包括：拉丝工艺A，其对含有不可避免的杂质的铜，超过2质量ppm的氧的稀铜铜合金材料施加拉丝工艺，以及Mg，Zr，Nb，Ca，V，N，Mn，Ti和Cr中的至少一种添加元素以制造拉丝2a; 制造多根拉丝2a的线捻制工艺A，通过缠绕它们来制造绞线9; 以及熔融焊锡镀覆工艺C，其通过将绞合线9浸入熔融焊料镀槽中，在每个拉丝2a被转换成软铜丝的情况下，将拉丝2a的每一个表面上形成镀层，熔融焊接电镀工艺C.版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2013023736A Soft dilute copper alloy wire, soft dilute copper alloy sheet and soft dilute copper alloy twisted wire 有权
标题翻译：软质稀土铜合金线，软质合金铜合金板和软质稀土铜合金线
公开(公告)号：JP2013023736A
公开(公告)日：2013-02-04
申请号：JP2011160356
申请日：2011-07-21
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： SAGAWA HIDEYUKI , AOYAMA MASAYOSHI , KURODA HIROMITSU , WASHIMI TORU , FUJITO KEISUKE
IPC分类号： C22C9/00 , C22C9/05 , C22C9/06
CPC分类号： H01B1/026 , H01L24/05 , H01L24/43 , H01L24/45 , H01L24/46 , H01L24/48 , H01L2224/05624 , H01L2224/4321 , H01L2224/43848 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/48824 , H01L2924/00011 , H01L2924/00015 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/10253 , Y10T428/12431 , H01L2224/45664 , H01L2224/45618 , H01L2224/45655 , H01L2224/45644 , H01L2224/45669 , H01L2224/45639 , H01L2924/01022 , H01L2924/0104 , H01L2924/01041 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01024 , H01L2924/00014 , H01L2924/01204 , H01L2924/01205 , H01L2924/20755 , H01L2224/45124 , H01L2924/013 , H01L2924/00 , H01L2924/2011 , H01L2924/01006 , H01L2924/01004 , H01L2924/01033 , H01L2924/01008 , H01L2924/01016
摘要： PROBLEM TO BE SOLVED: To provide a soft dilute copper alloy wire, a soft dilute copper alloy sheet, and a soft dilute copper alloy twisted wire which have high electrical conductivity, and high tensile strength and elongation despite soft material, and further have low hardness.SOLUTION: A soft dilute copper alloy material includes one or more kinds of addition elements selected from the group comprising Ti, Mg, Zr, Nb, Ca, V, Ni, Mn and Cr, with the balance comprising copper. The soft dilute copper alloy wire, the soft dilute copper alloy sheet or the soft dilute copper alloy twisted wire is formed from the soft dilute copper alloy material and characterized in that the average crystal grain size in the region from the surface of the soft dilute copper alloy wire or sheet toward inside to a depth of at least 20% of the wire diameter or the sheet thickness is 20 μm and less.
摘要翻译：要解决的问题：提供软质稀铜合金丝，柔软的稀铜合金片和软的稀铜合金绞线，其具有高导电性，并且尽管软材料具有高拉伸强度和伸长率，硬度低。解决方案：软的稀铜合金材料包括选自由Ti，Mg，Zr，Nb，Ca，V，Ni，Mn和Cr组成的组中的一种或多种添加元素，余量包含铜。软的稀铜合金丝，软的稀铜合金片或软的稀铜合金绞线由软的稀铜合金材料形成，其特征在于从软的稀铜的表面区域的平均晶粒尺寸合金线或片材向内侧至至少线材直径的20％或板厚度的深度为20μm以下。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2013004406A Manufacturing method of wire with terminal 审中-公开
标题翻译：端子线的制造方法
公开(公告)号：JP2013004406A
公开(公告)日：2013-01-07
申请号：JP2011136370
申请日：2011-06-20
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： KOYAMA HIROSHI , SAGAWA HIDEYUKI , HORIKOSHI TOSHIYUKI
IPC分类号： H01R43/02 , H01R4/02
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a wire with a terminal which can prevent a conductor consisting of stranded wires from being unstranded, and can ensure high connection strength stably and easily while reducing stress on a conductor portion.SOLUTION: A method of manufacturing a wire with a terminal by connecting a wire 10 and a terminal 22 having a connected part for connecting the conductor 12 of the wire 10 by ultrasonic-welding includes a step for mounting a terminal 22 having a planar connected part on an anvil 20 provided to an ultrasonic welder, a step for sandwiching the conductor 12 by a set of retaining jigs 23, 23 by disposing the set of retaining jigs 23, 23 on both sides of the conductor 12 so that at least one of the jigs abuts against the conductor 12, and a step for performing ultrasonic-welding to the terminal 22 while pressing the conductor 12 from a direction facing the terminal 22 between the set of retaining jigs 23, 23.
摘要翻译：要解决的问题：提供一种制造具有端子的导线的方法，所述端子可以防止由多股线组成的导体不被绞合，并且可以在减小导体部分上的应力的同时确保高连接强度，并且可以确保高连接强度。解决方案：通过连接导线10和具有用于通过超声波焊接连接导线10的导体12的连接部分的端子22来制造具有端子的导线的方法包括用于安装端子22的步骤，设置在超声波焊接机上的砧座20上的平面连接部件，通过一组保持夹具23,23夹持导体12的步骤，通过在导体12的两侧设置一组保持夹具23,23，使得至少一个夹具抵靠在导体12上，以及一个步骤，用于在端子22上从一组保持夹具23,23之间的端子22的方向上按压导体12进行超声波焊接。
版权所有（ C）2013，JPO＆INPIT

4. 发明专利

JP2012124025A Plated copper wire and manufacturing method thereof 审中-公开
标题翻译：镀铜线及其制造方法
公开(公告)号：JP2012124025A
公开(公告)日：2012-06-28
申请号：JP2010273811
申请日：2010-12-08
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： SAGAWA HIDEYUKI
IPC分类号： H01B5/02 , C23C28/02 , H01B13/00
摘要： PROBLEM TO BE SOLVED: To provide a plated copper wire which further suppresses growth of an intermetallic compound layer high in brittleness between Sn-based plating and a conductor than before while suppressing reduction in conductivity of the conductor as much as possible, and prevents deterioration of bending resistance characteristics and bonding strength when soldered even held in an environment at a high temperature.SOLUTION: The plated copper wire has a copper-zinc alloy layer containing zinc dispersed in copper in the outer periphery of a core material containing copper as a main component, and is provided with a plating layer containing tin as the main component in the outer periphery of the copper-zinc alloy layer. The average concentration of zinc in the copper-zinc alloy layer is 35 mass% or more, and thickness of the copper-zinc alloy layer is 0.1 μm or more.
摘要翻译：要解决的问题：为了提供一种电镀铜线，其进一步抑制Sn系镀层与导体之间的脆性高的金属间化合物层的生长，同时尽可能地抑制导体的导电性降低，以及防止即使在高温环境中保持焊接时的耐弯曲特性和接合强度的劣化。解决方案：电镀铜线具有含铜分散在铜中的铜 - 锌合金层，其中铜以铜为主要成分的外围，并且设有以锡为主要成分的镀层铜 - 锌合金层的外周。铜 - 锌合金层中锌的平均浓度为35质量％以上，铜 - 锌合金层的厚度为0.1μm以上。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2012107340A Soft dilute copper alloy material, soft dilute copper alloy sheet, soft dilute copper alloy wire, soft dilute copper alloy stranded wire, and cable using the same 有权
标题翻译：软质稀土铜合金材料，软质稀土铜合金板，软质稀土铜合金线，软质稀土铜合金线，以及使用其的电缆
公开(公告)号：JP2012107340A
公开(公告)日：2012-06-07
申请号：JP2012010160
申请日：2012-01-20
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： WASHIMI TORU , AOYAMA MASAYOSHI , KURODA HIROMITSU , SAGAWA HIDEYUKI
IPC分类号： C22C9/00 , H01B1/02 , H01B5/02 , H01B5/08 , H01B7/04
摘要： PROBLEM TO BE SOLVED: To provide a soft dilute copper alloy material having high conductivity, capable of reducing half-softening temperature and having improved bending life in a soft copper material.SOLUTION: A soft dilute copper alloy wire includes 12 mass ppm or less of sulfur, >2 mass ppm of oxygen, 4-55 mass ppm of Ti, and the balance of copper. In the soft dilute copper alloy wire, an electrical conductivity is 98% IACS or more, a half-softening temperature is 148°C or below, and an average crystal grain size in a surface layer at least up to a depth of 50 μm from a surface is 20 μm or less.
摘要翻译：要解决的问题：提供一种具有高导电性的柔软的稀铜合金材料，其能够降低软化铜材料的半软化温度和改善弯曲寿命。解决方案：软的稀铜合金线包括12质量ppm或更少的硫，≥2质量ppm的氧，4-55质量ppm的Ti和余量的铜。在软质稀铜合金丝中，电导率为98％IACS以上，半软化温度为148℃以下，表面层的平均结晶粒径至少达到50μm以下的深度表面为20μm以下。版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP2011258468A Terminal, electric wire with terminal and method for producing the same 审中-公开
标题翻译：端子，具有端子的电线及其制造方法
公开(公告)号：JP2011258468A
公开(公告)日：2011-12-22
申请号：JP2010133251
申请日：2010-06-10
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： SAGAWA HIDEYUKI , TAKEHARA HIDEAKI
IPC分类号： H01R4/02 , H01R43/02
摘要： PROBLEM TO BE SOLVED: To provide a terminal and an electric wire with a terminal which are inexpensive and highly reliable in connection strength and connection resistance, and to provide a method for producing such an electric wire.SOLUTION: The terminal 4 is provided with a first connected portion 5 to be connected to equipment and a second connected portion 6 to be connected to a conductor 2 which constitutes an electric wire 1, the second connected portion 6 having a first connected surface to which a first conductor 2A is connected in the surface contact, and a second connected surface which is provided in extension from the first connected surface in a width direction of the first connected surface and to which a second conductor 2B is connected in the surface contact.
摘要翻译：要解决的问题：提供一种具有连接强度和连接电阻便宜且高可靠性的端子的端子和电线，并且提供一种用于制造这种电线的方法。解决方案：端子4设置有与设备连接的第一连接部分5和要连接到构成电线1的导体2的第二连接部分6，第二连接部分6具有第一连接在第一连接表面的宽度方向上从第一连接表面延伸设置的第二连接表面，并且第二导体2B在表面中连接到第一连接表面联系。版权所有（C）2012，JPO＆INPIT

7. 发明专利

JP2011179110A Soft-dilute-copper-alloy material, soft-dilute-copper-alloy wire, soft-dilute-copper-alloy sheet, soft-dilute-copper-alloy stranded wire, and cable, coaxial cable and composite cable using the same 有权
标题翻译：软 - 稀土 - 铜合金材料，软 - 稀土 - 铜合金线，软 - 铜 - 合金板，软 - 稀铝 - 铜合金线，以及电缆，同轴电缆和使用该电缆的复合电缆
公开(公告)号：JP2011179110A
公开(公告)日：2011-09-15
申请号：JP2010235269
申请日：2010-10-20
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： WASHIMI TORU , AOYAMA MASAYOSHI , KURODA HIROMITSU , SAGAWA HIDEYUKI
IPC分类号： C22C9/00 , C22F1/00 , C22F1/08 , H01B1/02 , H01B5/02 , H01B5/08 , H01B7/00 , H01B11/00 , H01B11/18
CPC分类号： C22C9/00 , B21C1/003 , C22C1/10 , C22F1/08 , H01B1/026
摘要： PROBLEM TO BE SOLVED: To provide a soft-dilute-copper-alloy material, a soft-dilute-copper-alloy wire, a soft-dilute-copper-alloy sheet, a soft-dilute -copper-alloy stranded wire, and a cable, a coaxial cable and a composite cable using the same.
SOLUTION: The soft-dilute-copper-alloy material contains: copper and additional elements selected from the group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Mn and Cr, and the balance of inevitable impurities. The soft-dilute-copper-alloy wire is characterized in that the average crystal grain size is 20 μm or less in the surface layer up to a depth of 50 μm from the surface.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供软 - 稀铜合金材料，软 - 稀铜合金线，软 - 稀铜合金板，软 - 稀 - 铜 - 合金绞线，以及电缆，同轴电缆和使用其的复合电缆。
解决方案：软 - 铜 - 铜合金材料包含：铜和选自Ti，Mg，Zr，Nb，Ca，V，Ni，Mn和Cr组成的组中的其他元素，余量为不可避免的杂质。软 - 铜 - 铜合金线的特征在于，表面层的平均晶粒尺寸为20μm以下，距离表面深度为50μm。版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2006334606A Brazing filler metal, composite material for brazing, and brazed product using them 审中-公开
标题翻译：搅拌填充金属，复合复合材料及其制造产品
公开(公告)号：JP2006334606A
公开(公告)日：2006-12-14
申请号：JP2005159171
申请日：2005-05-31
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： SAGAWA HIDEYUKI , KURODA HIROMITSU , KUROKI KAZUMA , AOYAMA MASAYOSHI , HORII FUMIO
IPC分类号： B23K35/30 , B23K35/14 , C22C19/05 , H01M8/04
CPC分类号： Y02E60/50
摘要： PROBLEM TO BE SOLVED: To provide a brazing filler metal having sufficient corrosion resistance and high temperature strength, to provide a composite material for brazing, and to provide a brazed product using them. SOLUTION: The brazing filler metal 10 is used for brazing the members to be brazed, and composed of an alloy containing Ti, Ni, Fe and Cr, wherein the ratio (W1/W2) between the weight W1 of the Ni component contained in the brazing filler metal 10 and the total W2 of the weight of the Ni component and the Ti component contained in the brazing filler metal, is 0.55 to 0.70. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供具有足够的耐腐蚀性和高温强度的钎料，以提供用于钎焊的复合材料，并提供使用它们的钎焊制品。解决方案：钎焊金属10用于钎焊待钎焊的构件，并且由含有Ti，Ni，Fe和Cr的合金构成，其中Ni组分的重量W1之间的比（W1 / W2）包含在钎料10中的Ni成分和包含在钎料中的Ti成分的重量的总W2为0.55〜0.70。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2005211931A Compound material for brazing, method for manufacturing the same, and brazed product using compound material for brazing 审中-公开
标题翻译：用于制造的复合材料，其制造方法和使用复合材料制成的BRAZED产品进行制动
公开(公告)号：JP2005211931A
公开(公告)日：2005-08-11
申请号：JP2004021622
申请日：2004-01-29
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： KUROKI KAZUMA , KURODA HIROMITSU , SAGAWA HIDEYUKI , SHIRAI SUKAKU
IPC分类号： B21B1/22 , B23K1/19 , B23K35/14 , B23K35/30 , B23K35/32 , B23K35/40 , B23K103/04
摘要： PROBLEM TO BE SOLVED: To achieve an improvement in press forming and working properties of a compound material for brazing by preventing the rapture of a brazing layer and the fracture of a base material.
SOLUTION: The compound material 1 for brazing is provided with the brazing layer 6 formed of two or more kinds or two or more layers of metallic layers on the surface of the base material 2, wherein cracks are preliminarily formed at fine intervals on the brazing layer 6.
COPYRIGHT: (C)2005,JPO&NCIPI

10. 发明专利

JP2005103610A Composite material for brazing and brazed product using the same 审中-公开
标题翻译：使用它的制动和制动产品的复合材料
公开(公告)号：JP2005103610A
公开(公告)日：2005-04-21
申请号：JP2003341047
申请日：2003-09-30
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： SAGAWA HIDEYUKI , KURODA HIROMITSU , KUROKI KAZUMA , SHIRAI SUKAKU
IPC分类号： B23K35/14 , B23K35/30 , C22C19/03
摘要： PROBLEM TO BE SOLVED: To provide a composite material for brazing having satisfactory brazing properties and also having satisfactory heat resistance and corrosion resistance in brazed joined parts, and to provide a brazed product having satisfactory reliability in brazed joined parts with low manufacturing cost.
SOLUTION: In the composite material 10 for brazing, the members to be brazed are subjected to brazing. The surface of a base material 11 composed of an Ni-containing alloy is integrally provided with brazing layers 15 each obtained by superimposing an Ni or Ni alloy layer 13 and a Ti or Ti alloy layer 12. The ratio W1/W2 between the weight W1 of the Ni component and the total weight W2 of the Ni component and the Ti component in each brazing layer 15 is 0.58 to 0.64.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种钎焊复合材料，其钎焊性能良好，并且在钎焊接合部件中具有令人满意的耐热性和耐腐蚀性，并且在制造成本低的钎焊接合部件中提供具有令人满意的可靠性的钎焊制品。解决方案：在用于钎焊的复合材料10中，待钎焊的构件进行钎焊。由含Ni合金构成的基材11的表面一体地设置有通过叠加Ni或Ni合金层13和Ti或Ti合金层12而获得的钎焊层15.比重W1 / W2 的Ni成分和每个钎焊层15中的Ti成分的总重量W2为0.58〜0.64。版权所有（C）2005，JPO＆NCIPI

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