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    • 7. 发明专利
    • WORKING FOR WAFER
    • JPH04164534A
    • 1992-06-10
    • JP29012590
    • 1990-10-26
    • HITACHI CABLE
    • YOSHIOKA SHUICHINAITO YOSHIAKITERUNUMA TAKAOSEKIGUCHI AKIRATOMITA SHOGO
    • B23Q1/00B23Q1/56B28D5/02B28D7/04H01L21/304
    • PURPOSE:To completely automate working for a wafer by driving a motor for feeding a working table in the vertical direction by a previously programmed pulse quantity, and controlling the feeding quantity and feed speed in the vertical direction of the working table. CONSTITUTION:A working table 4 on which a wafer is placed is positioned in the x-axis and y-axis directions in a horizontal plane by the horizontal direction pulse motors 5 and 6, and a predetermined working point on the wafer surface is set directly under a horn. Then, the rising quantity of the working table 4 is controlled by applying a prescribed quantity of pulses to the vertical direction pulse motor 7, and a round groove is machined on the water surface by operating an ultrasonic working machine 10 which is constituted of a vibrator element 1, cone 2, horn 3, etc. The revolution angle, angular speed, etc., of each pulse motor 5, 6, 7, etc., are previously programmed through the conversion to the pulse quantity, repetitive pulse frequency, etc., by a controller. Since the revolution angle of each pulse motor is controlled by the preciously programmed pulse quantity, the working on the wafer surface can be automated.