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    • 2. 发明专利
    • SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
    • JPS61294682A
    • 1986-12-25
    • JP13416085
    • 1985-06-21
    • HITACHI LTDHITACHI MICROCUMPUTER ENG
    • UCHIBORI KIYOBUMINAKAMURA HIDEAKITACHIMORI HIROSHI
    • G11C11/34
    • PURPOSE:To reduce noises of a RAM and to speed up its operation by putting a voltage detecting circuit in operation with a change detection pulse for an address signal and providing a couple of MOSFETs which charge the output terminal of a buffer circuit to an intermediate level by the output of the voltage detecting circuit. CONSTITUTION:When even one address signal varies, a circuit ATD generates the inversion of phiq in response and phiq' goes up to H, so that a clocked inverter IV operates. When the parasitic capacitance at the output terminal Dout of the buffer is held at H, the IV 1 outputs H and an IV 2 outputs L to turn on a FET Q19, thereby discharging the parasitic capacitance gradually. When the parasitic capacitance is held at L, the VI 1 outputs H and the VI 2 outputs L to turn on a Q18, thereby charging the parasitic capacitance gradually. The Dout is discharged to an intermediate level between H and L within the width of the pulse phiq', i.e. the operation period of the IVs 1 and 2 and then a readout signal is applied to gates of Q16 and Q17 to obtain an output signal. In this case, the output buffer generate varies from the intermediate level to H or L, so the output level is determined at a high speed in a small-noise state.
    • 4. 发明专利
    • SEMICONDUCTOR DEVICE
    • JPS60123053A
    • 1985-07-01
    • JP22992783
    • 1983-12-07
    • HITACHI MICROCUMPUTER ENGHITACHI LTD
    • AKIMA ISAOTACHIMORI HIROSHITAKAHASHI OSAMUFUKUDA HIROSHI
    • H01L27/08H01L27/092H01L29/78
    • PURPOSE:To stabilize the potential of the central section of an MOSFET or the whole substrate and well potential, to reduce the resistance of a parasitic thyristor and to prevent a latch-up by forming an electrical supply section at the central section of the MOSFET or a position in the vicinity of the central section and applying the same supply signal as an electrical supply section in a peripheral section to the electrical supply section. CONSTITUTION:A P type well 11 is formed to one part of an N type silicon substrate 10, a PMOSFETQ'P is constituted on the main surface of the substrate 10 and an NMOSFETQ'N on the P type well 11, and a CMOS circuit is formed by these transistors. Consequently, electrical supplies to the substrate and the well are also executed at the central section by both sides and electrical supply sections 16, 24 in the PMOSQ'P and the NMOSQ'N. As a result, the floating of substrate potential in the central sections of the P and NMOSs and well potential is prevented, and substrate potential in the whole regions of each MOS and well potential are each stabilized at potential of VDD and VSS. Accordingly, substantial base resistance is reduced, the operation of thyristors by transistors TR'1, TR'2 is difficult to be generated, and the generation of a latch-up phenomenon can be prevented.
    • 6. 发明专利
    • SEMICONDUCTOR DEVICE
    • JPS60167467A
    • 1985-08-30
    • JP2179084
    • 1984-02-10
    • HITACHI MICROCUMPUTER ENGHITACHI LTD
    • FUKUDA HIROSHITACHIMORI HIROSHITAKAHASHI OSAMU
    • H01L29/78
    • PURPOSE:To enlarge the diffused layer surrounded by a gate electrode, and to prevent the lack of gate insulation film in the photoetching process by a method wherein the gate electrode is shaped into a square framelike form, and a corner of the gate electrode is bent at an angle of 90 deg. or more to a straight line section of the gate electrode. CONSTITUTION:The gate electrode 31 forms almost a square frame and locates one side 41 on an SiO2 layer 32 and the other side 42 in a P-well 30. The reason why one side 41 is located on the layer 32 is to improve the static withstand voltage by taking the area of the diffused layer 35 on the side of an input circuit occupied in the well 30 as wide as possible. Besides, formation of the gate electrode 31 in square frame like form is likewise to take wider the area of the layer 35 in the well 30. The corners 43 and 44 of the gate electrode 31 are bent at an angle of 90 deg. or more to the straight line sections 41, 42, 45, and 46, thus improving the adhesion property with photo resist.
    • 8. 发明专利
    • SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
    • JPS59231847A
    • 1984-12-26
    • JP10571383
    • 1983-06-15
    • HITACHI MICROCUMPUTER ENGHITACHI LTD
    • AKIMA ISAOFUKUDA HIROSHIOOKUBO KIYOUOADACHI KOUICHITACHIMORI HIROSHI
    • H01L29/78H01L27/02H01L27/06
    • PURPOSE:To assure the protection of a gate insulating film by a method wherein an IC with an input protecting circuit between an input terminal and an internal circuit is composed of an electric resistor with a protecting circuit series-inserted thereinto and a clamp element with the protecting circuit parallel-inserted thereinto while the clamp elemnt is composed of a parasitic MOSFET provided underneath the resistor serving both as a gate electrode of this FET. CONSTITUTION:An electric resistor Ri with a protecting circuit series-inserted thereinto and a clamp element Q1 with the protecting circuit parallel-inserted thereinto comprising MOSFET element are provided between an input terminal pad IN and an internal circuit IC. In other words, source and drain regions 12 are diffusion-formed on the surface layer of a semiconductor substrate 10 and the gaps between the regions 12 are covered with a thick insulating film 14 and the overall surface of the film 14 is further covered with another insulating film 16. Next a resistor Ri comprising multicrystal-line Si is provided on the film 16 located between the regions 12 while a parasitic MOSFET element Q1 is composed of the insulating film 14 and the gate insulating film 16. Through these procedures, the drain region D and the resistor Ri to be a gate electrode in the regions 12 are connected to the internal circuit IC while the source region S is grounded.
    • 9. 发明专利
    • PHOTOMASK
    • JPS61219955A
    • 1986-09-30
    • JP6063485
    • 1985-03-27
    • HITACHI MICROCUMPUTER ENGHITACHI LTD
    • FUKUDA HIROSHITACHIMORI HIROSHIKUNIMOTO YUKINORIADACHI KOICHI
    • G03F1/00G03F1/54H01L21/027
    • PURPOSE:To prevent the breakdown of a metallic film pattern of a photomask by forming a corner part of a semiconductor area, to an obtuse angle or a circular arc shape so that a distance between each semiconductor area becomes larger than a prescribed value, and using the photomask of the metallic film pattern. CONSTITUTION:In a semiconductor substrate consisting of an (n )-type single crystal silicon, a field insulating film is formed on a main surface on the substrate by using a photomask 22. This photomask 22 is used for a negative type photoresist by forming a chrome thin film 23 in a rectangular shape on a quartz substrate. In this regard, in accordance with the shape of the chrome thin film 23, a field insulating film is formed on the semiconductor substrate. A corner part 23A of this chrome thin film 23 is formed in a circular arc shape. This circular arc shape is formed so that a distance between each semiconductor area becomes larger than a prescribed value. Accordingly, when the photomask has been set to an exposing device, a corner part of a metallic pattern causes no melt breakdown, and a drop of the yield can be prevented.