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1. 发明专利

JPS60117193A WATER LEVEL INDICATOR FITTED NOZZLE FOR NUCLEAR REACTOR 失效
公开(公告)号：JPS60117193A
公开(公告)日：1985-06-24
申请号：JP22419383
申请日：1983-11-30
申请人： HITACHI LTD , TOKYO GENSHIRIYOKU SANGYO KENK
发明人： TANAKA MINORU , SAITOU HIDEYO , SHIMURA TAKAO , KUROSAWA KOUICHI , TANI MICHINARI
IPC分类号： G21C17/035 , G01F23/00 , G01F23/14 , G21C17/02

2. 发明专利

JP2000077848A Manufacture of multilayered interconnection layer 审中-公开
标题翻译：多层互连层的制造
公开(公告)号：JP2000077848A
公开(公告)日：2000-03-14
申请号：JP24592298
申请日：1998-08-31
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： KENMOCHI AKIHIRO , YUUKI YOSHIFUMI , MATSUYAMA HARUHIKO , TANAKA MINORU
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a method to manufacture a multilayered interconnection layer using a polyimide film.
SOLUTION: In a method to manufacture a multilayered interconnection layer, a wiring 4 is formed on a polyimide film 1, a wiring 6 is formed on a substrate 7, the film 1 and substrate 7 are adhered to each other by an insulative adhesive agent 5 in a manner that the wirings 4 and 6 thereon face each other, a laser light is emitted thereto from the film 1 side to form via holes 8-10 using the wirings 4 and 6 as a mask, electrodes 11 are provided to the via holes 8-10, and the wirings 4 and 6 between the film 1 and substrate 7 are connected. In this case, the diameter of via hole in an adhesive layer is made smaller than that in the film that is formed using the wirings 4 and 6 as a mask.
COPYRIGHT: (C)2000,JPO
摘要翻译：要解决的问题：提供一种使用聚酰亚胺膜制造多层互连层的方法。解决方案：在制造多层互连层的方法中，在聚酰亚胺膜1上形成布线4，在基板7上形成布线6，通过绝缘粘合剂5将膜1和基板7彼此粘合以其布线4和6在其上面对的方式，从膜1侧向其发射激光，使用布线4和6作为掩模形成通孔8-10，将电极11设置到通孔连接薄膜1和基板7之间的布线4和6。在这种情况下，粘合剂层中的通孔的直径比使用布线4和6作为掩模形成的膜的直径小。

3. 发明专利

JPH11179583A MASK FOR LASER MACHINING 失效
公开(公告)号：JPH11179583A
公开(公告)日：1999-07-06
申请号：JP34886297
申请日：1997-12-18
申请人： HITACHI LTD
发明人： MIZOE YUKIO , TANAKA MINORU , SUGANO KENICHI , INOUE KENICHI , YAMAGUCHI MITSUHIKO
IPC分类号： B23K26/066 , B23K26/06
摘要： PROBLEM TO BE SOLVED: To improve machining precision of a micro-pattern and to reduce machining cost by providing a metallic film, which is to be patterned on a quartz plate glass, with a mulatilayer structure of plural metals of different properties and thereby improving laser resistance of a mask. SOLUTION: In performing high-precision microfabrication on a polyimide insulating film 11 on a ceramic substrate 12, a mask 4 to use is designed to have a metallic film of a three layered structure, in which a Cr film 8 with a large reflectance and a high melting point is formed as the initial layer on a quartz plate glass 5, in which a Cu film 9 with a large thermal conductivity is formed next on the initial layer, and in which a Cr film 10 is further formed as a barrier for preventing oxidation of the Cu film 9. Incidentally, it is desirable that the thickness of the Cr film 8 is 0.075 μm, Cu film 9 is 3 μm, and Cr film 10 is 0.075 μm which is for the prevention of oxidation of the Cu film 9. As a result, in carrying out laser beam machining with an energy density of 0.4-0.8 J/cm , the resistance can be fifteen times or higher compared with the mask of a single Cr film.

4. 发明专利

JPH0936036A METHOD AND APPARATUS FOR DETECTING AT LEAST EITHER THE INCLINATION OR HEIGHT OF AN OPTICALLY MULTILAYER OBJECT 失效
公开(公告)号：JPH0936036A
公开(公告)日：1997-02-07
申请号：JP9798796
申请日：1996-04-19
申请人： HITACHI LTD
发明人： OSHIDA YOSHITADA , TANAKA MINORU , TANIMOTO TETSUZO
IPC分类号： G01B11/02 , G01B11/26 , G03F7/20 , G03F9/00 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To accurately measure the inclination or height of an object having a laminate structure such as semiconductor wafers, irrespective of its structure or optical characteristics by setting the incident angle of an irradiating light to specified value or more. SOLUTION: A laser beam emitted from a semiconductor laser 1 is formed into a thin collimated beam to a collimate lens 11 and applied to an exposure area on the surface of a resist of a wafer through a mirror 13 at an incident angle of 85deg. or more. A reflected light is condensed on a light position detector 3' by a mirror 210 and condenser lens 20 to detect the condensed position thereof. If the exposure area inclines by α, the normal reflected light inclines 2α, and hence the condensed spot of the light position detector deviates 2α where (f) is focal distance of the condenser lens. Thus, control can be made so that the photoresist face on the wafer may align with the reticle pattern image face.

5. 发明专利

JPH08172273A CERAMIC WIRING BOARD AND ITS MOUNTING STRUCTURE 失效
公开(公告)号：JPH08172273A
公开(公告)日：1996-07-02
申请号：JP31286494
申请日：1994-12-16
申请人： HITACHI LTD
发明人： YABUSHITA AKIRA , SHIGI HIDETAKA , ITO MITSUKO , KAWAI MICHIFUMI , YAMADA OSAMU , ANDO AKIHIRO , TANAKA MINORU , OTA TOSHIHIKO
IPC分类号： H05K3/46 , H01L23/12
摘要： PURPOSE: To obtain a ceramic wiring board which avoids the super-position of a strain based on a stress and which enhances the mechanical strength of a connecting electrode by a method wherein a stress-relaxation layer and an insulating layer are formed on the rear of a ceramic substrate, a through-hole opening hole, for connection, which is smaller than a specific outside-diameter value is formed and an input/output signal pin is formed. CONSTITUTION: A circular stress-relaxation metal layer 4 is formed on the rear of a thick-film multilayer ceramic substrate 1. The surface of the stress- relaxation metal layer 4 is covered with an interlayer insulating film 6 composed of an organic material such as a polyimide-based resin or the like in such a way that a through-hole opening 9 is made. The surface of the interlayer insulating layer 6 is covered with a circular solder-connection metal layer 2 and with a cover coat layer 5 in which an opening part has been formed. An Au-plated film 28 is formed on the surface of the solder-connection metal layer 2. An input/output signal pin 3 is connected to the Au-plated film 28 by means of solder 8. The diameter of the through-hole opening 9 is formed to be smaller than the root diameter of the signal pin 3 or 1/2 of the outside diameter of the solder-connection metal layer 2.

6. 发明专利

JPH0779080A MULTILAYER CIRCUIT WIRING BOARD AND CIRCUIT CORRECTING METHOD BASED THEREON 失效
公开(公告)号：JPH0779080A
公开(公告)日：1995-03-20
申请号：JP22271793
申请日：1993-09-08
申请人： HITACHI LTD
发明人： OGIWARA MAMORU , TANAKA MINORU
IPC分类号： H05K3/22 , H05K1/00 , H05K3/34 , H05K3/46
摘要： PURPOSE:To provide a multilayer circuit wiring board that has no limitation to the material for circuit correction, facilitates inspections after circuit correction, and can be easily manufactured. CONSTITUTION:A plurality of terminal connecting pads 2a, 2b, 2c are formed in the uppermost layer of regions where electronic circuit parts are to be mounted. A plurality of layers of wiring 7a, 7b, 7c are formed within the board. A first group of a plurality of pads 3c, 3d for correction, composed of the same metal as the terminal connecting pads, in contact therewith, are formed. A second group of a plurality of pads 3a, 3b, 3e for correction, made of the same metal as the terminal connecting pads, not in contact therewith, are formed. Both the groups are positioned virtually on the same plane as the terminal connecting pads. The circuit is corrected by cutting the wiring 7a, 7b and connecting the correcting pads 3c, 3d in the first group with the correcting pads 3a, 3b in the second group, respectively.

7. 发明专利

JPH0525061B2 失效
公开(公告)号：JPH0525061B2
公开(公告)日：1993-04-09
申请号：JP9771885
申请日：1985-05-10
申请人： HITACHI LTD
发明人： TANAKA MINORU , KOIZUMI MITSUYOSHI , OOSHIMA YOSHIMASA
IPC分类号： G01B11/30 , G01N21/88 , G01N21/95 , G11B5/84 , H04N7/18

8. 发明专利

JPH04201662A LINING CONSTRUCTION FOR RAILWAY VEHICLE 失效
公开(公告)号：JPH04201662A
公开(公告)日：1992-07-22
申请号：JP32919590
申请日：1990-11-30
申请人： HITACHI LTD , HITACHI KASADO ENG KK
发明人： TANAKA MINORU , FUJII TADAYUKI
IPC分类号： B61D17/00
摘要： PURPOSE:To increase the rigidity of an inner frame by supporting an inside panel together with the inner frame at short intervals on the main frame of a vehicle body acting as a bearing for the inside panel and inner frame. CONSTITUTION:A reinforcement inner frame 7 is fitted to the reinforcement panel 5 of an inside panel 4 where short of required strength, via spot welding or bonding. Also, an inspection cover 6 is assembled as a unit of a reinforcement panel 5. Cables 3 at both ends of a vehicle come from an overhead A and beneath a floor B. Due to the existence of a notch 2 in structural frames 1, however, it is not required to pass the cables 3 between the frames 1, and it is possible to work with the cables 3 at the front of a worker. After the cables are laid and electrical equipment are installed, an assembled inside panel unit is mounted like a box cover. In this case, the aforesaid unit is bonded to the structural frames 1. In this case, a presser face comes to the inside panel to befit by screw set thereby ensuring more reliable mounting.

9. 发明专利

JPH04185693A LIQUID COMPOSITION FOR ETCHING RESISTIVE FILM AND ETCHING PROCESS USING THE SAME 失效
公开(公告)号：JPH04185693A
公开(公告)日：1992-07-02
申请号：JP31405590
申请日：1990-11-21
申请人： HITACHI LTD
发明人： WATABE TAKAYOSHI , INOUE TAKASHI , OKA HITOSHI , TANAKA MINORU
IPC分类号： H05K1/16 , C04B41/52 , C04B41/53 , C04B41/89 , C04B41/91 , C09K13/08 , C23F1/16 , C23F1/26 , H01C17/00 , H01L21/308
摘要： PURPOSE:To prepare the title liquid composition which does not produce undercuts of a Cr-SiO2 layer and can process an upper Al layer in a tapered shape in the wet-etching of an Al/Cr-SiO2 multilayer metallic thin film by mixing water, an inorganic acid, HF and a specific compound. CONSTITUTION:The title composition comprises water, an inorganic acid (e.g. HCl) and H3PO4), HF and NH4F.

10. 发明专利

JPH0410754A METHOD AND DEVICE FOR REMOVING AFTERIMAGE OF IMAGE SIGNAL AND RAPIDLY INPUTTING THE SAME SIGNAL 失效
公开(公告)号：JPH0410754A
公开(公告)日：1992-01-14
申请号：JP11003290
申请日：1990-04-27
申请人： HITACHI LTD
发明人： TANIMOTO TETSUZO , OSHIDA YOSHITADA , TANAKA MINORU
IPC分类号： H04N1/028 , H04N1/19 , H04N5/335 , H04N5/341 , H04N5/353 , H04N5/357 , H04N5/369 , H04N5/372
摘要： PURPOSE:To make it possible to input an image at a high speed by removing an afterimage at the time of no inputting an image, and at the time of inputting the image, instantaneously receiving the image and then immediately outputting an image signal. CONSTITUTION:The image processor utilizing a CCD image sensor 1 inputs an image signal and then executes the arithmetic processing of the image signal by an inherent flow. Thus, an afterimage can be removed without requiring useless time by shielding a photodetecting face by an optical control means 3 while utilizing the above time and scanning an image at the maximum speed allowed of the image sensor 1. At the time of inputting the input signal, the photodetecting face is instantaneously turned to a photodetecting state by the means 3 and then a transfer clock (scanning start command) is forcedly applied to the sensor 1. Thereby, the image signal can be read out within the time of one scanning. Consequently, the afterimage can be removed without requiring useless time and the image signal can be rapidly inputted.

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