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1. 发明专利

JPH0213912A METHOD AND DEVICE FOR POSITIONING OPTICAL CIRCUIT PARTS 失效
公开(公告)号：JPH0213912A
公开(公告)日：1990-01-18
申请号：JP16252888
申请日：1988-07-01
申请人： HITACHI LTD , NIPPON TELEGRAPH & TELEPHONE
发明人： KONO TSUTOMU , WATANABE TOSHIO , KATO KUNIHARU
IPC分类号： G02B6/42 , G02B6/36 , G02B7/00
摘要： PURPOSE:To manufacture an optical circuit module being free from optical misalignment and having high accuracy by bringing optical circuit parts which are positioned and placed on a positioning device to vacuum adsorption as they are to the positioning device. CONSTITUTION:First of all, a cylindrical optical element 1 being optical circuit parts and an optical fiber use sleeve 2 are positioned and placed along a semi- cylindrical groove 6 and a projection 9 of a positioning device 5 placed in a position corresponding to a prescribed position on a substrate 3, respectively, and in such a state, by bringing a vacuum adsorption use hole 7 to vacuum exhaust, separate parts 1, 2 are adsorbed and fixed onto the positioning device 5. Thereafter, the substrate 3 on which a sticking material 4 is applied to a parts loading position is positioned by utilizing a height setting block 10 of the positioning device 5 and a substrate stopper 11, a weight 12 is placed on the substrate 3, and in a state that the parts 1, 2 are adsorbed and fixed to the positioning device 5, its state is held until the sticking material 4 is solidified completely. In such a way, stable assembly accuracy being free from an optical misalignment is obtained as an optical circuit module.

2. 发明专利

JPH02240989A SEMICONDUCTOR DEVICE FOR OPTICAL COMMUNICATION 失效
公开(公告)号：JPH02240989A
公开(公告)日：1990-09-25
申请号：JP6101589
申请日：1989-03-15
申请人： HITACHI LTD , NIPPON TELEGRAPH & TELEPHONE
发明人： KONO TSUTOMU , KANEKO SATOSHI , KATO KUNIHARU
IPC分类号： H01S5/00
摘要： PURPOSE:To secure a device so that it is kept at a stable state by forming a stem into a shape of round flange having a diameter that is smaller than the outer diameter of a cap and making the outer shape of the cap spherical. CONSTITUTION:A cap 4 is formed to have an outer diameter larger than a stem 1 and its external shape is formed into a sphere. At the end part of the mounting side of the stem 1, a round stepped part 8 having a diameter smaller than the outer diameter of the cap 4 is provided. Even if inferior adjustment and the like allow the optical axis of light emitted by a semiconductor laser 2 to be shifted with respect to the central axis of the external form in the case of the cap 4, a semiconductor device 16 for optical communication is supported by a precise jig for adjustment of optical axis when loaded on a substrate 15 and then, the optical axis of the device 16 is easily adjusted to a light combining or separating apparatus 14. This adjustment makes it possible to secure the device so that it is kept at a stable state.

3. 发明专利

JPH03265803A ASSEMBLING AND FIXING JIG FOR OPTICAL MULTIPLEXING AND DEMULTIPLEXING DEVICE 失效
公开(公告)号：JPH03265803A
公开(公告)日：1991-11-26
申请号：JP6424690
申请日：1990-03-16
申请人： HITACHI LTD , NIPPON TELEGRAPH & TELEPHONE
发明人： KONO TSUTOMU , KIRIYAMA TOSHIKATSU , KATO KUNIHARU
IPC分类号： G02B6/293 , G02B6/36
摘要： PURPOSE:To prevent the generation of positional and angular shifts by forming small holes in semicylindrical grooves and at a prism mounting position, providing a pin which serves as a stopper in the direction of an optical axis and setting a cylindrical sleeve in the semicylindrical groove, and performing vacuum deposition after a prism is mounted. CONSTITUTION:A lens 12 is incorporated in the cylindrical sleeve 1, which is machined to an accurate external diameter and an accurate internal diameter and coaxial with the lens 12. The assembling and fixing jig 11 is formed of the cylindrical sleeve 1, the semicylindrical groove 4 where the prism 2 is mounted, and the stopper 6 for positioning the prism 2, and the semicylindrical groove 4 is accurately machined with high density so that optical axes are aligned with each other. Further, the small holes 5 for vacuum suction are formed in the semicylindrical grooves 4 and at the position where the prism 2 is mounted and penetrate the assembling and fixing jig 11 to connect with a vacuum pump coupling nozzle 10. Consequently, the generation of positional and angular shifts are prevented.

4. 发明专利

JPH03273205A OPTICAL MODULE 失效
公开(公告)号：JPH03273205A
公开(公告)日：1991-12-04
申请号：JP7204590
申请日：1990-03-23
申请人： HITACHI LTD , NIPPON TELEGRAPH & TELEPHONE
发明人： KIRIYAMA TOSHIKATSU , HIMI SUSUMU , KONO TSUTOMU , KATO KUNIHARU
IPC分类号： G02B6/42 , G01N33/543 , H01L31/0232
摘要： PURPOSE:To facilitate the adjustment of an optical axis and the assembly by fixing a spherical or circular cylindrical lens into a cylindrical lens holder and fitting a light emitting and receiving element package to one end of the cylindrical lens holder and ferrule fibers to the other end. CONSTITUTION:The light emitting and receiving elements 4, 4' are disposed on one side of one piece of the cylindrical lens holder 1. The ferrule fibers are disposed on the other side and one piece of the lens 2 is coaxially disposed at the center. This lens holder 1 is soldered and fixed directly onto the pattern on a printed circuit board. The constitution to coaxially dispose the light emitting and receiving elements 4, 4', the lens 2 and the ferrule fibers into one piece of the cylindrical lens holder 1 and to solder and fix the lens holder 1 directly to the printed circuit board is adopted in such a manner, by which the number of parts is decreased and the size is reduced. The optical axis adjustment of the optical module is facilitatedin this way and the assembly characteristic is improved.

5. 发明专利

JP2010211179A Photoelectric composite wiring module and method for manufacturing the same 审中-公开
标题翻译：光电复合接线模块及其制造方法
公开(公告)号：JP2010211179A
公开(公告)日：2010-09-24
申请号：JP2009233978
申请日：2009-10-08
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： MATSUSHIMA NAOKI , NAKAJO TOKUO , MATSUOKA YASUNOBU , SUGAWARA TOSHIKI , MINAGAWA MADOKA , HAMAMURA SAORI , KANEKO SATOSHI , KONO TSUTOMU
IPC分类号： G02B6/42 , G02B6/122 , G02B6/13 , H01S5/022
CPC分类号： G02B6/4214 , H05K1/0274 , H05K1/185 , H05K3/4602 , H05K3/4644
摘要： PROBLEM TO BE SOLVED: To provide an photoelectric composite wiring module excellent in both performance and mass productivity, wherein the module is enhanced in transfer rate per channel while preventing increase in power consumption by connecting a drive circuit or amplifier circuit LSI of optical elements to electric wiring of the optical elements by a thin film wiring layer in a short distance, and is easy to assemble with high reliability since it adopts an easy connecting system to a transfer device such as a connector and conventional mounting of LSI; and to provide a transfer device using the same. SOLUTION: The photoelectric composite wiring module includes: optical elements 2a and 2b disposed on a first circuit board 1 so as to be optically coupled with an optical waveguide 11 formed on the first circuit board 1; an electric wiring layer 3 laminated on the upper layer of the optical elements, so that the electrodes of the optical elements are electrically connected to wires of the electric wiring layer 3; and an LSI mounted on and electrically connected to the electric wiring layer 3. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供性能和质量生产率优异的光电复合布线模块，其中模块通过连接驱动电路或光放大器电路LSI来防止电力消耗的增加，每个通道的传输速率提高元件通过薄膜布线层在短距离内的电气布线，并且由于采用容易的连接系统到诸如连接器的传输装置和LSI的常规安装，因此易于组装具有高可靠性; 并提供使用其的传送装置。光电复合布线模块包括：设置在第一电路板1上以与形成在第一电路板1上的光波导11光学耦合的光学元件2a和2b; 层叠在光学元件的上层的电布线层3，使得光学元件的电极电连接到电布线层3的导线; 和安装在电连接层3上并与其电连接的LSI。版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP2001007574A ELECTRONIC APPARATUS 失效
公开(公告)号：JP2001007574A
公开(公告)日：2001-01-12
申请号：JP17293799
申请日：1999-06-18
申请人： HITACHI LTD
发明人： KONO TSUTOMU , IIDA MAKOTO , NAKAMURA SHOZO , KURAMOTO HIROKI , NAKAGAWA TAKESHI
IPC分类号： H05K7/14 , B29C45/14
摘要： PROBLEM TO BE SOLVED: To provide an electronic apparatus in which deformation such as warpage is difficult to form and which has structure proper to recycling treatment. SOLUTION: A plurality of lower holes 1a, 1b are bored to a metal plate 1 as the framework of the box body of the electronic apparatus, and hooks 2a, 2b integrally molded on the backside of a molding part 2 as the external facing of the box body are installed to each of the lower holes one by one. The lower hole 1b at a center constrains the movement of the hook 2b in an xy plane. Sliding regions for moving the hooks 2a in the direction (the direct towards the fixed hook 2b) towards the center of the mold shrinkage of the molding part 2 are ensured in other lower holes 1a. A boss hole 2c for a mounting screw is formed to the head section of at least one sliding hook 2a. A screw for fixing a part housed in the box body is fitted into the boss hole 2c.

7. 发明专利

JP2000246419A FORMING DIE AND FORMING METHOD 失效
公开(公告)号：JP2000246419A
公开(公告)日：2000-09-12
申请号：JP4758599
申请日：1999-02-25
申请人： HITACHI LTD
发明人： KURAMOTO HIROKI , IIDA MAKOTO , TAKASU KEIJI , KONO TSUTOMU , OGAWA MASAKAZU , NAKAMURA SHOZO , EBINUMA NAOTAKE , YAMADA MASAYUKI
IPC分类号： B22D17/22
摘要： PROBLEM TO BE SOLVED: To prevent the development of unfilled part and casting flash, to uniformize cooling speed at a thin part and a thick part and to prevent the warping deformation and the lowering of strength by securing the fluidity of the molten metal or alloy in the zone at far distance from the thin part or a gate when the molten metal or alloy is injection-filled or cast into the cavity in a die. SOLUTION: On the cavity surface in the thin part, a heat insulating part or a heat insulating layer 8, 8' is arranged or in the cavity surface in the die for uniformizing the cooling speed, the heat insulating part or the heat insulating layer is arranged, and the thickness of the heat insulating part or the heat insulating layer at the thin part 6 in the cavity is thickened and the thickness thereof at the thick part 7 in the cavity is thinned. Further, the heat insulating part or the heat insulating layer is arranged on the cavity surface in the die and the farther distance from the gate is, the thicker the thickness of the heat insulating part or the heat insulating layer is.

8. 发明专利

JPH10221575A MANUFACTURE OF OPTICAL MODULE 失效
公开(公告)号：JPH10221575A
公开(公告)日：1998-08-21
申请号：JP2780997
申请日：1997-02-12
申请人： HITACHI LTD
发明人： KONO TSUTOMU , KATO TAKESHI , ISHII TOSHIAKI , FUKUDA KAZUYUKI , ISHIKAWA TADAAKI
IPC分类号： G02B6/42 , H01L21/56 , H01S5/00 , H01S3/18
摘要： PROBLEM TO BE SOLVED: To manufacture an optical module without damage and at low cost, by molding a pig-tail-type optical module. SOLUTION: This manufacturing method consists of two processes: one process is to fix an optical element, a lead frame, and an optical fiber on a board 12 and to cover an optical connection part of the optical element and the optical fiber with resin to produce a component, and another process is to sandwich the lead frame of the component and a part of a fiber jacket 5 covering the optical fiber between an upper die and a lower die 10 for molding such that there are cavity 21 covering the board 12, and to inject thermosetting resin into the cavity to form a package. Heat insulators 17, 23 which cover the fiber jacket are arranged between the fiber jacket 5 and the dies 10 so that the dies 10 do not contact with the fiber jacket 5.

9. 发明专利

JPH10200155A OPTICAL MODULE 失效
公开(公告)号：JPH10200155A
公开(公告)日：1998-07-31
申请号：JP360197
申请日：1997-01-13
申请人： HITACHI LTD
发明人： ISHII TOSHIAKI , EGUCHI KUNIYUKI , KATO TAKESHI , KONO TSUTOMU , FUKUDA KAZUYUKI , ISHIKAWA TADAAKI , MIURA TOSHIMASA
IPC分类号： H01L23/28 , G02B6/42 , H01L21/56 , H01L21/60 , H01L23/50 , H01L31/02 , H01L31/12 , H01S5/00 , H01S3/18
摘要： PROBLEM TO BE SOLVED: To obtain an optical module excellent in the optical coupling properties and package moldability by bonding a lead frame and a substrate electrically through a gold wire and setting the overall loop height of the gold wire within a specific range. SOLUTION: When the optical fiber part is clamped by dies, a positional shift takes place between the die clamp part and the fiber part due to dimensional accuracy of the die, mounting positional shift on a board 1, mounting shift of a fiber component, and the like, and the board 1 coupled with the fiber is displaced slightly. If L=h1 /h2 is 0.03 or less, the length of a gold wire becomes shorter than the displacement of board determined by the dimensional accuracy of the member and the gold wire 2 is broken. When the L is too long, the wire is waved by the fluid pressure of a thermosetting resin composition at the time of low pressure transfer molding to cause short circuit or breakage of wire, so that L must be 0.5 or less. Consequently, the L must be set in the range of 0.03 and 0.5.

10. 发明专利

JPH07113927A OPTICAL PARALLEL MODULE 失效
公开(公告)号：JPH07113927A
公开(公告)日：1995-05-02
申请号：JP25799893
申请日：1993-10-15
申请人： HITACHI LTD
发明人： TAKAYAMA KAZUTOSHI , MOGI SACHIHIRO , KANEKO SATOSHI , KONO TSUTOMU , KITO SHIGEFUMI
IPC分类号： G02B6/42
摘要： PURPOSE:To uniformly obtain the light outputs of the optical parallel module over a wide temp. range. CONSTITUTION:Constituting members including plural pieces of optical elements formed to an array form having an optical transmission relation, an optical lens array 2 and a ferrule 3 for protecting an optical fiber array 4 are so selected that the coeffts. of thermal expansion increase in order of arrangement. Then, the coeffts. of thermal expansion of materials increase in order of the arrangement, i.e. the optical element array 1, the optical lens array 2 and the ferrule 3 protecting the optical fiber array 4 and, therefore, a laser beam successively spreading in an outer channel direction by thermal expansion as temp. rises is easily taken into the optical lenses and fibers and alignment is executed with high accuracy if a semiconductor laser array (LD array) is used for, for example, the optical element array 1 and, therefore, the sufficient light outputs of the optical parallel module are uniformly obtd. over the wide temp. range.

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