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1. 发明专利

JPH08148643A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, MANUFACTURE THEREOF, AND RESIN MOLDING DIE THEREFOR 失效
公开(公告)号：JPH08148643A
公开(公告)日：1996-06-07
申请号：JP28572794
申请日：1994-11-18
申请人： HITACHI LTD , HITACHI VLSI ENG , HITACHI HOKKAI SEMICONDUCTOR
发明人： NISHIZAWA HIROTAKA , MIURA TOMOYOSHI , ANJO ICHIRO , YAMADA TOSHIO , SEKINE YASUSHI , OBARA TETSUJI , HANABUSA YOSHIAKI , SUGANO TOSHIO , YAMAGUCHI YASUNORI , SAWADA JIRO , YAMAMURA MASAHIRO , ISHIHARA MASAMICHI , MORITA SADAO , ARAKI TAKASHI , TAKEURA SHINOBU , FUDA MUTSUO , KASAI NORIHIKO , GOTO MASAKATSU
IPC分类号： H01L25/18 , H01L21/56 , H01L25/065 , H01L25/07
摘要： PURPOSE: To provide a miniature, high-performance multichip module and a manufacturing technique therefor. CONSTITUTION: Lead frames mounted with a semiconductor chip are stacked up to a specified number of layers, and sealed in a lump with resin to form a package 2. The obtained package 2 is placed on a mother socket 3. The outer leads 6 of the lead frames, led out of the side of the package 2, are electrically connected with the leads 7 of the mother socket that extend in the direction orthogonal to the direction of the extension of the outer leads 6, and a DRAM module 1 is thereby formed.

2. 发明专利

JPS63160264A SEMICONDUCTOR MODULE DEVICE 失效
公开(公告)号：JPS63160264A
公开(公告)日：1988-07-04
申请号：JP30646086
申请日：1986-12-24
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： NOSAKA TOSHIO , SUGANO TOSHIO
IPC分类号： H01L25/10 , H01L25/18 , H05K1/14 , H05K1/18
摘要： PURPOSE:To increase the mounting density of semiconductor devices on a laminated substrate by a method wherein electronic elements are mounted on an electronic element mounting hole made on the laminated substrate to mount semiconductor elements thereon. CONSTITUTION:An electronic element mounting hole 3 is made on a specified position of a laminated layer substrate 1 to mount electric elements such as a decoupling.chip.condenser, a battery, a microcomputer, EEPROM, etc., and then multiple semiconductor devices 2 are mounted on the upper and lower surface of laminated substrate 1. In such a constitution, the mounting space of semiconductor devices on the laminated substrate 1 can be widened to increase the mounting density of semiconductor devices on the laminated substrate 1.

3. 发明专利

JPH08121381A VENTILATING DEVICE FOR VEHICLE 失效
公开(公告)号：JPH08121381A
公开(公告)日：1996-05-14
申请号：JP25497394
申请日：1994-10-20
申请人： HITACHI LTD
发明人： NAKAMURA KENICHI , SUGANO TOSHIO
IPC分类号： G01F1/34 , F04D27/00
摘要： PURPOSE: To indirectly accurately and easily grasp an operation air flow of a ventilation device during mounting of it on a vehicle by providing a mechanism to detect and measure a reference differential pressure between a fan suction port, corresponding to an airflow of a fan, and a spot right before an impeller. CONSTITUTION: A ventilation device 1 mounted on a vehicle comprises a ventilating fan 2; a transmitter 3 for driving a fan, a ventilation duct 4 on the suction side of the ventilation device 1; and a duct 5 on the delivery side. Further, the ventilating device comprises a suction pressure detecting port 6 on the suction side of the ventilating fan 2; a pressure detecting port 8 right before an impeller 7; a differential pressure introduction pipe 9 for detecting a differential pressure; and a differential pressure gauge 10 to measure a differential pressure. This constitution facilitates detection and measurement of a differential pressure during loading of the ventilation device 1 on a vehicle to any time. By using the deferential pressure and one kind of a reference differential pressure - airflow characteristic curve measured and determined during pretesting of factory performance according to JIS, an accurate airflow is grasped.

4. 发明专利

JPH03291869A ELECTRONIC DEVICE 失效
公开(公告)号：JPH03291869A
公开(公告)日：1991-12-24
申请号：JP9346690
申请日：1990-04-09
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD
发明人： SUGANO TOSHIO , TSUKUI SEIICHIRO
IPC分类号： H05K1/11 , H01L23/538 , H01L25/065 , H01L25/10 , H05K1/14 , H05K3/34 , H05K3/36 , H05K3/40 , H05K3/42 , H05K3/44 , H05K3/46
摘要： PURPOSE:To enhance packaging density by embedding a part of a lead pin in the inside of a printed board at its one side. CONSTITUTION:A plurality of semi-conductor memory devices 11 are packaged in the respective surfaces mutually opposite in a printed board 10, and one end of a lead pin 10B is embedded at one end side of the board 10. By this constitution, the packaging density of a packaged board can thereby be enhanced.

5. 发明专利

JPH02288292A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH02288292A
公开(公告)日：1990-11-28
申请号：JP10767689
申请日：1989-04-28
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD
发明人： SUGANO TOSHIO , TSUKUI SEIICHIRO , SUZUKI SHIGERU
IPC分类号： H05K1/18 , H01L25/00 , H01L25/10 , H01L25/18 , H05K1/14
摘要： PURPOSE:To enable the oblique mounting at the angle corresponding to the height limitation of mounting space so as to realize high density mounting high in reliability by mounting semiconductor elements on both faces of a substrate so that the semiconductor element on one face may be positioned farther from an external electrode at the edge face of the substrate than the semiconductor element on the other face. CONSTITUTION:A semiconductor device 1 is of structure where a plurality of pieces of SOJ(small outline J-bend package)-shaped semiconductor elements 3a and 3b are mounted on both primary faces 2a and 2b of a printed wiring substrate 2 in multilayer interconnection structure, and is mainly used as a memory module for computer, etc. The semiconductor element 3a mounted on the top 2a of the substrate 2 is mounted being slid by the amounts of l-m from the position corresponding to the semiconductor element 3b mounted on the bottom 2b to the position near an external electrode terminals 5. The mounting of the semiconductor elements 3a and 3b on the substrate 2 is done by fixing J-shaped leads 4a and 4b projected from the semiconductor elements 3a and 3b to the electrode pads 8a and 8b on the substrate 2 with solder, etc.

6. 发明专利

JPH01170037A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH01170037A
公开(公告)日：1989-07-05
申请号：JP32708087
申请日：1987-12-25
申请人： HITACHI LTD , HITACHI DEVICE ENG
发明人： WATANABE MASAYUKI , SUGANO TOSHIO
IPC分类号： H01L23/52 , H01L25/10 , H01L25/11 , H01L25/18
摘要： PURPOSE:To enable the tape carriers to be mounted in high density by making it feasible to lamination-mount the lead patterns of packages. CONSTITUTION:The leads 8A as the parts if respective lead patterns 8 are modified to lamination-mount tape carriers. In other words, the lead 8A at right hand upper end part controls the input.output of chip select signals of laminationmounted upper chips while the other leads 8A adjacent to the leads 8B at right hand upper end part controls the input.output of chip select signals of lamination-mounted chips. Through these procedures, two each of tape carrier packages 3A, 3B can be lamination-mounted on a mother port 1 by modifying the leads 8A as the parts of lead patterns 8 to augment the mounting density.

7. 发明专利

JPS6429696A IMPELLER OF BLOWER 失效
公开(公告)号：JPS6429696A
公开(公告)日：1989-01-31
申请号：JP18218087
申请日：1987-07-23
申请人： HITACHI LTD
发明人： SUGANO TOSHIO , TAKADA AKIRA , SANGO NAOYOSHI
IPC分类号： F04D29/02 , F04D29/30
摘要： PURPOSE:To make the title impeller steadily operatable without using any adhesive even in high temperature gas by arranging flat rectangular ceramic pieces so as to coincide with a blade shape and tightening them through a damping material provided on a blade body member. CONSTITUTION:Ceramic pieces 7 are tightened and fixed by bolts 8 on the fluid passing surface of a blade 4 made of curved steel plate through a damping member 9. The ceramic piece 7 is of an uniform flat rectangular shape having a thickness of 4 to 9mm, and of trapezoidal shape with its one end having the angle coinciding with the fitting angle of a side plate 5 to the blade 4 and its short side width of 50 to 150mm. The length of the ceramic piece 7 equals to the length in the total width direction perpendicular to the gas flow direction of the blade 4, and is arranged as much as 5 to 10 rows per blade so as to coincide with the shape of the blade 4. The ceramic piece 7, as a wear resistance member, thereby can be mechanically tightened to the blade body member without using any adhesive.

8. 发明专利

JPS5322477A MEASURING JIG 失效
公开(公告)号：JPS5322477A
公开(公告)日：1978-03-01
申请号：JP9603976
申请日：1976-08-13
申请人： HITACHI LTD
发明人： SUZUMURA YOSHIKAZU , SUGANO TOSHIO
IPC分类号： G01R1/073 , G01R1/06
摘要： PURPOSE:To prevent cracking and breaking of measured object in jig to inspect electric characteristics causing needle to make contact simultaneously with upper and lower both surfaces of plate type material, by previously fixing measured object to main body side of measuring jig, and then, by pressing down measuring needle.

9. 发明专利

JPH04111386A ELECTRONIC DEVICE 失效
公开(公告)号：JPH04111386A
公开(公告)日：1992-04-13
申请号：JP22930890
申请日：1990-08-30
申请人： HITACHI LTD , HITACHI MICROCUMPUTER ENG
发明人： TERADA KAZUHIRO , OTSUKA KENICHI , KIMOTO RYOSUKE , MASUDA MASACHIKA , SUGANO TOSHIO , AKEYAMA KENJI , MURAKAMI HAJIME , NISHIMURA ASAO , KITANO MAKOTO
IPC分类号： H05K1/18 , H05K1/00 , H05K1/02 , H05K1/03 , H05K3/34 , H05K3/46
摘要： PURPOSE:To ensure the reliability of a soldered part at a module on which many IC's have been mounted by a method wherein a board whose coefficient of thermal expansion is matched to the value of an IC package as far as possible is used. CONSTITUTION:At an electronic device, a single-layer board or a multilayer board, of ten layers or lower, whose coefficient of thermal expansion is at 7.0X10 to 3.0X10 is used, and a semiconductor device in a package in which an interval between opposite lead terminals is at 10mm or higher and the height of leads from the board is at 0.7mm or lower is mounted at least on one face. Leads 3 of a TSOP- type semiconductor device 2 on a ceramic board 1 are bonded (soldered) by using a solder 4 and the device is mounted. The thickness of the package for the TSOP-type semiconductor device 2 is at about 1.27mm. The ceramic board 1 has a multilayer interconnection structure formed in the following manner: copper foils 1B having a thickness of about 18mum are pasted on both faces of a ceramic core material 1; glass cloths are impregnated with an epoxy resin and dried to form prepregs 1C; the prepregs having a thickness of about 100mum are laminated on the copper foils; copper foils 1B having a thickness of about 18mum are pasted on them; prepregs 1C having a thickness of about 100mum are laminated on them; the copper foils 1B having a thickness about 18mum are pasted on them.

10. 发明专利

JPH0371616B2 失效
公开(公告)号：JPH0371616B2
公开(公告)日：1991-11-13
申请号：JP21681382
申请日：1982-12-13
申请人： HITACHI LTD
发明人： SUGANO TOSHIO
IPC分类号： F04D29/46 , F04D29/66 , F24F7/013 , F24F7/06 , F24F13/24

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