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1. 发明专利

JPH11135562A BGA SEMICONDUCTOR PACKAGE 失效
公开(公告)号：JPH11135562A
公开(公告)日：1999-05-21
申请号：JP29668097
申请日：1997-10-29
申请人： HITACHI LTD , HITACHI ULSI SYS CO LTD
发明人： KAJIWARA RYOICHI , KOIZUMI MASAHIRO , MORITA TOSHIAKI , TAKAHASHI KAZUYA , NISHIMURA ASAO , TSUBOSAKI KUNIHIRO , AKIYAMA YUKIHARU , KIMOTO RYOSUKE
IPC分类号： H01L21/60 , H01L23/12 , H05K3/34 , H05K3/40
摘要： PROBLEM TO BE SOLVED: To reliably contact solder balls to a soldering pad surface when the solder balls are mounted even in case of a small aperture by pushing Cu lands to be solder bumps into tape openings to reduce the depth from the tape back side to the pad face at the opening bottom. SOLUTION: Using a pin-like tool aligned with solder bump tape openings, the extrusion forming from a Cu foil to the tape openings is performed to form solder lands 6. Even in case of a small solder bump pitch or thick polyimide tape 5 on a tape base, solder bumps can be formed reliably with little solder ball mounting defective by a solder ball mounting method using a flux and solder balls only on a one-side wiring tape base. Thus it is possible to obtain a low-cost BGA package superior in mounting property with only a small bump height variation.

2. 发明专利

JP2000349228A LAMINATED SEMICONDUCTOR PACKAGE 失效
公开(公告)号：JP2000349228A
公开(公告)日：2000-12-15
申请号：JP16201699
申请日：1999-06-09
申请人： HITACHI LTD , HITACHI ULSI SYS CO LTD
发明人： MORITA TOSHIAKI , KAJIWARA RYOICHI , KOIZUMI MASAHIRO , TAKAHASHI KAZUYA , NISHIMURA ASAO , MIYAZAKI CHUICHI , AKIYAMA YUKIJI , SHIMOISHI TOMOAKI
IPC分类号： H01L25/18 , H01L25/065 , H01L25/07
摘要： PROBLEM TO BE SOLVED: To obtain a semiconductor package which is lessened in size and improved in density by a method wherein a board with wirings corresponding to the electrode pattern of another semiconductor element is mounted on the non-functional surface of a mounted semiconductor element, and all semiconductor chips are mounted in a flip chip mounting manner. SOLUTION: A semiconductor chip 1 is mounted on a board 4, a semiconductor chip 2 is mounted on the semiconductor chip 1, and a semiconductor chip 3 is mounted on the semiconductor chip 2. The laminated semiconductor chips 1 to 3 are mounted on the board 4 through solder balls 5, 7, 11, and 15 on an electrode pad formed on the functional surface of the board 4. Bonding wires 10 and 14 are laid from electrodes on the wiring board 4 mounted on the non-functional surfaces of the semiconductor chips 1 to 3 to an electrode 6 on the board 4 mounted through the intermediary of a protrudent electrode formed on an electrode pad on the functional surfaces of the semiconductor chips 1 to 3. By this setup, semiconductor chips can be collectively mounted, and a laminated semiconductor package can be simplified in a manufacturing process.

3. 发明专利

JPH11145204A BONDING TOOL 失效
公开(公告)号：JPH11145204A
公开(公告)日：1999-05-28
申请号：JP30158097
申请日：1997-11-04
申请人： HITACHI LTD , HITACHI ULSI SYS CO LTD
发明人： MORITA TOSHIAKI , KAJIWARA RYOICHI , KOIZUMI MASAHIRO , TAKAHASHI KAZUYA , TSUBOSAKI KUNIHIRO , NISHIMURA ASAO , AKIYAMA YUKIHARU , SHIMOISHI TOMOAKI
IPC分类号： H01L21/60 , H01L21/607
摘要： PROBLEM TO BE SOLVED: To deal with the narrow pitch bonding of a bonding tool, by so applying a load not smaller than a specific value to it that the end portion present on the side whereon the slender portion of its end portion is contacted with an inner lead is distorted by a specific length. SOLUTION: The frictional force generated between a bonding tool and an inner lead provided in parallel with the main direction of the ultrasonic vibration of the bonding tool when vibrating it by an ultrasonic force is made equal to the frictional force generated between the bonding tool and an inner lead positioned vertically to the main direction of its ultrasonic vibration. That is, assuming that the slender portion of the end portion of the bonding tool is a cantilever, the load not smaller than seven grams is applied to the end portion present on the side whereon the slender portion of its end portion is contacted with the inner lead, when the end portion present on the side whereon the slender portion of its end portion is contacted with the inner lead is distorted by 1 μm.

4. 发明专利

JP2000040716A BONDING DEVICE 失效
公开(公告)号：JP2000040716A
公开(公告)日：2000-02-08
申请号：JP20895898
申请日：1998-07-24
申请人： HITACHI LTD , HITACHI ULSI SYS CO LTD
发明人： MORITA TOSHIAKI , KAJIWARA RYOICHI , KOIZUMI MASAHIRO , TAKAHASHI KAZUYA , TSUBOSAKI KUNIHIRO , NISHIMURA ASAO , AKIYAMA YUKIJI , SHIMOISHI TOMOAKI
IPC分类号： B06B1/06 , H01L21/60 , H01L21/607
摘要： PROBLEM TO BE SOLVED: To achieve high bonding strength with respect to the lead directed to any direction and to achieve low tipping damage, by fixing a bonding tool to the fixing part at the tip of bar-shaped head, and rotating the head part with the bar-shaped central axis as the center. SOLUTION: A laminated voltage element 1 is tightened by a bolt 3 and fixed to the tip part of a bar-shaped head 2. A bonding tool 5 is tightened and fixed by a bolt 6, which is provided at a bonding-tool fixing part 4. Then, the bonding tool 5 is vibrated ultrasonically by a vibrator. Furthermore, the head 2 is rotated with the central axis as the center. Thus, the bonding tool 5 is aligned so that the direction perpendiculart to the central axis of the head part 2 becomes the main vibrating direction. The vibrating direction of the bonding tool 5 can be made parallel to the longitudinal direction of the lead connected to the semiconductor element. Therefore, the low-damage bonding can be performed regardless of the direction of the lead.

5. 发明专利

JP2000223535A METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE USING THE METHOD AND APPARATUS 失效
公开(公告)号：JP2000223535A
公开(公告)日：2000-08-11
申请号：JP2580199
申请日：1999-02-03
申请人： HITACHI LTD , HITACHI ULSI SYS CO LTD
发明人： MORITA TOSHIAKI , KAJIWARA RYOICHI , KOIZUMI MASAHIRO , TAKAHASHI KAZUYA , NISHIMURA ASAO , AKIYAMA YUKIJI , SHIMOISHI TOMOAKI
IPC分类号： H01L21/60 , H01L21/607
摘要： PROBLEM TO BE SOLVED: To prevent bonding defects due to the breakage of a bonding tool and to eliminate bonding damages by setting a direction in which an ultrasonic wave vibrates to a direction perpendicular to an electrode. SOLUTION: An ultrasonic vibration system of this bonding apparatus comprises a bonding tool 5, a horn 6, and a piezoelectric element for generating ultrasonic vibrations. This ultrasonic vibration system has an elongated column- shaped configuration extending in a direction perpendicular to a work mounting surface. The tool 5 is designed to vibrate in a direction perpendicular to the work mounting surface, and extends in parallel with the horn 6. A direction in which an ultrasonic wave vibrates, i.e., a direction in which the tool 5 vibrates is along the length of the tool 5, i.e., in a direction perpendicular to the surface of an electrode pad 2. As a result, bonding defects due to the breakage of the tool 5 can be prevented, and bonding damages can be eliminated, and hence the production yield can be remarkably improved.

6. 发明专利

JPH11288967A SEMICONDUCTOR DEVICE AND BONDING METHOD THEREFOR 失效
公开(公告)号：JPH11288967A
公开(公告)日：1999-10-19
申请号：JP9123598
申请日：1998-04-03
申请人： HITACHI LTD , HITACHI ULSI SYS CO LTD
发明人： MORITA TOSHIAKI , KAJIWARA RYOICHI , KOIZUMI MASAHIRO , TAKAHASHI KAZUYA , TSUBOSAKI KUNIHIRO , NISHIMURA ASAO , AKIYAMA YUKIHARU , SHIMOISHI TOMOAKI
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To prevent bonding failures due to the damages of a bonding tool in advance by providing a function for determining whether bonding is normal or not, by comparing the shape of the tip part of the bonding tool being formed at a shape recognition region with a normal state. SOLUTION: Using a semiconductor device with a region for confirming a bonding tool shape, the bonding tool shape is compared with a normal state before bonding to check to see if the bonding is appropriate or not. If the bonding is found to be normal, bonding is made. More specifically, a bonding tool 15 is pressed against a bonding tool shape recognition region 16 prior to bonding, thus forming an indentation. The indentation corresponds to the shape, namely recesses and projections, of the bonding tool tip part. The image of the indentation shape is binarized. Through a bonding device storing the indentation shape of the tip part of the bonding tool 15 in normal state compared the image is composed in advance with a normal image.

7. 发明专利

JP2012020794A Apparatus for inspecting hand rail for passenger conveyor, and method of maintaining the conveyor 有权
标题翻译：用于检查乘客输送机的手提装置的装置，以及维护输送机的方法
公开(公告)号：JP2012020794A
公开(公告)日：2012-02-02
申请号：JP2010157431
申请日：2010-07-12
申请人： Hitachi Building Systems Co Ltd , Hitachi Ltd , 株式会社日立ビルシステム , 株式会社日立製作所
发明人： TAKAHASHI KAZUYA , TAKEMOTO HIROSUKE , YAMAGUCHI YUKIHIRO , ONISHI TOMOJI , KODAIRA NORIMI , SAKAI SHOHEI
IPC分类号： B66B31/00 , B66B29/00
摘要： PROBLEM TO BE SOLVED: To automatically evaluate quality of a hand rail based on a steel cord built in the hand rail for a passenger conveyor.SOLUTION: An apparatus for inspecting the hand rail for a passenger includes: an x-ray imaging part that images the hand rail for the passenger conveyor through x-ray; and an image processing part that processes the image photographed by the x-ray imaging part, detects the coming-off or tangling of the steel cord built in the hand rail and detects that the quality of the hand rail is defective when the length of the coming-off or tangling of the steel cord in a longitudinal direction of the hand rail is longer than a predetermined one.
摘要翻译：要解决的问题：根据内置在乘客输送机的手轨中的钢丝绳来自动评估手轨的质量。解决方案：用于检查乘客手扶轨道的装置包括：x射线成像部件，其通过x射线对乘客输送机的手轨进行成像; 以及处理由X射线成像部拍摄的图像的图像处理部，检测内置在手轨中的钢丝帘线的脱落或缠结，并且检测到手轨的质量在第钢帘线在手轨的纵向上的脱落或缠结比预定的长。版权所有（C）2012，JPO＆INPIT

8. 发明专利

JP2011053058A Vehicle inspection device 有权
标题翻译：车辆检查装置
公开(公告)号：JP2011053058A
公开(公告)日：2011-03-17
申请号：JP2009201638
申请日：2009-09-01
申请人： Central Japan Railway Co , Hitachi Ltd , 東海旅客鉄道株式会社 , 株式会社日立製作所
发明人： HOTTA MIYAKO , KITAMURA TADAAKI , TAKAHASHI KAZUYA , SAITO TAKESHI , KATSUTA NAOKI , MASUYAMA YUICHI
IPC分类号： G01N21/88 , G01B11/00 , G01M17/10 , G06T1/00
摘要： PROBLEM TO BE SOLVED: To provide a vehicle inspection device including a reference mark detection technique for, in the detection of the feature amount of a scratch on the side face of a wheel or the like, specifying the position of the scratch, or the like, based on the relationship to the absolute position.
SOLUTION: The vehicle inspection device detects a feature amount on a wheel from an input image of a side face of a wheel for railway vehicles, detects the coordinate of the center of the wheel from the input image of the side face of the wheel for railway vehicles; detects a reference mark from the input image of the side face of the wheel for railway vehicles, determines the coordinate thereof; and stores the position of the feature amount determined using the coordinate of the wheel center and the coordinate of the reference mark as references. Since the reference mark which is the absolute position for specifying the position of the feature amount can be detected, it is possible to automatically inspect a vehicle.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种车辆检查装置，其包括参考标记检测技术，用于在轮胎等的侧面上的划痕特征量的检测中指定划痕的位置，等等，基于与绝对位置的关系。解决方案：车辆检查装置从铁路车辆的车轮的侧面的输入图像检测车轮上的特征量，从车辆的侧面的输入图像检测车轮的中心坐标铁路车轮; 从轨道车辆的车轮侧面的输入图像中检测参考标记，确定其坐标; 并且存储使用轮中心的坐标和参考标记的坐标确定的特征量的位置作为参考。由于可以检测到用于指定特征量的位置的绝对位置的参考标记，因此可以自动检查车辆。版权所有（C）2011，JPO＆INPIT

9. 发明专利

JP2004010268A REMOTE RESERVATION DEVICE FOR ELEVATOR AND METHOD 审中-公开
公开(公告)号：JP2004010268A
公开(公告)日：2004-01-15
申请号：JP2002166661
申请日：2002-06-07
申请人： HITACHI LTD
发明人： MIYOSHI MASANORI , SHOJIMA HIROSHI , USAMI YOSHIAKI , TAKAHASHI KAZUYA , MORISANE HIROTO , FUJINO ATSUYA
IPC分类号： B66B1/14 , B66B3/00
摘要： PROBLEM TO BE SOLVED: To improve serviceability in a state wherein remote reservation getting-on of an elevator is simultaneously utilized from a plurality of user terminals. SOLUTION: This reservation device has an input/output processing means 102 receiving a service reservation of the elevator from the plurality of user terminals 100 via a network 204, and independently registers remote reservation data 118 by each user. Cancellation of the reservation can be requested from the user terminal, and the remote reservation is canceled when the reservation from the other user terminals corresponding to the reservation requested to be canceled are absent. Thereby, because the elevator is controlled in consideration of even the reservation state from the other users, proper elevator remote reservation service can be executed without contradiction even when the plurality of users use the portable terminals. COPYRIGHT: (C)2004,JPO

10. 发明专利

JP2003229451A FLIP CHIP MOUNTING STRUCTURE 审中-公开
公开(公告)号：JP2003229451A
公开(公告)日：2003-08-15
申请号：JP2002025737
申请日：2002-02-01
申请人： HITACHI LTD
发明人： KAJIWARA RYOICHI , KOIZUMI MASAHIRO , KONISHI SATOSHI , SHINODA MASAYOSHI , ICHIHARA SEIICHI , ITO KAZUTOSHI , MORITA TOSHIAKI , TAKAHASHI KAZUYA , NARISAWA AKIHIKO
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a flip chip mounting structure which is small in size and is capable of remarkably reducing bonding damages to a semiconductor device. SOLUTION: The flip chip mounting structure comprises a semiconductor substrate 1 made of silicon or a compound semiconductor which is formed with electrode pads 3 for connection formed on the substrate 1 and a passivation film 4 coating the surface of the substrate except for the electrode pad sections; electrodes for connection, each of which comprising a first metal bump 6 having a relatively large size and a second metal bump 7 having a relatively small size formed on the first metal bump, with the first metal bump connected to the electrode pad 3; a wiring board 8 having a metallized terminal face to be connected to the second metal bumps 7; and a resin layer filling a space between the semiconductor substrate and the wiring board. Bonding damages can be reduced by the first and second metal bumps. COPYRIGHT: (C)2003,JPO

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