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1. 发明专利

JPH08135884A LOW THERMAL STRESS STRUCTURE BODY 失效
公开(公告)号：JPH08135884A
公开(公告)日：1996-05-31
申请号：JP27738894
申请日：1994-11-11
申请人： HITACHI LTD , HITACHI NUCLEAR ENG
发明人： MATSUDA KENSHO , ABE RYUSUKE , TAKAKUSAKI TSUNEHIKO , ITAMI HIROYUKI , NAKANO SUSUMU , YAMAGUCHI SHIZUKA , TAKEUCHI MAMORU , MATSUZAKA KYO
IPC分类号： F16L57/00 , F16L9/00
摘要： PURPOSE: To reduce the thermal stress even if the temperature distribution in the sectional radial direction or lengthwise direction is large and provide the structure having the prescribed functions, without suppressing the flow of the high temperature fluid and improve the reliability of a plant. CONSTITUTION: As for a structure body which shows the hollow cylinder 1, full cylinder, hollow disc, full disc shaped and axially symmetrical structure, a cut 6 is formed on the surface in contact with the high temperature fluid, and the width of the cut is set to the dimension permitting the slight closure by the thermal expansion, and the depth is set to the value up to the position where the compression stress becomes zero.

2. 发明专利

JPH088531A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH088531A
公开(公告)日：1996-01-12
申请号：JP23661394
申请日：1994-09-30
申请人： HITACHI LTD
发明人： KAJIWARA RYOICHI , FUNAMOTO TAKAO , KATO MITSUO , SHIDA TOMOHIKO , MATSUZAKA KYO
IPC分类号： B23K35/24 , H01L21/60 , H01L23/50 , H05K3/34
摘要： PURPOSE:To enhance a semiconductor device in reliability when electronic parts or semiconductor parts are mounted on a wiring board having a different thermal expansion coefficient by a method wherein long magnetic bodies arranged in a specified direction are distributed in a soldered joint to serve as a reinforcing material to markedly prolong the fatigue life of the soldered joint. CONSTITUTION:A flat-package semiconductor device is equipped with an electronic part 25 composed of a package 5 with a semiconductor chip 1 enclosed in it and conducting leads 4 outwardly extending from it and a wiring board 6 where the leads 4 are bonded, wherein long magnetic bodies 16 are arranged in a non-magnetic joining material nearly perpendicular to a joint surface for the formation of a soldered joint 8.

3. 发明专利

JPS63310127A MICROJOINT STRUCTURE 失效
公开(公告)号：JPS63310127A
公开(公告)日：1988-12-19
申请号：JP14506887
申请日：1987-06-12
申请人： HITACHI LTD
发明人： KAJIWARA RYOICHI , KATO MITSUO , FUNAMOTO TAKAO , MATSUZAKA KYO , SHIDA TOMOHIKO
IPC分类号： H05K1/18 , H01L21/60 , H01L23/12 , H05K3/34
摘要： PURPOSE:To eliminate the destruction of a bonded part and to enhance its fatigue life by a method wherein this bonded part is constituted by a thin metal wire and a brazing material which has bonded each end of the thin metal wire to a connection terminal part. CONSTITUTION:A material 1 to be bonded and a material 1' to be bonded are coupled by using a microjoint structure which is composed of the following: a connection terminal part 2 installed at the material 1 to be bonded; a connection terminal part 3 installed at the material 1' to be bonded; thin metal wires 6 installed at a gap between the mutually facing connection terminal parts 2, 3; brazing materials 4, 5 bonding individual ends of the thin metal wires to the respective connection terminal parts 2, 3. If a relative dislocation delta is caused between the material 1 to be bonded and the material 1' to be bonded due to a change in a temperature, the relative dislocation delta is absorbed by a bending deformation of the thin metal wires 6; accordingly, a shearing stress caused at the thin metal wires 6 and the brazing materials 4, 5 is remarkably low. By this setup, a bonded layer is not destroyed and a fatigue life can be enhanced.

4. 发明专利

JPS6381956A PACKAGE FOR SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS6381956A
公开(公告)日：1988-04-12
申请号：JP22603586
申请日：1986-09-26
申请人： HITACHI LTD
发明人： OKAMURA HISANOBU , AKIYAMA HIROSHI , KAMOSHITA RIKUO , SAKAMOTO MASAHIKO , MATSUZAKA KYO
IPC分类号： H01L23/08 , H01L23/12 , H01L23/14 , H01L23/15
摘要： PURPOSE:To increase capacitance and density and attain a large size by placing a semiconductor element on an silicon carbide substrate and cooling the semiconductor element and sufficiently considering the difference of the thermal expansion coefficients of the semiconductor element and an alumina ceramics substrate supporting the substrate and the cooling efficiency of the whole semiconductor device. CONSTITUTION:A cooling substrate 2, on which a semiconductor element 1 is placed and &which cools the semiconductor element 1, is formed by silicon carbide ceramics prepared through a hot press method, using approximately 1 wt.% BeO having thermal conductivity of 260w/m.k and electric resistance of 10 OMEGA.cm or more as a sintering assistant, and a support substrate 3 supporting and fixing silicon carbide ceramics is also shaped by aluminum nitride ceramics, which has thermal conductivity of 100w/m.k or more and electric resistance of 10 OMEGA.cm or more and on the inside of which multilayer interconnections are enabled, thus allowing a large size, then coping with the increase of the capacitance and power of the semiconductor element.

5. 发明专利

JPS6345193A SILICON CARBIDE BASE CERAMIC SINTERED BODY WITH METALLIZED SURFACE AND MANUFACTURE 失效
公开(公告)号：JPS6345193A
公开(公告)日：1988-02-26
申请号：JP18848986
申请日：1986-08-13
申请人： HITACHI LTD
发明人： OKAMURA HISANOBU , SAKAMOTO MASAHIKO , AKIYAMA HIROSHI , KAMOSHITA RIKUO , MATSUZAKA KYO , ARAKAWA HIDEO
IPC分类号： C04B41/88

6. 发明专利

JPS62286666A BRAZING METHOD FOR CONDUCTOR TERMINAL 失效
公开(公告)号：JPS62286666A
公开(公告)日：1987-12-12
申请号：JP13014386
申请日：1986-06-06
申请人： HITACHI LTD
发明人： FUKUMAKI TAKASHI , SHIODA KATSUHIKO , MATSUZAKA KYO
IPC分类号： B23K1/00 , H01R4/02 , H01R43/02
摘要： PURPOSE:To execute brazing of a conductor terminal of a high strength and a high heat resistance by placing a brazing filler metal on a joint part of one conductor coil, heating it and forming an alloy layer and a brazing filler metal on the interface and the surface, respectively, and thereafter, inserting it between conductor terminals of the other side, which have been brought to U-shaped working, and heating and pressing it between a pair of electrodes. CONSTITUTION:Preliminary soldering 2 is performed to a joint part of a conductor coil 1 being a material to be joined, a joint part of the other conductor terminal 3 is brought to U-shaped working 4, and said coil 1 is combined with this part. That is to say, a cross section of said joint part is combined with electrodes 5, 5 of an electric conduction heating and pressure device, and thereafter, the preliminary solding 2 is performed by electric conduction heating, and an alloy layer 6, and an unreacting solder layer 7 are formed continuously between the coil 1 and solder, and on the upper layer part of the alloy layer 6, respectively. Subsequently, electric conduction working is executed through the electrodes 5, 5, and a thin alloy layer 8 is formed between the terminal 3 and a solder material 7. Thereafter, the electric conduction heating is further continued and by applying the pressure, unreacting solder 10 is joined and discharged, and the coil 1 and the terminal 3 are joined by each alloy layer 9.

7. 发明专利

JPS6259205B2 失效
公开(公告)号：JPS6259205B2
公开(公告)日：1987-12-10
申请号：JP5657482
申请日：1982-04-07
申请人： HITACHI LTD
发明人： ABE TAKAO , KAMITSUMA YASUO , MATSUZAKA KYO , KOBAYASHI YOSHIHIRO , KOIKE JIRO , MATSUMOTO MINORU , TAKAHASHI TSUTOMU
IPC分类号： C23C8/22 , C23C10/60 , C23C12/02 , F01D5/28 , F01D9/02

8. 发明专利

JPS62278427A HIGH TEMPERATURE WEAR CHARACTERISTIC EVALUATOR APPARATUS 失效
公开(公告)号：JPS62278427A
公开(公告)日：1987-12-03
申请号：JP12104786
申请日：1986-05-28
申请人： HITACHI LTD , TOSOKU SEIMITSU KOGYO KK , TOYO BOLDWIN KK
发明人： KAMITSUMA YASUO , ABE TAKAO , MATSUZAKA KYO , IIZUKA TAKEO
IPC分类号： G01N3/56
摘要： PURPOSE:To enable evaluation of one-way sliding wear characteristic in atmospheric air, gas and vacuum environments from the normal temperature to a high temperature, by arranging an enclosure of a sealing package between a rotating shaft and a stationary shaft to place a heating furnace therein. CONSTITUTION:In a rotary wear tester, a ring-shaped mobile test piece 1 and a ring-shaped fixed test piece 2 are fixed between a rotating shaft 6 having a cooling hole direct connected to a gear 10 driven with DC motor 9 and a stationary shaft 13 having a cooling hole likewise which is provided to detect torque and wear facing the shaft 6 through joint holders 4 and 5 and a ceramic joint 3. To seal the shafts, a sealing package 7 is provided and a vacuum sealed bearing 8 is used between the mobile shaft 6 and the sealing package 7 while a radial thrust bearing 17 is used between the the stationary shaft 13 and the sealing package 7 to prevent possible gas and vacuum leakage. The test piece 1 is turned in a heating furnace 24 provided in the sealing package 7 to detect a friction force in the test piece 2 given a load with a loadcell 19 for torque through a detection lever 20 and a wear displacement is measured with a sensor 21.

9. 发明专利

JPS62251570A MULTIPLE BELLOWS AND MANUFACTURE THEREOF 失效
公开(公告)号：JPS62251570A
公开(公告)日：1987-11-02
申请号：JP9460286
申请日：1986-04-25
申请人： HITACHI LTD
发明人： KAJIWARA RYOICHI , FUNAMOTO TAKAO , KATO MITSUO , SHIDA TOMOHIKO , MATSUZAKA KYO
IPC分类号： F16J3/04 , H01L23/46 , H01L23/473
摘要： PURPOSE:To secure such a multiple structural bellows that is flexible and excellent in anticorrosion, by housing one more set of bellows in the inner part of a set of bellows in addition. CONSTITUTION:In this multiple bellows, such a bellows that has an outer circumferential diameter larger than an inner circumferential diameter of another bellows at the outside is housed in the inner part of a set of bellows. When this bellows is manufactured, sheet rings 2a, 2b, 4a, 4b constituting the specified- form bellows of two types in size are superposed on each plural sheets alternately by two sheets, while joining rings 3 and 5 in the same width as joining allowance are inserted in a part joining both inner and outer circumferences of each bellows alternately, and pressure is added in a direction where these laminated rings 3 and 5 are compressed, whereby they are heated and joined together in a vacuum or inactive gas.

10. 发明专利

JPS62183542A SILICON CARBIDE SYSTEM CERAMIC JUNCTION MEMBER AND MANUFACTURE OF THE SAME 失效
公开(公告)号：JPS62183542A
公开(公告)日：1987-08-11
申请号：JP2382686
申请日：1986-02-07
申请人： HITACHI LTD
发明人： SHIODA KATSUHIKO , OKAMURA HISANOBU , FUKUMAKI TAKASHI , SAKAMOTO MASAHIKO , AKIYAMA HIROSHI , MATSUZAKA KYO , YASUDA TOMIRO
IPC分类号： H01L23/12 , C04B37/00 , C04B37/02 , H01L23/15
摘要： PURPOSE:To obtain a junction with high reliability by a method wherein a metallized layer is constituted by a three-layer structure composed of a mixture layer of chrome silicide and chrome carbide, a chrome layer formed on it and an outer layer made of at least one of nickel and copper and a thermal stress relief material is provided between junction planes of itself and the other ceramics or metal. CONSTITUTION:The junction plane of a silicon carbide system ceramics sintered unit is metallized and soldered with the other ceramics sintered unit or a metal unit to form a junction member. On the junction plane of the silicon carbides system ceramics sintered unit, a mixture layer of chrome silicide and chrome carbide, a chrome layer formed on it and a layer made of at least one of nickel and copper are provided and further a thermal stress relief material is provided between soldered planes of itself and the other ceramic sintered unit or metal unit. With this constitution, as the mixture layer of chrome silicide and chrome carbide functions to combine the silicon carbide system ceramics sintered unit and the chrome layer firmly and, moreover, the mixture layer has sufficient heat resistance which can endure the soldering temperature, the peeling off of the chrome layer can be avoided.

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