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    • 4. 发明专利
    • DATA PROCESSOR
    • JPH0373043A
    • 1991-03-28
    • JP20781289
    • 1989-08-14
    • HITACHI LTDHITACHI MICROCUMPUTER ENG
    • NAKAUCHI NORIOSHIBUKAWA YOSHIMICHI
    • G06F12/14G06F21/02G06F21/24
    • PURPOSE:To protect the secrecy of data in an EPROM by inputting the read signal of an extension prohibiting bit to a mode control circuit, which forms a control signal, and prohibiting the bus extension mode of a single chip microcomputer when write is executed to the bit. CONSTITUTION:A protecting circuit 8 is provided with the extension prohibiting bit for setting whether the bus extension mode is prohibited or not, and a protect bit for setting whether the data in the EPROM are made secret or not. The respective bits constituting this protecting circuit 8 are constituted so that the extension prohibiting bit is selected in a CPU mode and the protect bit can be selected in a program mode when an EPROM 1 is accessed. A signal read out from the protecting circuit 8 is supplied to a mode control circuit 3 as a protect signal Pr and when write is executed to the bit, a port is controlled so that the bus extension mode of the single chip microcomputer can be prohibited. Thus, the secrecy of the data in the built-in EPROM can be effectively protected.
    • 5. 发明专利
    • SEMICONDUCTOR INTEGRATED CIRCUIT
    • JPH04181745A
    • 1992-06-29
    • JP30891390
    • 1990-11-16
    • HITACHI LTDHITACHI MICRO SYSTEM KK
    • MATSUMOTO YASUNOBUSHIBUKAWA YOSHIMICHI
    • H01L21/60
    • PURPOSE:To restrain the size of a semiconductor chip from being made large and to make the electric resistance of a power-supply interconnection inside the chip proper by a method wherein a power-supply pad is formed in the active region of the semiconductor chip. CONSTITUTION:A semiconductor chip 1 is provided with the following: an analog module 9 formed of an analog circuit; and a digital module 10 formed of a digital circuit. Regions in which the modules 9, 10 have been formed are set as active regions; regions other than them are set as inactive regions. The chip is provided with leads 11 to 28 supported by a package or the like and with bonding pads 31 to 48. The bonding pads 31, 32 are formed in the active regions formed in the analog module 9 and the digital module 10, and are used as power-supply pads. Consequently, the length of power-supply interconnections reaching individual functional block cells inside the chip 1 from the power-supply pads is made proper. Thereby, it is possible to restrain the size of the chip from being made large and to make the electric resistance of the power-supply interconnections inside the chip proper.